Richard L. Bechtel

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heatsink apparatus for de-coupling clamping forces on an integrated...
- Patent number 6,483,708
- Issue date Nov 19, 2002
- Fujitsu Limited
- Hassan O. Ali
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink apparatus for de-coupling clamping forces on an integrated...
- Patent number 6,459,582
- Issue date Oct 1, 2002
- Fujitsu Limited
- Hassan O. Ali
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for fabrication of programmable interconnect structure
- Patent number 6,150,199
- Issue date Nov 21, 2000
- QuickLogic Corporation
- Ralph G. Whitten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of programmable interconnect structure
- Patent number 5,989,943
- Issue date Nov 23, 1999
- QuickLogic Corporation
- Ralph G. Whitten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically programmable interconnect structure having a PECVD amo...
- Patent number 5,780,919
- Issue date Jul 14, 1998
- QuickLogic Corporation
- Hua-Thye Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array having reproducible metal-to-metal am...
- Patent number 5,717,230
- Issue date Feb 10, 1998
- QuickLogic Corporation
- Hua-Thye Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,691,949
- Issue date Nov 25, 1997
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,514,884
- Issue date May 7, 1996
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrically programmable interconnect structure having a PECVD amo...
- Patent number 5,502,315
- Issue date Mar 26, 1996
- QuickLogic Corporation
- Hua-Thye Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,315,130
- Issue date May 24, 1994
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,252,507
- Issue date Oct 12, 1993
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Package for an integrated circuit structure
- Patent number 5,223,741
- Issue date Jun 29, 1993
- Tactical Fabs, Inc.
- Richard L. Bechtel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multichip package with interconnect structure and heat...
- Patent number 5,182,632
- Issue date Jan 26, 1993
- Tactical Fabs, Inc.
- Richard L. Bechtel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and cell mount
- Patent number 4,836,861
- Issue date Jun 6, 1989
- Tactical Fabs, Inc.
- Douglas L. Peltzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heatsink apparatus for de-coupling clamping forces on an integrated...
- Publication number 20020030972
- Publication date Mar 14, 2002
- Hassan O. Ali
- F28 - HEAT EXCHANGE IN GENERAL

Richard L. Bechtel

Person

Patents Grantslast 30 patents

Heatsink apparatus for de-coupling clamping forces on an integrated...

Heatsink apparatus for de-coupling clamping forces on an integrated...

Method for fabrication of programmable interconnect structure

Method for fabrication of programmable interconnect structure

Electrically programmable interconnect structure having a PECVD amo...

Field programmable gate array having reproducible metal-to-metal am...

Very high density wafer scale device architecture

Very high density wafer scale device architecture

Electrically programmable interconnect structure having a PECVD amo...

Very high density wafer scale device architecture

Very high density wafer scale device architecture

Package for an integrated circuit structure

High density multichip package with interconnect structure and heat...

Solar cell and cell mount

Patents Applicationslast 30 patents

Heatsink apparatus for de-coupling clamping forces on an integrated...