Roawen Chen

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package assembly including a semiconductor substrate in which a fir...
- Patent number 9,768,144
- Issue date Sep 19, 2017
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed semiconductor substrates and associated techniques
- Patent number 9,391,045
- Issue date Jul 12, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including a semiconductor substrate in which a fir...
- Patent number 9,257,410
- Issue date Feb 9, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed semiconductor substrates and associated techniques
- Patent number 9,034,730
- Issue date May 19, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state disk with wireless functionality
- Patent number 8,935,464
- Issue date Jan 13, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state disk with wireless functionality
- Patent number 8,719,485
- Issue date May 6, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating 1T-DRAM on bulk silicon
- Patent number 8,008,137
- Issue date Aug 30, 2011
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making and using fuse structures, and integrated circuit...
- Patent number 7,820,493
- Issue date Oct 26, 2010
- Marvell International Ltd.
- Chuan-Cheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structures, methods of making and using the same, and integrat...
- Patent number 7,704,805
- Issue date Apr 27, 2010
- Marvell International Ltd.
- Chuan-Cheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structures, methods of making and using the same, and integrat...
- Patent number 7,589,363
- Issue date Sep 15, 2009
- Marvell International Ltd.
- Chuan-Cheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structures, methods of making and using the same, and integrat...
- Patent number 7,344,924
- Issue date Mar 18, 2008
- Marvell International Ltd.
- Chuan-Cheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structures, methods of making and using the same, and integrat...
- Patent number 6,940,107
- Issue date Sep 6, 2005
- Marvell International Ltd.
- Chuan-Cheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIR...
- Publication number 20160155732
- Publication date Jun 2, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20150279806
- Publication date Oct 1, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DISK WITH WIRELESS FUNCTIONALITY
- Publication number 20140237171
- Publication date Aug 21, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20140124961
- Publication date May 8, 2014
- Marvell World Trade Ltd.
- Albert WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186960
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20110186992
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186998
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DISK WITH WIRELESS FUNCTIONALITY
- Publication number 20090327588
- Publication date Dec 31, 2009
- Sehat Sutardja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING 1T-DRAM ON BULK SILICON
- Publication number 20070215906
- Publication date Sep 20, 2007
- Marvell International Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS

Roawen Chen

Person

Patents Grantslast 30 patents

Package assembly including a semiconductor substrate in which a fir...

Recessed semiconductor substrates and associated techniques

Package assembly including a semiconductor substrate in which a fir...

Recessed semiconductor substrates and associated techniques

Solid-state disk with wireless functionality

Solid-state disk with wireless functionality

Method for fabricating 1T-DRAM on bulk silicon

Methods of making and using fuse structures, and integrated circuit...

Fuse structures, methods of making and using the same, and integrat...

Fuse structures, methods of making and using the same, and integrat...

Fuse structures, methods of making and using the same, and integrat...

Fuse structures, methods of making and using the same, and integrat...

Patents Applicationslast 30 patents

PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIR...

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

SOLID-STATE DISK WITH WIRELESS FUNCTIONALITY

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

RECESSED SEMICONDUCTOR SUBSTRATES

SOLID-STATE DISK WITH WIRELESS FUNCTIONALITY

METHOD FOR FABRICATING 1T-DRAM ON BULK SILICON