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Richard R. Steitz
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Chippewa Falls, WI, US
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last 30 patents
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Patent Grant
Method of fabricating metallized chip carries from wafer-shaped sub...
Patent number
5,358,826
Issue date
Oct 25, 1994
Cray Research, Inc.
Richard R. Steitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip carrier lid
Patent number
5,258,576
Issue date
Nov 2, 1993
Cray Research, Inc.
Eugene F. Neumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a chip carrier with terminating resistive elements
Patent number
RE34395
Issue date
Oct 5, 1993
Cray Research, Inc.
Eugene F. Neumann
029 - Metal working
Information
Patent Grant
Non-metallized chip carrier
Patent number
H1153
Issue date
Mar 2, 1993
Melvin C. August
357 -
Information
Patent Grant
Method of fabricating metallized chip carriers from wafer-shaped su...
Patent number
5,182,420
Issue date
Jan 26, 1993
Cray Research, Inc.
Richard R. Steitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced capacitance chip carrier
Patent number
5,134,247
Issue date
Jul 28, 1992
Cray Research Inc.
Peter J. Wehner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible automated bonding method and apparatus
Patent number
5,127,570
Issue date
Jul 7, 1992
Cray Research, Inc.
Richard R. Steitz
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip carrier with terminating resistive elements
Patent number
5,122,620
Issue date
Jun 16, 1992
Cray Research Inc.
Eugene F. Neumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a chip carrier with terminating resistive elements
Patent number
4,949,453
Issue date
Aug 21, 1990
Cray Research, Inc.
Eugene F. Neumann
H01 - BASIC ELECTRIC ELEMENTS