Richard Scott Trevino

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High density chip level package for the packaging of integrated cir...
- Patent number 6,953,999
- Issue date Oct 11, 2005
- Kulicke & Soffa Investments, Inc.
- Jan I. Strandberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip level package for the packaging of integrated cir...
- Patent number 6,872,589
- Issue date Mar 29, 2005
- Kulicke & Soffa Investments, Inc.
- Jan I. Strandberg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High density chip level package for the packaging of integrated cir...
- Publication number 20050146033
- Publication date Jul 7, 2005
- Kulicke & Soffa Investments, Inc.
- Jan I. Strandberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip level package for the packaging of integrated cir...
- Publication number 20040155337
- Publication date Aug 12, 2004
- Kulicke & Soffa Investments, Inc.
- Jan I. Strandberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density substrate for the packaging of integrated circuits
- Publication number 20030197285
- Publication date Oct 23, 2003
- Kulicke & Soffa Investments, Inc.
- Jan I. Strandberg
- H01 - BASIC ELECTRIC ELEMENTS