Reynaldo Corpuz Javier

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,580,723
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,366,947
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stacked attached chips overhan...
- Patent number 9,768,098
- Issue date Sep 19, 2017
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-hermetic semiconductor package
- Patent number 9,721,859
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,576,886
- Issue date Feb 21, 2017
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,373,569
- Issue date Jun 21, 2016
- Texas Instruments Incorporation
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having solderable lead surfaces expo...
- Patent number 9,219,019
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20230377124
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20220092767
- Publication date Mar 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20190295935
- Publication date Sep 26, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20170162489
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES
- Publication number 20170062315
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20160286652
- Publication date Sep 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...
- Publication number 20160233147
- Publication date Aug 11, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...
- Publication number 20160181180
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20160071788
- Publication date Mar 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20160005712
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...
- Publication number 20150262919
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20150262918
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20150262903
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Three Terminal Miniature Package
- Publication number 20150014832
- Publication date Jan 15, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-Grid Array Device Having Chip Assembled on Half-Etched metal L...
- Publication number 20110248392
- Publication date Oct 13, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo C. Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRAT...
- Publication number 20090072373
- Publication date Mar 19, 2009
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits Having Controlled Inductances
- Publication number 20070296056
- Publication date Dec 27, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Anthony L. Coyle
- H01 - BASIC ELECTRIC ELEMENTS

Reynaldo Corpuz Javier

Person

Patents Grantslast 30 patents

Exposed pad integrated circuit package

Exposed pad integrated circuit package

Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

Packaged semiconductor device having stacked attached chips overhan...

Semi-hermetic semiconductor package

Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

Packaged semiconductor devices having solderable lead surfaces expo...

Patents Applicationslast 30 patents

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

Flat No-Lead Packages with Electroplated Edges

Flat No-Lead Packages with Electroplated Edges

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...

PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

Semiconductor Device Having Three Terminal Miniature Package

Ball-Grid Array Device Having Chip Assembled on Half-Etched metal L...

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRAT...

Integrated Circuits Having Controlled Inductances