Richard Korneisel

Person

Cedar Rapids, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Custom photolithography masking via precision dispense process
- Patent number 11,626,286
- Issue date Apr 11, 2023
- Rockwell Collins, Inc.
- Jenny Calubayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufactured shadow masks for material deposition control
- Patent number 11,613,802
- Issue date Mar 28, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reconstituted wafer including integrated circuit die mechanically i...
- Patent number 11,605,570
- Issue date Mar 14, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled warping of shadow mask tooling for improved reliability...
- Patent number 11,326,246
- Issue date May 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled induced warping of electronic substrates via electroplating
- Patent number 11,236,436
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates
- Patent number 11,239,182
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...
- Publication number 20220077016
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Warping of Shadow Mask Tooling for Improved Reliability...
- Publication number 20220025506
- Publication date Jan 27, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADDITIVELY MANUFACTURED SHADOW MASKS FOR MATERIAL DEPOSITION CONTROL
- Publication number 20210324508
- Publication date Oct 21, 2021
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Induced Warping of Electronic Substrates via Electroplating
- Publication number 20210230765
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Controlled Induced Warping of Electronic Substrates
- Publication number 20210233866
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS

Richard Korneisel

Person

Patents Grantslast 30 patents

Custom photolithography masking via precision dispense process

Additively manufactured shadow masks for material deposition control

Reconstituted wafer including integrated circuit die mechanically i...

Reconstituted wafer including mold material with recessed conductiv...

Controlled warping of shadow mask tooling for improved reliability...

Controlled induced warping of electronic substrates via electroplating

Controlled induced warping of electronic substrates

Patents Applicationslast 30 patents

RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

Controlled Warping of Shadow Mask Tooling for Improved Reliability...

ADDITIVELY MANUFACTURED SHADOW MASKS FOR MATERIAL DEPOSITION CONTROL

Controlled Induced Warping of Electronic Substrates via Electroplating

Controlled Induced Warping of Electronic Substrates