Richard Pommer

Person

San Clemente, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fiber optic end-face transparent protector system and method
- Patent number 10,712,508
- Issue date Jul 14, 2020
- Ultra Communications, Inc.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Grant
Fiber optic end-face transparent protector system and method
- Patent number 10,162,124
- Issue date Dec 25, 2018
- Ultra Communications, Inc.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Grant
Fiber optic end-face transparent protector
- Patent number 9,784,924
- Issue date Oct 10, 2017
- Ultra Communications, Inc.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Grant
Small form factor transceiver compatible with solder processing
- Patent number 9,465,176
- Issue date Oct 11, 2016
- Ultra Communications, Inc.
- Richard J. Pommer
- G02 - OPTICS
Information Patent Grant
Low profile fiber-to-module interface with relaxed alignment tolera...
- Patent number 9,442,255
- Issue date Sep 13, 2016
- Ultra Communications, Inc.
- Richard J. Pommer
- G02 - OPTICS
Information Patent Grant
Optical time domain reflectometer in a small form factor package
- Patent number 9,429,496
- Issue date Aug 30, 2016
- Ultra Communications, Inc.
- Charles B. Kuznia
- G01 - MEASURING TESTING
Information Patent Grant
Compact optical package made with planar structures
- Patent number 9,151,916
- Issue date Oct 6, 2015
- Ultra Communications, Inc.
- Richard J. Pommer
- G02 - OPTICS
Information Patent Grant
Fiber optic bi-directional coupling lens
- Patent number 8,724,944
- Issue date May 13, 2014
- Ultra Communications, Inc.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Grant
Attachable components for providing an optical interconnect between...
- Patent number 8,348,522
- Issue date Jan 8, 2013
- Ultra Communications, Inc.
- Charles B. Kuznia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber optic bi-directional coupling lens
- Patent number 8,335,411
- Issue date Dec 18, 2012
- Ultra Communications, Inc.
- Charles B. Kuznia
- G01 - MEASURING TESTING
Information Patent Grant
Small-scale optoelectronic package
- Patent number 6,910,812
- Issue date Jun 28, 2005
- Peregrine Semiconductor Corporation
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment plate with matched thermal coefficient of expansion method
- Patent number 6,675,456
- Issue date Jan 13, 2004
- Honeywell International Inc.
- Richard J. Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lasable bond-ply materials for high density printed wiring boards
- Patent number 6,673,190
- Issue date Jan 6, 2004
- Honeywell International Inc.
- David Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making a multi-layer interconnect
- Patent number 6,607,939
- Issue date Aug 19, 2003
- Honeywell International Inc.
- Richard Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond-ply structure for interconnection of circuit layer pairs with...
- Patent number 6,576,839
- Issue date Jun 10, 2003
- Honeywell International Inc.
- Richard J. Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conditioning substrate stiffener
- Patent number 6,570,250
- Issue date May 27, 2003
- Honeywell International Inc.
- Richard J. Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment plate with matched thermal coefficient of expansion
- Patent number 6,560,844
- Issue date May 13, 2003
- Honeywell International Inc.
- Richard J. Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing inherent stress via high temperature annealing
- Patent number 6,489,184
- Issue date Dec 3, 2002
- Honeywell International Inc.
- Richard Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer interconnect
- Patent number 6,388,325
- Issue date May 14, 2002
- AlliedSignal Inc.
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric processing with included stabilization periods
- Patent number 6,338,776
- Issue date Jan 15, 2002
- Honeywell International Inc.
- Richard J. Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bond ply structure and associated process for interconnection of ci...
- Patent number 6,319,811
- Issue date Nov 20, 2001
- Scott Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sputtering process
- Patent number 6,261,423
- Issue date Jul 17, 2001
- Honeywell International Inc.
- Richard J. Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lasable bond-ply materials for high density printed wiring boards
- Patent number 6,245,696
- Issue date Jun 12, 2001
- Honeywell International Inc.
- David R. Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit assembly and method of manufacture therefor
- Patent number 6,246,014
- Issue date Jun 12, 2001
- Honeywell International Inc.
- Richard John Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density printed circuit substrate and method of fabrication
- Patent number 6,242,078
- Issue date Jun 5, 2001
- Isola Laminate Systems Corp.
- Richard J. Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering process
- Patent number 6,153,060
- Issue date Nov 28, 2000
- Honeywell International Inc.
- Richard J. Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit assembly having locally enhanced wiring density
- Patent number 6,147,870
- Issue date Nov 14, 2000
- Honeywell International Inc.
- Richard J. Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit assembly
- Patent number 5,839,188
- Issue date Nov 24, 1998
- AlliedSignal Inc.
- Richard J. Pommer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fiber Optic End-Face Transparent Protector System and Method
- Publication number 20190154926
- Publication date May 23, 2019
- ULTRA COMMUNICATIONS, INC.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Application
FIBER OPTIC END-FACE TRANSPARENT PROTECTOR SYSTEM AND METHOD
- Publication number 20180011259
- Publication date Jan 11, 2018
- ULTRA COMMUNICATIONS, INC.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Application
FIBER OPTIC END-FACE TRANSPARENT PROTECTOR
- Publication number 20150378108
- Publication date Dec 31, 2015
- ULTRA COMMUNICATIONS, INC.
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Application
OPTICAL TIME DOMAIN REFLECTOMETER IN A SMALL FORM FACTOR PACKAGE
- Publication number 20150323420
- Publication date Nov 12, 2015
- ULTRA COMMUNICATION, INC.
- Charles B. Kuznia
- G01 - MEASURING TESTING
Information Patent Application
SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING
- Publication number 20150063760
- Publication date Mar 5, 2015
- ULTRA COMMUNICATIONS, INC.
- Richard J. Pommer
- G02 - OPTICS
Information Patent Application
COMPACT OPTICAL PACKAGE MADE WITH PLANAR STRUCTURES
- Publication number 20140099059
- Publication date Apr 10, 2014
- Ultra Communications,Inc.
- Richard J. Pommer
- G02 - OPTICS
Information Patent Application
LOW PROFILE FIBER-TO-MODULE INTERFACE WITH RELAXED ALIGNMENT TOLERA...
- Publication number 20130209038
- Publication date Aug 15, 2013
- Richard J. Pommer
- G02 - OPTICS
Information Patent Application
INTEGRATED OPTICAL TIME DOMAIN REFLECTOMETER
- Publication number 20130208264
- Publication date Aug 15, 2013
- Joseph F. Ahadian
- G01 - MEASURING TESTING
Information Patent Application
FIBER OPTIC BI-DIRECTIONAL COUPLING LENS
- Publication number 20130094026
- Publication date Apr 18, 2013
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Application
PATTERNED BACKSIDE OPTICAL COATING ON TRANSPARENT SUBSTRATE
- Publication number 20120176680
- Publication date Jul 12, 2012
- Joseph F. Ahadian
- G02 - OPTICS
Information Patent Application
FIBER OPTIC BI-DIRECTIONAL COUPLING LENS
- Publication number 20110097037
- Publication date Apr 28, 2011
- ULTRA COMMUNICATIONS, INC.
- Charles B. KUZNIA
- G02 - OPTICS
Information Patent Application
COMPONENTS FOR OPTICAL INTERCONNECT THROUGH PRINTED WIRING BOARDS
- Publication number 20100067853
- Publication date Mar 18, 2010
- Charles B. Kuznia
- G02 - OPTICS
Information Patent Application
Connector attachment to a low height profile module
- Publication number 20090245736
- Publication date Oct 1, 2009
- Joseph F. Ahadian
- G02 - OPTICS
Information Patent Application
Lasable bond-ply materials for high density printed wiring boards
- Publication number 20040170795
- Publication date Sep 2, 2004
- AlliedSignal Inc.
- David R. Haas
- B32 - LAYERED PRODUCTS
Information Patent Application
Alignment plate with matched thermal coefficient of expansion
- Publication number 20040148756
- Publication date Aug 5, 2004
- Richard J. Pommer
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layer interconnect
- Publication number 20040124534
- Publication date Jul 1, 2004
- Richard Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Small-scale optoelectronic package
- Publication number 20030201462
- Publication date Oct 30, 2003
- Richard Pommer
- G02 - OPTICS
Information Patent Application
Power conditioning substrate stiffener
- Publication number 20030197256
- Publication date Oct 23, 2003
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment plate with matched thermal coefficient of expansion
- Publication number 20030005567
- Publication date Jan 9, 2003
- Richard J. Pommer
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layer interconnect
- Publication number 20020092159
- Publication date Jul 18, 2002
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER INTERCONNECT
- Publication number 20020003303
- Publication date Jan 10, 2002
- RICHARD POMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lasable bond-ply materials for high density printed wiring boards
- Publication number 20020004352
- Publication date Jan 10, 2002
- AlliedSignal, Inc.
- David Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ION PROCESSING OF A SUBSTRATE
- Publication number 20020000370
- Publication date Jan 3, 2002
- RICHARD J. POMMER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE MANUFACTURING PLANT HAVING MINIMUM FOOTPRINT SKINNED LINES
- Publication number 20010039715
- Publication date Nov 15, 2001
- pommer
- RICHARD POMMER
- H01 - BASIC ELECTRIC ELEMENTS

Richard Pommer

Person

Patents Grantslast 30 patents

Fiber optic end-face transparent protector system and method

Fiber optic end-face transparent protector system and method

Fiber optic end-face transparent protector

Small form factor transceiver compatible with solder processing

Low profile fiber-to-module interface with relaxed alignment tolera...

Optical time domain reflectometer in a small form factor package

Compact optical package made with planar structures

Fiber optic bi-directional coupling lens

Attachable components for providing an optical interconnect between...

Fiber optic bi-directional coupling lens

Small-scale optoelectronic package

Alignment plate with matched thermal coefficient of expansion method

Lasable bond-ply materials for high density printed wiring boards

Method of making a multi-layer interconnect

Bond-ply structure for interconnection of circuit layer pairs with...

Power conditioning substrate stiffener

Alignment plate with matched thermal coefficient of expansion

Removing inherent stress via high temperature annealing

Multi-layer interconnect

Dielectric processing with included stabilization periods

Bond ply structure and associated process for interconnection of ci...

Sputtering process

Lasable bond-ply materials for high density printed wiring boards

Printed circuit assembly and method of manufacture therefor

High density printed circuit substrate and method of fabrication

Sputtering process

Printed circuit assembly having locally enhanced wiring density

Method of manufacturing a printed circuit assembly

Patents Applicationslast 30 patents

Fiber Optic End-Face Transparent Protector System and Method

FIBER OPTIC END-FACE TRANSPARENT PROTECTOR SYSTEM AND METHOD

FIBER OPTIC END-FACE TRANSPARENT PROTECTOR

OPTICAL TIME DOMAIN REFLECTOMETER IN A SMALL FORM FACTOR PACKAGE

SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING

COMPACT OPTICAL PACKAGE MADE WITH PLANAR STRUCTURES

LOW PROFILE FIBER-TO-MODULE INTERFACE WITH RELAXED ALIGNMENT TOLERA...

INTEGRATED OPTICAL TIME DOMAIN REFLECTOMETER

FIBER OPTIC BI-DIRECTIONAL COUPLING LENS

PATTERNED BACKSIDE OPTICAL COATING ON TRANSPARENT SUBSTRATE

FIBER OPTIC BI-DIRECTIONAL COUPLING LENS

COMPONENTS FOR OPTICAL INTERCONNECT THROUGH PRINTED WIRING BOARDS

Connector attachment to a low height profile module

Lasable bond-ply materials for high density printed wiring boards

Alignment plate with matched thermal coefficient of expansion

Multi-layer interconnect

Small-scale optoelectronic package

Power conditioning substrate stiffener

Alignment plate with matched thermal coefficient of expansion

Multi-layer interconnect

MULTI-LAYER INTERCONNECT

Lasable bond-ply materials for high density printed wiring boards

ION PROCESSING OF A SUBSTRATE

SUBSTRATE MANUFACTURING PLANT HAVING MINIMUM FOOTPRINT SKINNED LINES