Rie Katou

Person

Ichihara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flap in an adhesive tape for semiconductor manufacturing
- Patent number D804435
- Issue date Dec 5, 2017
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,190,309
- Issue date Nov 17, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,076,833
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer processing tape, method of manufacturing wafer processing tap...
- Patent number 9,076,832
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Adhesive sheet and method for manufacturing adhesive sheets
- Patent number 9,011,624
- Issue date Apr 21, 2015
- Hitachi Chemical Company, Ltd.
- Ryoji Furutani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding integral film, dicing/die bonding integral film...
- Patent number 8,975,161
- Issue date Mar 10, 2015
- Hitachi Chemical Company, Ltd.
- Rie Katou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D690278
- Issue date Sep 24, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D689831
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D680505
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664511
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664512
- Issue date Jul 31, 2012
- Hitachi Chemical Comapany, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656909
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656910
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20150279717
- Publication date Oct 1, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20130273718
- Publication date Oct 17, 2013
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM...
- Publication number 20130143390
- Publication date Jun 6, 2013
- Hitachi Chemical Company, Ltd.
- Rie Katou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEETS
- Publication number 20120171475
- Publication date Jul 5, 2012
- Ryoji Furutani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...
- Publication number 20120094471
- Publication date Apr 19, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Flap in an adhesive tape for semiconductor manufacturing

Tape for processing wafer, method for manufacturing tape for proces...

Tape for processing wafer, method for manufacturing tape for proces...

Wafer processing tape, method of manufacturing wafer processing tap...

Adhesive sheet and method for manufacturing adhesive sheets

Dicing/die bonding integral film, dicing/die bonding integral film...

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Patents Applicationslast 30 patents

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEETS

WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...