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Richard J. Harries
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic package that includes lamination layer
Patent number
10,985,080
Issue date
Apr 20, 2021
Intel Corporation
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses and methods to enhance passivation and ILD reliability
Patent number
10,002,814
Issue date
Jun 19, 2018
Intel Corporation
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal expansion compensators for controlling microelectronic pack...
Patent number
9,793,225
Issue date
Oct 17, 2017
Intel Corporation
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal expansion compensators for controlling microelectronic pack...
Patent number
9,414,484
Issue date
Aug 9, 2016
Intel Corporation
Pramod Malatkar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
9,136,239
Issue date
Sep 15, 2015
Micron Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Using collapse limiter structures between elements to reduce solder...
Patent number
8,941,236
Issue date
Jan 27, 2015
Intel Corporation
Ameya Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses and methods to enhance passivation and ILD reliability
Patent number
8,664,771
Issue date
Mar 4, 2014
Intel Corporation
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
8,642,462
Issue date
Feb 4, 2014
Micorn Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Apparatuses and methods to enhance passivation and ILD reliability
Patent number
8,198,185
Issue date
Jun 12, 2012
Intel Corporation
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded capacitors for reducing package cracking
Patent number
7,719,109
Issue date
May 18, 2010
Intel Corporation
Mitul Modi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compliant structure for an electronic device, method of manufacturi...
Patent number
7,692,307
Issue date
Apr 6, 2010
Intel Corporation
Sudarshan Rangaraj
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mold compound cap in a flip chip multi-matrix array package and pro...
Patent number
7,514,300
Issue date
Apr 7, 2009
Intel Corporation
Vassoudevane Lebonheur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
7,387,827
Issue date
Jun 17, 2008
Intel Corporation
Terry Lee Sterrett
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Mold compound cap in a flip chip multi-matrix array package and pro...
Patent number
7,294,533
Issue date
Nov 13, 2007
Intel Corporation
Vassou Lebonheur
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
Publication number
20180350709
Publication date
Dec 6, 2018
Intel Corporation
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACK...
Publication number
20160322311
Publication date
Nov 3, 2016
Intel Corporation
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND...
Publication number
20140203430
Publication date
Jul 24, 2014
Micron Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
Publication number
20140175643
Publication date
Jun 26, 2014
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
USING COLLAPSE LIMITER STRUCTURES BETWEEN ELEMENTS TO REDUCE SOLDER...
Publication number
20140091456
Publication date
Apr 3, 2014
Ameya LIMAYE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACK...
Publication number
20130271929
Publication date
Oct 17, 2013
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
Publication number
20120241952
Publication date
Sep 27, 2012
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
First-level interconnects with slender columns, and processes of fo...
Publication number
20110122592
Publication date
May 26, 2011
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
Publication number
20090325347
Publication date
Dec 31, 2009
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF
Publication number
20090065931
Publication date
Mar 12, 2009
Intel Corporation
Sudarshan V. Rangaraj
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND...
Publication number
20080254611
Publication date
Oct 16, 2008
Intel Corporation (a Delaware corporation)
TERRY LEE STERRETT
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Compliant structure for an electronic device, method of manufacturi...
Publication number
20080137318
Publication date
Jun 12, 2008
Sudarshan Rangaraj
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Embedded capacitors for reducing package cracking
Publication number
20080096310
Publication date
Apr 24, 2008
Mitul Modi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Mold compound cap in a flip chip multi-matrix array package and pro...
Publication number
20080032459
Publication date
Feb 7, 2008
Vassoudevane Lebonheur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic assembly having a periphery seal around a thermal i...
Publication number
20080001282
Publication date
Jan 3, 2008
Mitul Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatuses and methods to enhance passivation and ILD reliability
Publication number
20070238222
Publication date
Oct 11, 2007
Richard J. Harries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mold compound cap in a flip chip multi-matrix array package and pro...
Publication number
20040262776
Publication date
Dec 30, 2004
Intel Corporation
Vassoudevane Lebonheur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection designs and materials having improved strength and...
Publication number
20040115409
Publication date
Jun 17, 2004
Intel Corporation
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL