Robert Fehler

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 12,131,988
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a multi-branch switch node connector
- Patent number 12,009,290
- Issue date Jun 11, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry and method of forming a circuitry
- Patent number 11,935,874
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 11,848,262
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,304
- Issue date May 30, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space efficient and low parasitic half bridge
- Patent number 11,469,164
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,444,017
- Issue date Sep 13, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,348,861
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 10,811,342
- Issue date Oct 20, 2020
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20250087581
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedded Package with Shielding Pad
- Publication number 20240312799
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20240079310
- Publication date Mar 7, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR
- Publication number 20230253304
- Publication date Aug 10, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS
- Publication number 20220367350
- Publication date Nov 17, 2022
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20220262716
- Publication date Aug 18, 2022
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108945
- Publication date Apr 7, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitry and Method of Forming a Circuitry
- Publication number 20220028840
- Publication date Jan 27, 2022
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...
- Publication number 20210287964
- Publication date Sep 16, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space Efficient and Low Parasitic Half Bridge
- Publication number 20210225745
- Publication date Jul 22, 2021
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20210005536
- Publication date Jan 7, 2021
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20200075484
- Publication date Mar 5, 2020
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20190267309
- Publication date Aug 29, 2019
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
- Publication number 20180374769
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS

Robert Fehler

Person

Patents Grantslast 30 patents

Semiconductor devices including parallel electrically conductive la...

Semiconductor package with non-uniformly distributed vias

Semiconductor package and passive element with interposer

Semiconductor module having a multi-branch switch node connector

Circuitry and method of forming a circuitry

Semiconductor package and passive element with interposer

Semiconductor module

Space efficient and low parasitic half bridge

Semiconductor package and method of manufacturing a semiconductor p...

Semiconductor package and method of manufacturing a semiconductor p...

Electronic device including redistribution layer pad having a void

Semiconductor package and method of manufacturing a semiconductor p...

Patents Applicationslast 30 patents

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

Embedded Package with Shielding Pad

Semiconductor Package and Passive Element with Interposer

SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR

SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS

Semiconductor Package and Passive Element with Interposer

SEMICONDUCTOR MODULE

Circuitry and Method of Forming a Circuitry

SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...

Space Efficient and Low Parasitic Half Bridge

Semiconductor Package and Method of Manufacturing a Semiconductor P...

Semiconductor Package and Method of Manufacturing a Semiconductor P...

Semiconductor Package and Method of Manufacturing a Semiconductor P...

ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID