Richard Joseph Saia

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tapered gate electrode for semiconductor devices
- Patent number 10,903,330
- Issue date Jan 26, 2021
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress resistant micro-via structure for flexible circuits
- Patent number 10,276,486
- Issue date Apr 30, 2019
- General Electric Company
- Thomas Bert Gorczyca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with junction termination extension
- Patent number 9,406,762
- Issue date Aug 2, 2016
- General Electric Company
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach adhesive to facilitate embedded chip build up and relat...
- Patent number 8,604,612
- Issue date Dec 10, 2013
- General Electric Company
- Richard Joseph Saia
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect structure
- Patent number 8,498,131
- Issue date Jul 30, 2013
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing pitch in an integrated circuit
- Patent number 8,008,781
- Issue date Aug 30, 2011
- General Electric Company
- Raymond Albert Fillion
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic chip package with reduced contact pad pitch
- Patent number 7,964,974
- Issue date Jun 21, 2011
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a wafer scale package
- Patent number 7,952,187
- Issue date May 31, 2011
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making an ignition device
- Patent number 7,785,482
- Issue date Aug 31, 2010
- General Electric Company
- Kanakasabapathi Subramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method of forming a low profile conformal shield
- Patent number 7,752,751
- Issue date Jul 13, 2010
- General Electric Company
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques for fabricating a resistor on a flexible base material
- Patent number 7,158,383
- Issue date Jan 2, 2007
- General Electric Company
- Kevin M. Durocher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Large organic devices and methods of fabricating large organic devices
- Patent number 7,011,983
- Issue date Mar 14, 2006
- General Electric Company
- Donald F. Foust
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of processing high-resolution flex circuits with low distortion
- Patent number 6,994,897
- Issue date Feb 7, 2006
- General Electric Company
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezoelectric microvalve
- Patent number 6,988,706
- Issue date Jan 24, 2006
- General Electric Company
- Charles Erklin Seeley
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Optoelectronic package and fabrication method
- Patent number 6,935,792
- Issue date Aug 30, 2005
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic dry etching technique for deep bulk silicon etching
- Patent number 6,790,779
- Issue date Sep 14, 2004
- Lockheed Martin Corporation
- James H. Schermerhorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for aligning die to interconnect metal on flex substrate
- Patent number 6,790,703
- Issue date Sep 14, 2004
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system device packaging method
- Patent number 6,773,962
- Issue date Aug 10, 2004
- General Electric Company
- Richard Joseph Saia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system device packaging method
- Patent number 6,767,764
- Issue date Jul 27, 2004
- General Electric Company
- Richard Joseph Saia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Plastic packaging of LED arrays
- Patent number 6,733,711
- Issue date May 11, 2004
- General Electric Company
- Kevin Matthew Durocher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaging of LED arrays
- Patent number 6,730,533
- Issue date May 4, 2004
- General Electric Company
- Kevin Matthew Durocher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for fabricating a resistor on a flexible base material
- Patent number 6,709,944
- Issue date Mar 23, 2004
- General Electric Company
- Kevin M. Durocher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Plastic packaging of LED arrays
- Patent number 6,614,103
- Issue date Sep 2, 2003
- General Electric Company
- Kevin Matthew Durocher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous hydrogenated carbon hermetic structure fabrication method
- Patent number 6,548,329
- Issue date Apr 15, 2003
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting device and method for mounting
- Patent number 6,515,417
- Issue date Feb 4, 2003
- General Electric Company
- Anil Raj Duggal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning die to interconnect metal on flex substrate
- Patent number 6,475,877
- Issue date Nov 5, 2002
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect multichip module stack and fabrication me...
- Patent number 6,429,381
- Issue date Aug 6, 2002
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a flexible interconnect film with resistor a...
- Patent number 6,323,096
- Issue date Nov 27, 2001
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous hydrogenated carbon hermetic structure and fabrication me...
- Patent number 6,150,719
- Issue date Nov 21, 2000
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for molding optical disks
- Patent number 6,146,558
- Issue date Nov 14, 2000
- General Electric Company
- Thomas Paul Feist
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH JUNCTION TERMINATION EXTENSION
- Publication number 20160307997
- Publication date Oct 20, 2016
- GENERAL ELECTRIC COMPANY
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED GATE ELECTRODE FOR SEMICONDUCTOR DEVICES
- Publication number 20150144960
- Publication date May 28, 2015
- GENERAL ELECTRIC COMPANY
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH JUNCTION TERMINATION EXTENSION
- Publication number 20150115284
- Publication date Apr 30, 2015
- GENERAL ELECTRIC COMPANY
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure
- Publication number 20110299821
- Publication date Dec 8, 2011
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS
- Publication number 20110215480
- Publication date Sep 8, 2011
- Thomas Bert Gorczyca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH ADHESIVE TO FACILITATE EMBEDDED CHIP BUILD UP AND RELAT...
- Publication number 20100207261
- Publication date Aug 19, 2010
- GENERAL ELECTRIC COMPANY
- Richard Joseph Saia
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT
- Publication number 20100132994
- Publication date Jun 3, 2010
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT
- Publication number 20100133705
- Publication date Jun 3, 2010
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD
- Publication number 20090242263
- Publication date Oct 1, 2009
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE
- Publication number 20090243081
- Publication date Oct 1, 2009
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20090028491
- Publication date Jan 29, 2009
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ignition device for a gas appliance and method of operation
- Publication number 20070128563
- Publication date Jun 7, 2007
- Kanakasabapathi Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an ignition device
- Publication number 20070125745
- Publication date Jun 7, 2007
- Kanakasabapathi Subramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method of processing a semiconductor subst...
- Publication number 20070015373
- Publication date Jan 18, 2007
- General Electric Company
- Christopher Steven Cowen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control valve assembly for controlling gas flow in gas combustion s...
- Publication number 20060057520
- Publication date Mar 16, 2006
- Richard Joseph Saia
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
Piezoelectric microvalve
- Publication number 20050133751
- Publication date Jun 23, 2005
- General Electric Company
- Charles Erklin Seeley
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
Large organic devices and methods of fabricating large organic devices
- Publication number 20040121508
- Publication date Jun 24, 2004
- Donald F. Foust
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Techniques for fabricating a resistor on a flexible base material
- Publication number 20040114336
- Publication date Jun 17, 2004
- Kevin M. Durocher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of processing high-resolution flex circuits with low distortion
- Publication number 20040094329
- Publication date May 20, 2004
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic package and fabrication method
- Publication number 20040076382
- Publication date Apr 22, 2004
- General Electric Company
- Richard Joseph Saia
- G02 - OPTICS
Information Patent Application
TECHNIQUES FOR FABRICATING A RESISTOR ON A FLEXIBLE BASE MATERIAL
- Publication number 20040063294
- Publication date Apr 1, 2004
- Kevin M. Durocher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ANISOTROPIC DRY ETCHING TECHNIQUE FOR DEEP BULK SILICON ETCHING
- Publication number 20040018734
- Publication date Jan 29, 2004
- Lockheed Martin Corporation
- James H. Schermerhorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Plastic packaging of LED arrays
- Publication number 20030160256
- Publication date Aug 28, 2003
- General Electric Company
- Kevin Matthew Durocher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic packaging of LED arrays
- Publication number 20030153108
- Publication date Aug 14, 2003
- General Electric Company
- Kevin Matthew Durocher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, method and product therefrom, for aligning die to interc...
- Publication number 20020197767
- Publication date Dec 26, 2002
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical system device package and packaging method
- Publication number 20020173080
- Publication date Nov 21, 2002
- Richard Joseph Saia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectromechanical system device package and packaging method
- Publication number 20020132391
- Publication date Sep 19, 2002
- Richard Joseph Saia
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Richard Joseph Saia

Person

Patents Grantslast 30 patents

Tapered gate electrode for semiconductor devices

Stress resistant micro-via structure for flexible circuits

Semiconductor device with junction termination extension

Chip attach adhesive to facilitate embedded chip build up and relat...

Interconnect structure

Apparatus and method for reducing pitch in an integrated circuit

Electronic chip package with reduced contact pad pitch

System and method of forming a wafer scale package

Method of making an ignition device

System and method of forming a low profile conformal shield

Techniques for fabricating a resistor on a flexible base material

Large organic devices and methods of fabricating large organic devices

Method of processing high-resolution flex circuits with low distortion

Piezoelectric microvalve

Optoelectronic package and fabrication method

Anisotropic dry etching technique for deep bulk silicon etching

Apparatus for aligning die to interconnect metal on flex substrate

Microelectromechanical system device packaging method

Microelectromechanical system device packaging method

Plastic packaging of LED arrays

Plastic packaging of LED arrays

Techniques for fabricating a resistor on a flexible base material

Plastic packaging of LED arrays

Amorphous hydrogenated carbon hermetic structure fabrication method

Organic light emitting device and method for mounting

Method for aligning die to interconnect metal on flex substrate

High density interconnect multichip module stack and fabrication me...

Method for fabricating a flexible interconnect film with resistor a...

Amorphous hydrogenated carbon hermetic structure and fabrication me...

Structure and method for molding optical disks

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH JUNCTION TERMINATION EXTENSION

TAPERED GATE ELECTRODE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH JUNCTION TERMINATION EXTENSION

Interconnect structure

STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS

CHIP ATTACH ADHESIVE TO FACILITATE EMBEDDED CHIP BUILD UP AND RELAT...

APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT

APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT

SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD

SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE

INTERCONNECT STRUCTURE

Ignition device for a gas appliance and method of operation

Method of making an ignition device

Semiconductor device and method of processing a semiconductor subst...

Control valve assembly for controlling gas flow in gas combustion s...

Piezoelectric microvalve

Large organic devices and methods of fabricating large organic devices

Techniques for fabricating a resistor on a flexible base material

Method of processing high-resolution flex circuits with low distortion

Optoelectronic package and fabrication method

TECHNIQUES FOR FABRICATING A RESISTOR ON A FLEXIBLE BASE MATERIAL

ANISOTROPIC DRY ETCHING TECHNIQUE FOR DEEP BULK SILICON ETCHING

Plastic packaging of LED arrays

Plastic packaging of LED arrays

Apparatus, method and product therefrom, for aligning die to interc...

Microelectromechanical system device package and packaging method

Microelectromechanical system device package and packaging method