Rikiya Kamimura

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Toyoake-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thick film circuit board, method of producing the same and integrat...
- Patent number 7,417,318
- Issue date Aug 26, 2008
- Denso Corporation
- Tohru Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of recycling printed circuit board
- Patent number 7,107,661
- Issue date Sep 19, 2006
- Denso Corporation
- Rikiya Kamimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Angular velocity sensor, related method for manufacturing the senso...
- Patent number 6,360,600
- Issue date Mar 26, 2002
- Denso Corporation
- Hisao Kuroki
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20110042812
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of recycling printed circuit board
- Publication number 20050246879
- Publication date Nov 10, 2005
- Rikiya Kamimura
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
Thick film circuit board, method of producing the same and integrat...
- Publication number 20040212085
- Publication date Oct 28, 2004
- Denso Corporation
- Tohru Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and appratus of recycling printed circuit board
- Publication number 20040111854
- Publication date Jun 17, 2004
- Rikiya Kamimura
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL