Richard E. Schenker

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 12,218,052
- Issue date Feb 4, 2025
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning with colored blocking and structures result...
- Patent number 12,154,855
- Issue date Nov 26, 2024
- Intel Corporation
- Mohit K. Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colored gratings in microelectronic structures
- Patent number 12,087,594
- Issue date Sep 10, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide layers to inhi...
- Patent number 12,080,639
- Issue date Sep 3, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contacts for semiconductor devices
- Patent number 12,080,605
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly structures and techniques
- Patent number 12,012,473
- Issue date Jun 18, 2024
- Intel Corporation
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked forksheet transistors
- Patent number 11,996,411
- Issue date May 28, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,990,403
- Issue date May 21, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
1D vertical edge blocking (VEB) via and plug
- Patent number 11,972,979
- Issue date Apr 30, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive plug and tab patterning with photobuckets for back end...
- Patent number 11,854,882
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having a portion without a liner material and related...
- Patent number 11,837,542
- Issue date Dec 5, 2023
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 11,764,263
- Issue date Sep 19, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
1D vertical edge blocking (VEB) via and plug
- Patent number 11,721,580
- Issue date Aug 8, 2023
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap enabled by a single damascene process
- Patent number 11,610,810
- Issue date Mar 21, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and layout design options for DSA on transition regions o...
- Patent number 11,605,623
- Issue date Mar 14, 2023
- Intel Corporation
- Gurpreet Singh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Non-planar transistors with channel regions having varying widths
- Patent number 11,569,231
- Issue date Jan 31, 2023
- Intel Corporation
- Stephen D Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mask lithography line end enhancement
- Patent number 11,462,469
- Issue date Oct 4, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contacts for semiconductor devices
- Patent number 11,437,283
- Issue date Sep 6, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned local interconnects
- Patent number 11,424,160
- Issue date Aug 23, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene plug and tab patterning with photobuckets
- Patent number 11,373,900
- Issue date Jun 28, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV phase-shift SRAF masks by means of embedded phase shift layers
- Patent number 11,300,885
- Issue date Apr 12, 2022
- Intel Corporation
- Robert Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnects having a portion without a liner material and related...
- Patent number 11,264,325
- Issue date Mar 1, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivating silicide-based approaches for conductive via fabricatio...
- Patent number 11,239,112
- Issue date Feb 1, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,011,463
- Issue date May 18, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20250125260
- Publication date Apr 17, 2025
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT
- Publication number 20250072069
- Publication date Feb 27, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...
- Publication number 20250046713
- Publication date Feb 6, 2025
- Intel Corporation
- Mohit K. HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20240371700
- Publication date Nov 7, 2024
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...
- Publication number 20240243052
- Publication date Jul 18, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORKSHEET TRANSISTORS
- Publication number 20240234422
- Publication date Jul 11, 2024
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20240213095
- Publication date Jun 27, 2024
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS
- Publication number 20240213250
- Publication date Jun 27, 2024
- Intel Corporation
- Shao Ming KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...
- Publication number 20240203868
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SOURCE OR DRAIN CONTACT FLYOVER
- Publication number 20240113177
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
- Publication number 20240096785
- Publication date Mar 21, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-DECKED INTERCONNECT FEATURES
- Publication number 20240071913
- Publication date Feb 29, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI...
- Publication number 20240063210
- Publication date Feb 22, 2024
- Intel Corporation
- Nischal ARKALI RADHAKRISHNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
- Publication number 20240038661
- Publication date Feb 1, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CH...
- Publication number 20230369399
- Publication date Nov 16, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG
- Publication number 20230326794
- Publication date Oct 12, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ROUTING THAT OVERLAPS NMOS AND PMOS REGIONS OF A TRANSISTOR
- Publication number 20230317602
- Publication date Oct 5, 2023
- Intel Corporation
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD CELL ARCHITECTURE WITHOUT POWER DELIVERY SPACE ALLOCATION
- Publication number 20230207551
- Publication date Jun 29, 2023
- Sukru YEMENICIOGLU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20220352032
- Publication date Nov 3, 2022
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORED GRATINGS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199420
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
- Publication number 20220148967
- Publication date May 12, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...
- Publication number 20220102210
- Publication date Mar 31, 2022
- Intel Corporation
- Paul A. NYHUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORKSHEET TRANSISTORS
- Publication number 20210407999
- Publication date Dec 30, 2021
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR...
- Publication number 20210407895
- Publication date Dec 30, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
- Publication number 20210375745
- Publication date Dec 2, 2021
- Intel Corporation, Santa Clara, CA
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...
- Publication number 20210225698
- Publication date Jul 22, 2021
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS

Richard E. Schenker

Person

Patents Grantslast 30 patents

Contact over active gate structures using directed self-assembly fo...

Advanced lithography and self-assembled devices

Self-aligned patterning with colored blocking and structures result...

Contact over active gate structures with metal oxide-caped contacts...

Colored gratings in microelectronic structures

Contact over active gate structures with metal oxide layers to inhi...

Backside contacts for semiconductor devices

Directed self-assembly structures and techniques

Stacked forksheet transistors

Dielectric helmet-based approaches for back end of line (BEOL) inte...

1D vertical edge blocking (VEB) via and plug

Vertically spaced intra-level interconnect line metallization for i...

Advanced lithography and self-assembled devices

Subtractive plug and tab patterning with photobuckets for back end...

Interconnects having a portion without a liner material and related...

Contact over active gate structures with metal oxide-caped contacts...

Gate-all-around integrated circuit structures having depopulated ch...

1D vertical edge blocking (VEB) via and plug

Maskless air gap enabled by a single damascene process

Materials and layout design options for DSA on transition regions o...

Non-planar transistors with channel regions having varying widths

Single mask lithography line end enhancement

Backside contacts for semiconductor devices

Self-aligned local interconnects

Damascene plug and tab patterning with photobuckets

Advanced lithography and self-assembled devices

EUV phase-shift SRAF masks by means of embedded phase shift layers

Interconnects having a portion without a liner material and related...

Passivating silicide-based approaches for conductive via fabricatio...

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Patents Applicationslast 30 patents

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT

SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...

STACKED FORKSHEET TRANSISTORS

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS

SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...

STACKED SOURCE OR DRAIN CONTACT FLYOVER

INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER

DOUBLE-DECKED INTERCONNECT FEATURES

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI...

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CH...

1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG

METAL ROUTING THAT OVERLAPS NMOS AND PMOS REGIONS OF A TRANSISTOR

STANDARD CELL ARCHITECTURE WITHOUT POWER DELIVERY SPACE ALLOCATION

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

COLORED GRATINGS IN MICROELECTRONIC STRUCTURES

INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...

CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...

STACKED FORKSHEET TRANSISTORS

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR...

DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...