RISHI BHOOSHAN

Person

GHAZIABAD, IN

People

Patents Grantslast 30 patents

Information Patent Grant
Processing system with low power wake-up pad
- Patent number 9,494,987
- Issue date Nov 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dzung T. Tran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for preventing tampering with integrated circuit
- Patent number 9,455,233
- Issue date Sep 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Rishi Bhooshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal bond wire shield
- Patent number 9,337,140
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power distribution using bond wires
- Patent number 9,196,598
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved shielding
- Patent number 9,147,656
- Issue date Sep 29, 2015
- Freescale Semicondutor, Inc.
- Sumit Varshney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for preventing tampering with integrated circuit
- Patent number 8,896,086
- Issue date Nov 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Mohit Arora
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES
- Publication number 20160163671
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHAILESH KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING POWER DISTRIBUTION USING BOND WIRES
- Publication number 20150364439
- Publication date Dec 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORME...
- Publication number 20150221592
- Publication date Aug 6, 2015
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH VARIABLE LENGTH BOND PAD
- Publication number 20150214167
- Publication date Jul 30, 2015
- Rishi Bhooshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM WITH LOW POWER WAKE-UP PAD
- Publication number 20150153811
- Publication date Jun 4, 2015
- DZUNG T. TRAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR PREVENTING TAMPERING WITH INTEGRATED CIRCUIT
- Publication number 20140353849
- Publication date Dec 4, 2014
- Mohit Arora
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND AND PROBE PADS
- Publication number 20140332811
- Publication date Nov 13, 2014
- Naveen Kumar
- H01 - BASIC ELECTRIC ELEMENTS

RISHI BHOOSHAN

Person

Patents Grantslast 30 patents

Processing system with low power wake-up pad

System for preventing tampering with integrated circuit

Signal bond wire shield

Semiconductor device having power distribution using bond wires

Semiconductor device with improved shielding

System for preventing tampering with integrated circuit

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES

SEMICONDUCTOR DEVICE HAVING POWER DISTRIBUTION USING BOND WIRES

SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORME...

SEMICONDUCTOR DIE WITH VARIABLE LENGTH BOND PAD

PROCESSING SYSTEM WITH LOW POWER WAKE-UP PAD

SYSTEM FOR PREVENTING TAMPERING WITH INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE WITH BOND AND PROBE PADS