Robert K. Lowry

Person

Melbourne Beach, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser decapsulation method
- Patent number 7,316,936
- Issue date Jan 8, 2008
- Intersil Americans Inc.
- Robert K. Lowry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser decapsulation apparatus and method
- Patent number 7,166,186
- Issue date Jan 23, 2007
- Intersil Americas Inc.
- Robert K. Lowry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded wafer with metal silicidation
- Patent number 6,909,146
- Issue date Jun 21, 2005
- Intersil Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decapsulating method and apparatus for integrated circuit packages
- Patent number 6,457,506
- Issue date Oct 1, 2002
- Intersil Americas Inc.
- Robert K. Lowry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser decapsulation method
- Patent number 6,335,208
- Issue date Jan 1, 2002
- Intersil Americas Inc.
- Robert K. Lowry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation hardened dielectric for EEPROM
- Patent number 6,130,172
- Issue date Oct 10, 2000
- Intersil Corporation
- Robert T. Fuller
- G11 - INFORMATION STORAGE
Information Patent Grant
Decapsulating method and apparatus for integrated circuit packages
- Patent number 6,054,012
- Issue date Apr 25, 2000
- Intersil Corporation
- Robert K. Lowry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing with oxidative bonding
- Patent number 5,849,627
- Issue date Dec 15, 1998
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened dielectric for EEPROM
- Patent number 5,808,353
- Issue date Sep 15, 1998
- Harris Corporation
- Robert T. Fuller
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded wafer processing
- Patent number 5,728,624
- Issue date Mar 17, 1998
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing with metal silicidation
- Patent number 5,569,620
- Issue date Oct 29, 1996
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,517,047
- Issue date May 14, 1996
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing with metal silicidation
- Patent number 5,387,555
- Issue date Feb 7, 1995
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,362,667
- Issue date Nov 8, 1994
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and means for measuring moisture content of hermetic semicon...
- Patent number 4,272,986
- Issue date Jun 16, 1981
- Harris Corporation
- Robert K. Lowry
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LASER DECAPSULATION APPARATUS AND METHOD
- Publication number 20070111337
- Publication date May 17, 2007
- Robert K. Lowry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser decapsulation apparatus and method
- Publication number 20020025600
- Publication date Feb 28, 2002
- HARRIS CORPORATION
- Robert K. Lowry
- H01 - BASIC ELECTRIC ELEMENTS

Robert K. Lowry

Person

Patents Grantslast 30 patents

Laser decapsulation method

Laser decapsulation apparatus and method

Bonded wafer with metal silicidation

Decapsulating method and apparatus for integrated circuit packages

Laser decapsulation method

Radiation hardened dielectric for EEPROM

Decapsulating method and apparatus for integrated circuit packages

Bonded wafer processing with oxidative bonding

Radiation hardened dielectric for EEPROM

Bonded wafer processing

Bonded wafer processing with metal silicidation

Bonded wafer processing

Bonded wafer processing with metal silicidation

Bonded wafer processing

Method and means for measuring moisture content of hermetic semicon...

Patents Applicationslast 30 patents

LASER DECAPSULATION APPARATUS AND METHOD

Laser decapsulation apparatus and method