Richard K. Spielberger

Person

Hannover, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged die heater
- Patent number 7,965,094
- Issue date Jun 21, 2011
- Honeywell International Inc.
- Richard Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for stacking integrated circuits
- Patent number 7,863,720
- Issue date Jan 4, 2011
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for sealing a MEMS device
- Patent number 7,736,946
- Issue date Jun 15, 2010
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package with top-side conduction cooling
- Patent number 7,635,916
- Issue date Dec 22, 2009
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding arrangement to protect a circuit from stray magnetic fields
- Patent number 7,569,915
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
Shielding arrangement to protect a circuit from stray magnetic fields
- Patent number 7,078,243
- Issue date Jul 18, 2006
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
Methods for providing a magnetic shield for an integrated circuit h...
- Patent number 6,916,668
- Issue date Jul 12, 2005
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
Stacked ball grid array
- Patent number 6,657,134
- Issue date Dec 2, 2003
- Honeywell International Inc.
- Richard K. Spielberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package lid for dose enhancement protection
- Patent number 6,611,054
- Issue date Aug 26, 2003
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding arrangement to protect a circuit from stray magnetic fields
- Patent number 6,515,352
- Issue date Feb 4, 2003
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
Three axis sensor package on flexible substrate
- Patent number 6,169,254
- Issue date Jan 2, 2001
- Honeywell, Inc.
- Bharat B. Pant
- G01 - MEASURING TESTING
Information Patent Grant
Method to permit high temperature assembly processes for magnetical...
- Patent number 6,027,948
- Issue date Feb 22, 2000
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stacking and capacitor mounting arrangement including spacers
- Patent number 6,005,778
- Issue date Dec 21, 1999
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation enhanced chip encapsulant
- Patent number 5,998,867
- Issue date Dec 7, 1999
- Honeywell Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package for magnetic devices
- Patent number 5,939,772
- Issue date Aug 17, 1999
- Honeywell Inc.
- Allan T. Hurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test and tear-away bond pad design
- Patent number 5,891,745
- Issue date Apr 6, 1999
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge for chip area connection
- Patent number 5,719,748
- Issue date Feb 17, 1998
- Honeywell Inc.
- Deborah A. Cullinan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature magnetometer and flexible circuit
- Patent number 5,644,230
- Issue date Jul 1, 1997
- Honeywell Inc.
- Bharat B. Pant
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with weldable ceramic lid
- Patent number 5,498,900
- Issue date Mar 12, 1996
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package to semiconductor chip active interconnect site method
- Patent number 5,161,729
- Issue date Nov 10, 1992
- Honeywell Inc.
- Thomas J. Dunaway
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a surface etched shadow mask
- Patent number 5,139,610
- Issue date Aug 18, 1992
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct microcircuit decoupling
- Patent number 5,140,496
- Issue date Aug 18, 1992
- Honeywell, Inc.
- Michael W. Heinks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable drop-through die bond frame
- Patent number 5,101,550
- Issue date Apr 7, 1992
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked tab leadframe assembly
- Patent number 5,099,306
- Issue date Mar 24, 1992
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of die bonding semiconductor chip by using removable frame
- Patent number 5,074,036
- Issue date Dec 24, 1991
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a leadframe having conductive elements pref...
- Patent number 5,066,614
- Issue date Nov 19, 1991
- Honeywell Inc.
- Thomas J. Dunaway
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal semiconductor chip package
- Patent number 5,066,831
- Issue date Nov 19, 1991
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radial solution to chip carrier pitch deviation
- Patent number 5,061,822
- Issue date Oct 29, 1991
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package capacitor cover
- Patent number 5,043,533
- Issue date Aug 27, 1991
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor chip package
- Patent number 5,036,163
- Issue date Jul 30, 1991
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaged Die Heater
- Publication number 20100007367
- Publication date Jan 14, 2010
- Honeywell International Inc.
- Richard Spielberger
- G01 - MEASURING TESTING
Information Patent Application
Integrated Circuit Package With Top-Side Conduction Cooling
- Publication number 20080272482
- Publication date Nov 6, 2008
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20080188035
- Publication date Aug 7, 2008
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Shielding arrangement to protect a circuit from stray magnetic fields
- Publication number 20060237823
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Application
Method and system for stacking integrated circuits
- Publication number 20050258528
- Publication date Nov 24, 2005
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding arrangement to protect a circuit from stray magnetic fields
- Publication number 20050130327
- Publication date Jun 16, 2005
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING
Information Patent Application
Ball grid array package
- Publication number 20030102156
- Publication date Jun 5, 2003
- Richard K. Spielberger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Shielding arrangement to protect a circuit from stray magnetic fields
- Publication number 20030098469
- Publication date May 29, 2003
- Micron Technology, Inc.
- Richard K. Spielberger
- G01 - MEASURING TESTING

Richard K. Spielberger

Person

Patents Grantslast 30 patents

Packaged die heater

Method and system for stacking integrated circuits

System and method for sealing a MEMS device

Integrated circuit package with top-side conduction cooling

Shielding arrangement to protect a circuit from stray magnetic fields

Shielding arrangement to protect a circuit from stray magnetic fields

Methods for providing a magnetic shield for an integrated circuit h...

Stacked ball grid array

IC package lid for dose enhancement protection

Shielding arrangement to protect a circuit from stray magnetic fields

Three axis sensor package on flexible substrate

Method to permit high temperature assembly processes for magnetical...

Chip stacking and capacitor mounting arrangement including spacers

Radiation enhanced chip encapsulant

Shielded package for magnetic devices

Test and tear-away bond pad design

Semiconductor package with a bridge for chip area connection

Miniature magnetometer and flexible circuit

Semiconductor package with weldable ceramic lid

Package to semiconductor chip active interconnect site method

Method of making a surface etched shadow mask

Direct microcircuit decoupling

Removable drop-through die bond frame

Stacked tab leadframe assembly

Method of die bonding semiconductor chip by using removable frame

Method of manufacturing a leadframe having conductive elements pref...

Universal semiconductor chip package

Radial solution to chip carrier pitch deviation

Chip package capacitor cover

Universal semiconductor chip package

Patents Applicationslast 30 patents

Packaged Die Heater

Integrated Circuit Package With Top-Side Conduction Cooling

SYSTEM AND METHOD FOR SEALING A MEMS DEVICE

Shielding arrangement to protect a circuit from stray magnetic fields

Method and system for stacking integrated circuits

Shielding arrangement to protect a circuit from stray magnetic fields

Ball grid array package

Shielding arrangement to protect a circuit from stray magnetic fields