Richard C. Blish II

Person

Saratogo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Soft error resistant circuitry
- Patent number 8,946,663
- Issue date Feb 3, 2015
- Spansion LLC
- Richard C. Blish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper interconnects with improved electromigration lifetime
- Patent number 8,723,321
- Issue date May 13, 2014
- GLOBALFOUNDIES Inc.
- Christy Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material and semiconductor component including th...
- Patent number 8,384,210
- Issue date Feb 26, 2013
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-assisted etch with oxygen
- Patent number 6,806,198
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for suppressing packaged semiconductor chip curvature whi...
- Patent number 6,803,653
- Issue date Oct 12, 2004
- Advanced Micro Devices, Inc.
- Robert E. Likins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for removing conductive lines during deprocessing
- Patent number 6,768,198
- Issue date Jul 27, 2004
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus to achieve bond pad crater sensing and steppin...
- Patent number 6,548,881
- Issue date Apr 15, 2003
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for metal stack thermal management in semiconductor devices
- Patent number 6,518,661
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to improve chip scale package electrostatic discharge perfor...
- Patent number 6,495,393
- Issue date Dec 17, 2002
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for achieving synchronous non-destructive latchup characteri...
- Patent number 6,483,337
- Issue date Nov 19, 2002
- Advanced Micro Devices Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for measuring effects of packaging stresses of...
- Patent number 6,461,879
- Issue date Oct 8, 2002
- Advanced Micro Devices Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for improving image depth resolution in a magnetic field...
- Patent number 6,429,657
- Issue date Aug 6, 2002
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for achieving bond pad crater sensing and ESD...
- Patent number 6,395,568
- Issue date May 28, 2002
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing IC package delamination by use of internal baffles
- Patent number 6,373,126
- Issue date Apr 16, 2002
- Advanced Micro Devices, Inc.
- Pramod Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seal ring for copper damascene process and method for fabricat...
- Patent number 6,362,524
- Issue date Mar 26, 2002
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for determining the robustness of memory cells...
- Patent number 6,348,356
- Issue date Feb 19, 2002
- Advanced Micro Devices, Inc.
- Sunil Narayan Shabde
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for marking semiconductor device using a green laser
- Patent number 6,339,728
- Issue date Jan 15, 2002
- Advanced Micro Devices, Inc.
- Quang D. Nguyen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method to improve chip scale package electrostatic discharge perfor...
- Patent number 6,331,735
- Issue date Dec 18, 2001
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for selectively disconnecting a redundant power d...
- Patent number 6,320,400
- Issue date Nov 20, 2001
- Advanced Micro Devices, Inc.
- J. Courtney Black
- G01 - MEASURING TESTING
Information Patent Grant
Encapsulation method using non-homogeneous molding compound pellets
- Patent number 6,315,936
- Issue date Nov 13, 2001
- Advanced Micro Devices, Inc.
- J. Courtney Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for detecting faults utilizing an AC power supply
- Patent number 6,294,923
- Issue date Sep 25, 2001
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for determining the location of an open circuit i...
- Patent number 6,285,181
- Issue date Sep 4, 2001
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Flip chip packages
- Patent number 6,274,473
- Issue date Aug 14, 2001
- Advanced Micro Devices, Inc.
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate removal from a semiconductor chip structure having buried...
- Patent number 6,252,239
- Issue date Jun 26, 2001
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining the robustness of memory cells...
- Patent number 6,204,516
- Issue date Mar 20, 2001
- Advanced Micro Devices, Inc.
- Sunil Narayan Shabde
- G11 - INFORMATION STORAGE
Information Patent Grant
System for marking electrophoretic dies while reducing damage due t...
- Patent number 6,181,017
- Issue date Jan 30, 2001
- Advanced Micro Devices, Inc.
- Colin Hatchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure water stream to separate a multi-layer integrated cir...
- Patent number 6,119,325
- Issue date Sep 19, 2000
- Advanced Micro Devices, Inc.
- J. Courtney Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve internal package delamination and wire bond relia...
- Patent number 6,091,157
- Issue date Jul 18, 2000
- Advanced Micro Devices, Inc.
- J. Courtney Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal carrying means including a carrier substrate and wire bonds...
- Patent number 6,049,465
- Issue date Apr 11, 2000
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrophoretic coating methodology to improve internal package del...
- Patent number 6,046,507
- Issue date Apr 4, 2000
- Advanced Micro Devices
- Colin D. Hatchard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOFT ERROR RESISTANT CIRCUITRY
- Publication number 20130306885
- Publication date Nov 21, 2013
- SPANSION LLC
- Richard C. Blish
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
RADIATION-DETECTING STRUCTURES
- Publication number 20100155611
- Publication date Jun 24, 2010
- SPANSION LLC
- Clayton Fullwood
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING VIAS IN A SEMICONDUCTOR DEVICE
- Publication number 20080182407
- Publication date Jul 31, 2008
- Advanced Micro Devices, Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for memory devices
- Publication number 20080175054
- Publication date Jul 24, 2008
- Spansion LLC
- Bryan William Hancock
- G11 - INFORMATION STORAGE
Information Patent Application
Method and semiconductor structure for reliability characterization
- Publication number 20080102637
- Publication date May 1, 2008
- Advanced Micro Devices, Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnects with improved electromigration lifetime
- Publication number 20070284748
- Publication date Dec 13, 2007
- Advanced Micro Devices, Inc.
- Christy Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve chip scale package electrostatic discharge perfor...
- Publication number 20010039073
- Publication date Nov 8, 2001
- Richard C. Blish
- H01 - BASIC ELECTRIC ELEMENTS

Richard C. Blish II

Person

Patents Grantslast 30 patents

Soft error resistant circuitry

Copper interconnects with improved electromigration lifetime

Thermal interface material and semiconductor component including th...

Gas-assisted etch with oxygen

Apparatus for suppressing packaged semiconductor chip curvature whi...

Method and system for removing conductive lines during deprocessing

Method and apparatus to achieve bond pad crater sensing and steppin...

Apparatus for metal stack thermal management in semiconductor devices

Method to improve chip scale package electrostatic discharge perfor...

Method for achieving synchronous non-destructive latchup characteri...

Method and apparatus for measuring effects of packaging stresses of...

Apparatus for improving image depth resolution in a magnetic field...

Method and apparatus for achieving bond pad crater sensing and ESD...

Method for reducing IC package delamination by use of internal baffles

Edge seal ring for copper damascene process and method for fabricat...

Method and apparatus for determining the robustness of memory cells...

Method for marking semiconductor device using a green laser

Method to improve chip scale package electrostatic discharge perfor...

Method and system for selectively disconnecting a redundant power d...

Encapsulation method using non-homogeneous molding compound pellets

Method and system for detecting faults utilizing an AC power supply

Method and system for determining the location of an open circuit i...

Flip chip packages

Substrate removal from a semiconductor chip structure having buried...

Method and apparatus for determining the robustness of memory cells...

System for marking electrophoretic dies while reducing damage due t...

High pressure water stream to separate a multi-layer integrated cir...

Method to improve internal package delamination and wire bond relia...

Signal carrying means including a carrier substrate and wire bonds...

Electrophoretic coating methodology to improve internal package del...

Patents Applicationslast 30 patents

SOFT ERROR RESISTANT CIRCUITRY

RADIATION-DETECTING STRUCTURES

METHOD OF FORMING VIAS IN A SEMICONDUCTOR DEVICE

Methods and systems for memory devices

Method and semiconductor structure for reliability characterization

Copper interconnects with improved electromigration lifetime

Method to improve chip scale package electrostatic discharge perfor...