International Journal of Hybrid Microelectronics & Electronics Packaging, "Characteristics and Performance of PHP-92: AT&T's Triazine-Based Dielectric for Polyhic MCMs", E. Sweetman, vol. 15, No. 4, 4Q92, pp. 195-204. |
International Electronic Manufacturing Technology Symposium, "A Fine-Line Multilayer Substrate with Photo-Sensitive Polyimide Dielectric and Electroless Copper Plated Conductors", Ohsaka et al., No. 1987, Oct. 12, 1987, pp. 178-183. |
IEEE Transactions on Components, Hybrids and Manufacturing Technology, "Solder Connections with a Ni Barrier", Keller et al., vol. CHMT-9, No. 4, Dec. 1986, pp. 433-439. |