Robert B Hallock

Person

Newton, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging semiconductors at a wafer level
- Patent number 8,653,673
- Issue date Feb 18, 2014
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounted monolithic microwave integrated circuit (MMIC) st...
- Patent number 8,581,406
- Issue date Nov 12, 2013
- Raytheon Company
- James A. Robbins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivation layer for a circuit device and method of manufacture
- Patent number RE44303
- Issue date Jun 18, 2013
- Raytheon Company
- John Bedinger
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Passivation layer for a circuit device and method of manufacture
- Patent number 7,902,083
- Issue date Mar 8, 2011
- Raytheon Company
- John M. Bedinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for a circuit device and method of manufacture
- Patent number 7,767,589
- Issue date Aug 3, 2010
- Raytheon Company
- John M. Bedinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition in the formation of gate structures for III...
- Patent number 7,692,222
- Issue date Apr 6, 2010
- Raytheon Company
- Kamal Tabatabaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power microwave window
- Patent number 6,707,017
- Issue date Mar 16, 2004
- Rayth on Company
- Weldon Stoddard Williamson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) ST...
- Publication number 20130277843
- Publication date Oct 24, 2013
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20130154124
- Publication date Jun 20, 2013
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ALIGNMENT WITH CRYSTALLOGRAPHIC AXES IN GaN-ON-SiC AND OTHER NO...
- Publication number 20120313111
- Publication date Dec 13, 2012
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYGON SHAPED POWER AMPLIFIER CHIPS
- Publication number 20120313213
- Publication date Dec 13, 2012
- Raytheon Company
- Paul M. Head
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer for a Circuit Device and Method of Manufacture
- Publication number 20100120254
- Publication date May 13, 2010
- Raytheon Company
- John M. Bedinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20080308922
- Publication date Dec 18, 2008
- Yiwen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer for a Circuit Device and Method of Manufacture
- Publication number 20080185174
- Publication date Aug 7, 2008
- John M. Bedinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION IN THE FORMATION OF GATE STRUCTURES FOR III...
- Publication number 20080105901
- Publication date May 8, 2008
- Kamal Tabatabaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-power microwave window
- Publication number 20030213800
- Publication date Nov 20, 2003
- Weldon Stoddard Williamson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Robert B Hallock

Person

Patents Grantslast 30 patents

Method for packaging semiconductors at a wafer level

Flip chip mounted monolithic microwave integrated circuit (MMIC) st...

Passivation layer for a circuit device and method of manufacture

Passivation layer for a circuit device and method of manufacture

Passivation layer for a circuit device and method of manufacture

Atomic layer deposition in the formation of gate structures for III...

High-power microwave window

Patents Applicationslast 30 patents

FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) ST...

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

DIE ALIGNMENT WITH CRYSTALLOGRAPHIC AXES IN GaN-ON-SiC AND OTHER NO...

POLYGON SHAPED POWER AMPLIFIER CHIPS

Passivation Layer for a Circuit Device and Method of Manufacture

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

Passivation Layer for a Circuit Device and Method of Manufacture

ATOMIC LAYER DEPOSITION IN THE FORMATION OF GATE STRUCTURES FOR III...

High-power microwave window