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Rie Wada

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  • Itaboshi-ku, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-Free Solder Alloy, Solder Material and Joined Structure
    • Publication number 20160368104
    • Publication date Dec 22, 2016
    • KOKI COMPANY LIMITED
    • Atsushi Irisawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLUX FOR SOLDER PASTE, AND SOLDER PASTE
    • Publication number 20120291921
    • Publication date Nov 22, 2012
    • ARAKAWA CHEMICAL INDUSTRIES, LTD.
    • Eiji Iwamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER PASTE
    • Publication number 20120291922
    • Publication date Nov 22, 2012
    • ARAKAWA CHEMICAL INDUSTRIES, LTD.
    • Eiji Iwamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR