Ricardo L. YANDOC

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,224,180
- Issue date Feb 11, 2025
- Nexperia B.V.
- Ricardo Yandoc
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaged semiconductor device
- Patent number 12,159,818
- Issue date Dec 3, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 11,973,009
- Issue date Apr 30, 2024
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge semiconductor device
- Patent number 11,942,401
- Issue date Mar 26, 2024
- Nexperia B.V.
- Dilder Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor device and method of manufacture
- Patent number 11,538,795
- Issue date Dec 27, 2022
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor
- Patent number 11,538,744
- Issue date Dec 27, 2022
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor device and method of manufacture
- Patent number 11,227,819
- Issue date Jan 18, 2022
- Nexperia B.V.
- Robert James Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 10,957,632
- Issue date Mar 23, 2021
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe assembly for a semiconductor device
- Patent number 10,714,413
- Issue date Jul 14, 2020
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power apparatus
- Patent number 10,665,532
- Issue date May 26, 2020
- Nexperia B.V.
- Mark A. Gajda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20240258207
- Publication date Aug 1, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230223320
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SUCH SEMICONDUCT...
- Publication number 20230163053
- Publication date May 25, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...
- Publication number 20230154883
- Publication date May 18, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE FOR A CASCODE SEMICONDUCTOR DEVICE
- Publication number 20230123782
- Publication date Apr 20, 2023
- NEXPERIA B.V.
- Ricardo YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCT...
- Publication number 20230025949
- Publication date Jan 26, 2023
- NEXPERIA B.V.
- Matthew Lloyd Anthony
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCT...
- Publication number 20230028579
- Publication date Jan 26, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
- Publication number 20230005846
- Publication date Jan 5, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HALF-BRIDGE CIRCUIT
- Publication number 20220293525
- Publication date Sep 15, 2022
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20220262712
- Publication date Aug 18, 2022
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20220230942
- Publication date Jul 21, 2022
- NEXPERIA B.V.
- Ricardo YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20220139724
- Publication date May 5, 2022
- NEXPERIA B.V.
- Ricardo Yandoc
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
- Publication number 20210343627
- Publication date Nov 4, 2021
- NEXPERIA B.V.
- Ricardo YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210296218
- Publication date Sep 23, 2021
- NEXPERIA B.V.
- Ricardo YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Half-Bridge Semiconductor Device
- Publication number 20210111107
- Publication date Apr 15, 2021
- NEXPERIA B.V.
- Dilder Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20210005538
- Publication date Jan 7, 2021
- NEXPERIA B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200365565
- Publication date Nov 19, 2020
- NEXPERIA B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cascode Semiconductor Device and Method of Manufacture
- Publication number 20200243426
- Publication date Jul 30, 2020
- NEXPERIA B.V.
- Robert James MONTGOMERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20200194354
- Publication date Jun 18, 2020
- NEXPERIA B.V.
- Ricardo Lagmay YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame Assembly for a Semiconductor Device
- Publication number 20190393137
- Publication date Dec 26, 2019
- NEXPERIA B.V.
- Ricardo Lagmay YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20190189544
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Ricardo Lagmay YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER APPARATUS
- Publication number 20180286792
- Publication date Oct 4, 2018
- NEXPERIA B.V.
- Mark A. GAJDA
- H01 - BASIC ELECTRIC ELEMENTS

Ricardo L. YANDOC

Person

Patents Grantslast 30 patents

Semiconductor device and a method of manufacture

Method of manufacture for a cascode semiconductor device

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device and a method of manufacturing a semiconductor...

Multi-chip packaged semiconductor device

Lead frame assembly for a semiconductor device

Half-bridge semiconductor device

Cascode semiconductor device and method of manufacture

Cascode semiconductor

Cascode semiconductor device and method of manufacture

Lead frame assembly for a semiconductor device

Leadframe assembly for a semiconductor device

Power apparatus

Patents Applicationslast 30 patents

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SUCH SEMICONDUCT...

SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...

METHOD OF MANUFACTURE FOR A CASCODE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCT...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCT...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

PACKAGED HALF-BRIDGE CIRCUIT

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

PACKAGED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Half-Bridge Semiconductor Device

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Cascode Semiconductor Device and Method of Manufacture

LEADFRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

Lead Frame Assembly for a Semiconductor Device

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

POWER APPARATUS