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Robert David Sebesta
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Endicott, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Structure having flush circuit features and method of making
Patent number
7,098,136
Issue date
Aug 29, 2006
International Business Machines Corporation
Ronald Clothier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making an electronic package
Patent number
7,024,764
Issue date
Apr 11, 2006
International Business Machines Corporation
John S. Kresge
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Variable thickness pads on a substrate surface
Patent number
6,989,297
Issue date
Jan 24, 2006
International Business Machines Corporation
Robert David Sebesta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Variable thickness pads on a substrate surface
Patent number
6,900,545
Issue date
May 31, 2005
International Business Machines Corporation
Robert David Sebesta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a multi-layered interconnect structure
Patent number
6,829,823
Issue date
Dec 14, 2004
International Business Machines Corporation
Francis J. Downes
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure having flush circuitry features and method of making
Patent number
6,815,709
Issue date
Nov 9, 2004
International Business Machines Corporation
Ronald Clothier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fine pitch circuitization with filled plated through holes
Patent number
6,618,940
Issue date
Sep 16, 2003
International Business Machines Corporation
Kenneth J. Lubert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for compensating for distortion of a printed c...
Patent number
6,580,491
Issue date
Jun 17, 2003
International Business Machines Corporation
Richard Ronald Hall
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and system of distortion compensation in a projection imagin...
Patent number
6,580,494
Issue date
Jun 17, 2003
International Business Machines Corporation
Richard Ronald Hall
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
High density design for organic chip carriers
Patent number
6,538,213
Issue date
Mar 25, 2003
International Business Machines Corporation
Timothy F. Carden
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for connecting an electrical device to a circuit substrate
Patent number
6,429,113
Issue date
Aug 6, 2002
International Business Machines Corporation
Robert Lee Lewis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with high density interconnect layer
Patent number
6,373,717
Issue date
Apr 16, 2002
International Business Machines Corporation
Francis J. Downes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package for electronic components and method of making same
Patent number
6,351,393
Issue date
Feb 26, 2002
International Business Machines Corporation
John S. Kresge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine pitch circuitization with filled plated through holes
Patent number
6,291,779
Issue date
Sep 18, 2001
International Business Machines Corporation
Kenneth J. Lubert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Variable thickness pads on a substrate surface
Patent number
6,077,766
Issue date
Jun 20, 2000
International Business Machines Corporation
Robert David Sebesta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for circuitizing over an edge of a circuit card
Patent number
6,014,809
Issue date
Jan 18, 2000
International Business Machines Corporation
Robert D. Sebesta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for fabricating circuitry on substrates having plated throu...
Patent number
6,013,417
Issue date
Jan 11, 2000
International Business Machines Corporation
Robert David Sebesta
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Multilayered circuitized substrate and method of fabrication
Patent number
5,858,254
Issue date
Jan 12, 1999
International Business Machines Corporation
Peter Lynn Balzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for connecting an electrical device to a circuit substrate
Patent number
5,712,192
Issue date
Jan 27, 1998
International Business Machines Corporation
Robert Lee Lewis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with multilevel connections
Patent number
5,612,573
Issue date
Mar 18, 1997
International Business Machines Corporation
Robert L. Lewis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method employing laser ablating for providing a pattern on a substrate
Patent number
5,505,320
Issue date
Apr 9, 1996
International Business Machines Corporation
Francis C. Burns
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Variable thickness pads on a substrate surface
Publication number
20050023703
Publication date
Feb 3, 2005
Robert David Sebesta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure having flush circuit features and method of making
Publication number
20050020079
Publication date
Jan 27, 2005
International Business Machines Corporation
Ronald Clothier
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Structure having flush circuitry features and method of making
Publication number
20020177006
Publication date
Nov 28, 2002
International Business Machines Corporation
Ronald Clothier
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electronic package with high density interconnect layer
Publication number
20020085364
Publication date
Jul 4, 2002
Francis J. Downes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for compensating for distortion of a printed c...
Publication number
20020085188
Publication date
Jul 4, 2002
Richard Ronald Hall
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic package for electronic components and method of making same
Publication number
20020059723
Publication date
May 23, 2002
John S. Kresge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fine pitch circuitization with filled plated through holes
Publication number
20010050183
Publication date
Dec 13, 2001
Kenneth J. Lubert
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC