RITA J. KLEIN

Person

BOISE, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 12,034,057
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including a conductive contact including a dielectric m...
- Patent number 12,002,759
- Issue date Jun 4, 2024
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,990,528
- Issue date May 21, 2024
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including staircase structures, and related...
- Patent number 11,894,305
- Issue date Feb 6, 2024
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory with conductive rails in conductive tiers,...
- Patent number 11,812,610
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Integrated assemblies having conductive posts extending through sta...
- Patent number 11,800,706
- Issue date Oct 24, 2023
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Tungsten structures and methods of forming the structures
- Patent number 11,791,268
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects
- Patent number 11,742,282
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,705,500
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,600,630
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices including conductive levels having varying...
- Patent number 11,594,495
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,393,756
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a dielectric material in a central portion of a...
- Patent number 11,342,265
- Issue date May 24, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,315,877
- Issue date Apr 26, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten structures and methods of forming the structures
- Patent number 11,244,903
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,195,848
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 11,158,718
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive posts extending through sta...
- Patent number 11,121,143
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,056,507
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Collin Howder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 10,957,775
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures
- Patent number 10,943,920
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 10,748,922
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Collin Howder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vapor-etch cyclic process
- Patent number 10,607,851
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Andrew L. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods of fabricating integrated structure
- Patent number 10,553,611
- Issue date Feb 4, 2020
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods of fabricating integrated structures
- Patent number 10,438,968
- Issue date Oct 8, 2019
- Micron Technology, Inc.
- John M. Meldrin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via liner densification
- Patent number 10,163,655
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures
- Patent number 9,935,120
- Issue date Apr 3, 2018
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 9,287,379
- Issue date Mar 15, 2016
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal silicide-comprising material and methods o...
- Patent number 8,962,431
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC...
- Publication number 20240290722
- Publication date Aug 29, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20240237336
- Publication date Jul 11, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240153877
- Publication date May 9, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20240138146
- Publication date Apr 25, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY WITH CONDUCTIVE RAILS IN CONDUCTIVE TIERS,...
- Publication number 20240107768
- Publication date Mar 28, 2024
- Micron Technology Way
- John D. Hopkins
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071931
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Tom George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230395149
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND...
- Publication number 20230397424
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
Information Patent Application
Methods Used In Forming A Memory Array Comprising Strings Of Memory...
- Publication number 20230290721
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...
- Publication number 20230207458
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230164985
- Publication date May 25, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230164991
- Publication date May 25, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...
- Publication number 20230154856
- Publication date May 18, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20230121315
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor And Memory Circuitry Comprising Strings Of Memory Cells
- Publication number 20230016742
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...
- Publication number 20220310522
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE
- Publication number 20220310524
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE
- Publication number 20220310525
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20220302032
- Publication date Sep 22, 2022
- Micron Technology Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING A CONDUCTIVE CONTACT INCLUDING A DIELECTRIC M...
- Publication number 20220254727
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20220238444
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES
- Publication number 20220230962
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220059569
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220045075
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Conductive Interconnects
- Publication number 20220044999
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Having a First Metal-Containing...
- Publication number 20220028996
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20210375894
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210287990
- Publication date Sep 16, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210287989
- Publication date Sep 16, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES
- Publication number 20210202388
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS

RITA J. KLEIN

Person

Patents Grantslast 30 patents

Microelectronic devices and memory devices including conductive lev...

Assemblies which include wordlines having a first metal-containing...

Apparatuses including a conductive contact including a dielectric m...

Assemblies having conductive structures with three or more differen...

Microelectronic devices including staircase structures, and related...

Three-dimensional memory with conductive rails in conductive tiers,...

Integrated assemblies having conductive posts extending through sta...

Tungsten structures and methods of forming the structures

Conductive interconnects

Assemblies having conductive structures with three or more differen...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including conductive levels having varying...

Methods of forming microelectronic devices, and related microelectr...

Apparatus including a dielectric material in a central portion of a...

Methods of forming microelectronic devices, and related microelectr...

Tungsten structures and methods of forming the structures

Memory arrays and methods used in forming a memory array comprising...

Assemblies which include wordlines having a first metal-containing...

Integrated assemblies having conductive posts extending through sta...

Memory arrays and methods used in forming a memory array

Assemblies having conductive structures with three or more differen...

Methods of fabricating integrated structures

Memory arrays and methods used in forming a memory array

Vapor-etch cyclic process

Memory arrays and methods of fabricating integrated structure

Memory arrays and methods of fabricating integrated structures

Through substrate via liner densification

Methods of fabricating integrated structures

Memory arrays

Methods of forming metal silicide-comprising material and methods o...

Patents Applicationslast 30 patents

APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC...

Integrated Assemblies Having Conductive Posts Extending Through Sta...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Integrated Assemblies Having Conductive Posts Extending Through Sta...

THREE-DIMENSIONAL MEMORY WITH CONDUCTIVE RAILS IN CONDUCTIVE TIERS,...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND...

Methods Used In Forming A Memory Array Comprising Strings Of Memory...

BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...

Assemblies Having Conductive Structures with Three or More Differen...

Transistor And Memory Circuitry Comprising Strings Of Memory Cells

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...

MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE

MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

APPARATUSES INCLUDING A CONDUCTIVE CONTACT INCLUDING A DIELECTRIC M...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Conductive Interconnects

Assemblies Which Include Wordlines Having a First Metal-Containing...

Integrated Assemblies Having Conductive Posts Extending Through Sta...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES