Robert G. McKenna

Person

Houston, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive-sealed window lid for micromechanical devices
- Patent number 6,827,449
- Issue date Dec 7, 2004
- Texas Instruments Incorporated
- Homer B. Klonis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for stretching and processing saw film tape af...
- Patent number 6,685,073
- Issue date Feb 3, 2004
- Texas Instruments Incorporated
- Robert G. McKenna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adhering a wafer to wafer tape
- Patent number 6,471,806
- Issue date Oct 29, 2002
- Texas Instruments Incorporated
- Robert G. McKenna
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of breaking and separating a wafer into die using a multi-ra...
- Patent number 6,248,648
- Issue date Jun 19, 2001
- Texas Instruments Incorporated
- Robert G. McKenna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for breaking and separating a wafer into die u...
- Patent number 6,184,063
- Issue date Feb 6, 2001
- Texas Instruments Incorporated
- Robert G. McKenna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adhering a wafer to a wafer tape
- Patent number 6,129,811
- Issue date Oct 10, 2000
- Texas Instruments Incorporated
- Robert G. McKenna
- B32 - LAYERED PRODUCTS
Information Patent Grant
Gasket sealed integrated circuit package
- Patent number 6,028,351
- Issue date Feb 22, 2000
- Texas Instruments Incorporated
- Homer B. Klonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noncontact method of adhering a wafer to a wafer tape
- Patent number 6,007,654
- Issue date Dec 28, 1999
- Texas Instruments Incorporated
- Robert G. McKenna
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Separation of wafer into die with wafer-level processing
- Patent number 5,597,767
- Issue date Jan 28, 1997
- Texas Instruments Incorporated
- Michael A. Mignardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Baffled collet for vacuum pick-up of a semiconductor die
- Patent number 5,516,125
- Issue date May 14, 1996
- Texas Instruments Incorporated
- Robert G. McKenna
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Leveling block for semiconductor demounter
- Patent number 5,482,899
- Issue date Jan 9, 1996
- Texas Instruments Incorporated
- Robert G. McKenna
- B28 - WORKING CEMENT, CLAY, OR STONE

Robert G. McKenna

Person

Patents Grantslast 30 patents

Adhesive-sealed window lid for micromechanical devices

Method and apparatus for stretching and processing saw film tape af...

Method of adhering a wafer to wafer tape

Method of breaking and separating a wafer into die using a multi-ra...

Method and apparatus for breaking and separating a wafer into die u...

Method of adhering a wafer to a wafer tape

Gasket sealed integrated circuit package

Noncontact method of adhering a wafer to a wafer tape

Separation of wafer into die with wafer-level processing

Baffled collet for vacuum pick-up of a semiconductor die

Leveling block for semiconductor demounter