Robert Francis DARVEAUX

Person

Corona Del Mar, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with ball grid array and grounding pins for signal...
- Patent number 12,033,954
- Issue date Jul 9, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 12,009,343
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of packaging substrate deformation
- Patent number 11,974,390
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices related to dual-sided module with land-grid array (LGA) foo...
- Patent number 11,894,323
- Issue date Feb 6, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to nested filters
- Patent number 11,765,814
- Issue date Sep 19, 2023
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to reduced packaging substrate deformation
- Patent number 11,596,056
- Issue date Feb 28, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 11,545,405
- Issue date Jan 3, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module having a ball grid array with grounding shielding p...
- Patent number 11,233,014
- Issue date Jan 25, 2022
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
- Patent number 11,201,066
- Issue date Dec 14, 2021
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low frequency shield solutions with sputtered/sprayed absorber mate...
- Patent number 11,190,158
- Issue date Nov 30, 2021
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods related to dual-sided module with land-grid array (LGA) foo...
- Patent number 11,139,257
- Issue date Oct 5, 2021
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 11,127,690
- Issue date Sep 21, 2021
- Skyworks Solutions, Inc.
- Howard E. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a radio-frequency module with a conformal s...
- Patent number 11,069,978
- Issue date Jul 20, 2021
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus related to conformal coating implemented with surface mou...
- Patent number 10,980,106
- Issue date Apr 13, 2021
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under-fill deflash for a dual-sided ball grid array package
- Patent number 10,770,312
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making semiconductor devices
- Patent number 10,714,408
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 10,636,717
- Issue date Apr 28, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 10,607,944
- Issue date Mar 31, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill with a packaging substrate having an integrat...
- Patent number 10,593,565
- Issue date Mar 17, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number RE47890
- Issue date Mar 3, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
Information Patent Grant
Apparatus and methods related to conformal coating implemented with...
- Patent number 10,524,350
- Issue date Dec 31, 2019
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-sided module with land-grid array (LGA) footprint
- Patent number 10,497,656
- Issue date Dec 3, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of under-fill using an encapsulant for a dual-sided ball gr...
- Patent number 10,460,957
- Issue date Oct 29, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 10,418,318
- Issue date Sep 17, 2019
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using under-fill deflash for a dual-sided bal...
- Patent number 10,410,885
- Issue date Sep 10, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...
- Publication number 20240324095
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20240250045
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED FILTERS
- Publication number 20240090123
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED PACKAGED RADIO-FREQUENCY MODULE HAVING BALL GRID ARRAY E...
- Publication number 20230326841
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS
- Publication number 20230268247
- Publication date Aug 24, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING HEAT FROM UNGROUNDED ELECTRONIC COMPONENTS
- Publication number 20230269861
- Publication date Aug 24, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF PACKAGING SUBSTRATE DEFORMATION
- Publication number 20230262877
- Publication date Aug 17, 2023
- SKYWORKS SOLUTIONS, INC.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20220254730
- Publication date Aug 11, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20220189866
- Publication date Jun 16, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20220148984
- Publication date May 12, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
- Publication number 20220130686
- Publication date Apr 28, 2022
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...
- Publication number 20220115331
- Publication date Apr 14, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
- Publication number 20210399423
- Publication date Dec 23, 2021
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20210166992
- Publication date Jun 3, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SI...
- Publication number 20210143024
- Publication date May 13, 2021
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
- Publication number 20200365480
- Publication date Nov 19, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
- Publication number 20200321287
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20200227364
- Publication date Jul 16, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOU...
- Publication number 20200229298
- Publication date Jul 16, 2020
- SKYWORKS SOLUTIONS, INC.
- Anthony James LOBIANCO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MO...
- Publication number 20200161222
- Publication date May 21, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
- Publication number 20200152483
- Publication date May 14, 2020
- SKYWORKS SOLUTIONS, INC.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES RELATED TO REDUCED PACKAGING SUBSTRATE DEFORMATION
- Publication number 20200107433
- Publication date Apr 2, 2020
- SKYWORKS SOLUTIONS, INC.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW FREQUENCY SHIELD SOLUTIONS WITH SPUTTERED/SPRAYED ABSORBER MATE...
- Publication number 20200099356
- Publication date Mar 26, 2020
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-FILL DEFLASH FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE
- Publication number 20200075349
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO NESTED FILTERS
- Publication number 20200077510
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Robert Francis DARVEAUX
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20190371706
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULES WITH BALL GRI...
- Publication number 20190057929
- Publication date Feb 21, 2019
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Robert Francis DARVEAUX

Person

Patents Grantslast 30 patents

Fine pitch copper pillar package and method

Packaged module with ball grid array and grounding pins for signal...

Stackable package and method

Reduction of packaging substrate deformation

Devices and methods related to dual-sided radio-frequency package w...

Devices related to dual-sided module with land-grid array (LGA) foo...

Devices and methods related to nested filters

Methods and devices related to reduced packaging substrate deformation

Packaging for fingerprint sensors and methods of manufacture

Methods and structures for increasing the allowable die size in TMV...

Control of under-fill using a film during fabrication for a dual-si...

Packaged module having a ball grid array with grounding shielding p...

Control of under-fill using a dam on a packaging substrate for a du...

Low frequency shield solutions with sputtered/sprayed absorber mate...

Methods related to dual-sided module with land-grid array (LGA) foo...

Dual-sided radio-frequency package with overmold structure

Fine pitch copper pillar package and method

Method of manufacturing a radio-frequency module with a conformal s...

Apparatus related to conformal coating implemented with surface mou...

Under-fill deflash for a dual-sided ball grid array package

Semiconductor devices and methods of making semiconductor devices

Packaging for fingerprint sensors and methods of manufacture

Dual-sided radio-frequency package with overmold structure

Control of under-fill with a packaging substrate having an integrat...

Packaging for fingerprint sensors and methods of manufacture

Apparatus and methods related to conformal coating implemented with...

Dual-sided module with land-grid array (LGA) footprint

Control of under-fill using an encapsulant for a dual-sided ball gr...

Fine pitch copper pillar package and method

Control of under-fill using under-fill deflash for a dual-sided bal...

Patents Applicationslast 30 patents

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...

METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

NESTED FILTERS

DUAL-SIDED PACKAGED RADIO-FREQUENCY MODULE HAVING BALL GRID ARRAY E...

HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS

METHOD OF TRANSFERRING HEAT FROM UNGROUNDED ELECTRONIC COMPONENTS

REDUCTION OF PACKAGING SUBSTRATE DEFORMATION

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...

DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...

RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SI...

PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE

METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

APPARATUS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOU...

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MO...

CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...

METHODS AND DEVICES RELATED TO REDUCED PACKAGING SUBSTRATE DEFORMATION

LOW FREQUENCY SHIELD SOLUTIONS WITH SPUTTERED/SPRAYED ABSORBER MATE...

UNDER-FILL DEFLASH FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE

DEVICES AND METHODS RELATED TO NESTED FILTERS

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULES WITH BALL GRI...