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Rick Snyder
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Windsor, CO, US
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Patents Grants
last 30 patents
Information
Patent Grant
Moisture barrier for semiconductor structures with stress relief
Patent number
9,576,920
Issue date
Feb 21, 2017
Avago Technologies General IP (Singapore) Pte. Ltd.
Jonathan Abrokwah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Moisture barrier for semiconductor structures with stress relief
Patent number
9,508,661
Issue date
Nov 29, 2016
Avago Technologies General IP (Singapore) Pte. Ltd.
Jonathan Abrokwah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance semiconductor device
Patent number
9,087,926
Issue date
Jul 21, 2015
Avago Technologies General IP (Singapore) Pte. Ltd.
Rick D. Snyder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including cap
Patent number
8,946,877
Issue date
Feb 3, 2015
Avago Technologies General IP (Singapore) Pte. Ltd.
Rick Snyder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation for group III-V semiconductor devices having a plated m...
Patent number
8,941,218
Issue date
Jan 27, 2015
Avago Technologies General IP (Singapore) Pte. Ltd.
Nathan Perkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Acoustic coupling layer for coupled resonator filters and method of...
Patent number
8,587,391
Issue date
Nov 19, 2013
Avago Technologies General IP (Singapore) Pte. Ltd.
Steve Gilbert
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Planar packageless semiconductor structure with via and coplanar co...
Patent number
7,977,799
Issue date
Jul 12, 2011
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
William J. Lypen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
Patent number
6,903,017
Issue date
Jun 7, 2005
Agilent Technologies, Inc.
Ricky D. Snyder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
Patent number
6,646,346
Issue date
Nov 11, 2003
Agilent Technologies, Inc.
Ricky D. Snyder
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF
Publication number
20160336284
Publication date
Nov 17, 2016
Avago Technologies General IP (Singapore) PTE. LTD.
Jonathan Abrokwah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF
Publication number
20160020179
Publication date
Jan 21, 2016
Avago Technologies General IP (Singapore) PTE. LTD.
Jonathan Abrokwah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Passivation for Group III-V Semiconductor Devices Having a Plated M...
Publication number
20150048484
Publication date
Feb 19, 2015
Avago Technologies General IP (Singapore) PTE. LTD.
Nathan Perkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CAP
Publication number
20120074555
Publication date
Mar 29, 2012
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
Rick Snyder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACOUSTIC COUPLING LAYER FOR COUPLED RESONATOR FILTERS AND METHOD OF...
Publication number
20110204996
Publication date
Aug 25, 2011
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
Steve Gilbert
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
LOW CAPACITANCE SEMICONDUCTOR DEVICE
Publication number
20110147894
Publication date
Jun 23, 2011
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
Rick D. Snyder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANAR PACKAGELESS SEMICONDUCTOR STRUCTURE WITH VIA AND COPLANAR CO...
Publication number
20090273093
Publication date
Nov 5, 2009
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
William J. Lypen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Schottky diodes and methods of making the same
Publication number
20060076639
Publication date
Apr 13, 2006
William J. Lypen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit metallization using a titanium/alminum alloy
Publication number
20040038453
Publication date
Feb 26, 2004
Ricky D. Snyder
H01 - BASIC ELECTRIC ELEMENTS