Richard L. Wheeler

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect pattern for semiconductor packaging
- Patent number 8,743,559
- Issue date Jun 3, 2014
- Xilinx, Inc.
- Paul Y. Wu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnect pattern for semiconductor packaging
- Patent number 8,395,903
- Issue date Mar 12, 2013
- Xilinx, Inc.
- Paul Ying-Fung Wu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package component and ball grid array simulation...
- Patent number 8,386,229
- Issue date Feb 26, 2013
- Xilinx, Inc.
- Raymond E. Anderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for reducing a magnitude of a rate of current change of an i...
- Patent number 6,871,290
- Issue date Mar 22, 2005
- Sun Microsystems, Inc.
- Claude R. Gauthier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of emulating an ideal transformer valid from DC to infinite...
- Patent number 6,754,616
- Issue date Jun 22, 2004
- Fujitsu Limited
- Bidyut K. Sen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
CMOS-microprocessor chip and package anti-resonance apparatus
- Patent number 6,483,341
- Issue date Nov 19, 2002
- Sun Microsystems, Inc.
- Claude R. Gauthier
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
CMOS-microprocessor chip and package anti-resonance method
- Patent number 6,456,107
- Issue date Sep 24, 2002
- Sun Microsystems, Inc.
- Claude R. Gauthier
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
CMOS-microprocessor chip and package anti-resonance pass-band shunt...
- Patent number 6,441,640
- Issue date Aug 27, 2002
- Sun Microsystems, Inc.
- Claude R. Gauthier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power supply distribution structure for integrated circuit chip mod...
- Patent number 6,034,332
- Issue date Mar 7, 2000
- Fujitsu Limited
- Larry Louis Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for equalizing signal parameters in flip chip redistribut...
- Patent number 6,025,647
- Issue date Feb 15, 2000
- VLSI Technology, Inc.
- Jayarama N. Shenoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-yield methods of fabricating large substrate capacitors
- Patent number 5,817,533
- Issue date Oct 6, 1998
- Fujitsu Limited
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing power supply distribution structures for m...
- Patent number 5,765,279
- Issue date Jun 16, 1998
- Fujitsu Limited
- Larry Louis Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for controlling power consumption in integrated circuits
- Patent number 5,701,071
- Issue date Dec 23, 1997
- Fujitsu Limited
- Jiunn-Yau Liou
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate with thin film capacitor and insulating plug
- Patent number 5,652,693
- Issue date Jul 29, 1997
- Fujitsu Limited
- William T. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling semiconductor chips in multichip modules
- Patent number 5,514,906
- Issue date May 7, 1996
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Special interconnect layer employing offset trace layout for advanc...
- Patent number 5,508,938
- Issue date Apr 16, 1996
- Fujitsu Limited
- Richard L. Wheeler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a substrate with thin film capacitor and in...
- Patent number 5,455,064
- Issue date Oct 3, 1995
- Fujitsu Limited
- William T. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-density chip mounting
- Patent number 5,113,314
- Issue date May 12, 1992
- Hewlett-Packard Company
- Richard L. Wheeler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver-receiver pair for low noise digital signaling
- Patent number 4,987,322
- Issue date Jan 22, 1991
- Hewlett-Packard Company
- Richard L. Wheeler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Method for reducing a magnitude of a rate of current change of an i...
- Publication number 20030037267
- Publication date Feb 20, 2003
- Claude R. Gauthier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Apparatus for reducing a magnitude of a rate of current change of a...
- Publication number 20030034817
- Publication date Feb 20, 2003
- Claude R. Gauthier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CMOS-microprocessor chip and package anti-resonance pass-band shunt...
- Publication number 20020089347
- Publication date Jul 11, 2002
- Claude R. Gauthier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CMOS-microprocessor chip and package anti-resonance method
- Publication number 20020084837
- Publication date Jul 4, 2002
- Claude R. Gauthier
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CMOS-microprocessor chip and package anti-resonance apparatus
- Publication number 20020084836
- Publication date Jul 4, 2002
- Claude R. Gauthier
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Richard L. Wheeler

Person

Patents Grantslast 30 patents

Interconnect pattern for semiconductor packaging

Interconnect pattern for semiconductor packaging

Integrated circuit package component and ball grid array simulation...

Method for reducing a magnitude of a rate of current change of an i...

Method of emulating an ideal transformer valid from DC to infinite...

CMOS-microprocessor chip and package anti-resonance apparatus

CMOS-microprocessor chip and package anti-resonance method

CMOS-microprocessor chip and package anti-resonance pass-band shunt...

Power supply distribution structure for integrated circuit chip mod...

Apparatus for equalizing signal parameters in flip chip redistribut...

High-yield methods of fabricating large substrate capacitors

Methods of manufacturing power supply distribution structures for m...

Systems for controlling power consumption in integrated circuits

Substrate with thin film capacitor and insulating plug

Apparatus for cooling semiconductor chips in multichip modules

Special interconnect layer employing offset trace layout for advanc...

Process for fabricating a substrate with thin film capacitor and in...

High-speed, high-density chip mounting

Driver-receiver pair for low noise digital signaling

Patents Applicationslast 30 patents

Method for reducing a magnitude of a rate of current change of an i...

Apparatus for reducing a magnitude of a rate of current change of a...

CMOS-microprocessor chip and package anti-resonance pass-band shunt...

CMOS-microprocessor chip and package anti-resonance method

CMOS-microprocessor chip and package anti-resonance apparatus