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Robert M. Nickerson
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,798,932
Issue date
Oct 24, 2023
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through mold interconnect drill feature
Patent number
11,705,383
Issue date
Jul 18, 2023
Intel Corporation
Robert M. Nickerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-trenching mold interface in a pop package
Patent number
11,462,527
Issue date
Oct 4, 2022
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin, hyper-density semiconductor packages
Patent number
11,430,724
Issue date
Aug 30, 2022
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally coupled package-on-package semiconductor packages
Patent number
11,222,877
Issue date
Jan 11, 2022
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package thermal transfer systems and methods
Patent number
11,056,466
Issue date
Jul 6, 2021
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
10,607,976
Issue date
Mar 31, 2020
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
10,446,530
Issue date
Oct 15, 2019
Intel Corporation
Russell K. Mortensen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package on package thermal transfer systems and methods
Patent number
10,438,930
Issue date
Oct 8, 2019
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming trenches in packages structures and structures f...
Patent number
10,231,338
Issue date
Mar 12, 2019
Intel Corporation
Naga Sivakumar Yagnamurthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures with polymer core
Patent number
10,128,225
Issue date
Nov 13, 2018
Intel Corporation
Sandeep Razdan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture material and process to improve thermal performance of...
Patent number
10,121,722
Issue date
Nov 6, 2018
Intel Corporation
Chandra M. Jha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad-less interconnect for electrical coreless substrate
Patent number
9,691,727
Issue date
Jun 27, 2017
Intel Corporation
Javier Soto Gonzalez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BBUL top side substrate layer enabling dual sided silicon interconn...
Patent number
9,691,728
Issue date
Jun 27, 2017
Intel Corporation
Robert M. Nickerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for solder for through-mold interconnect
Patent number
9,666,549
Issue date
May 30, 2017
Intel Corporation
Chia-Pin Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures with polymer core
Patent number
9,613,934
Issue date
Apr 4, 2017
Intel Corporation
Sandeep Razdan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with multiple dice
Patent number
9,177,911
Issue date
Nov 3, 2015
Intel Corporation
Robert Nickerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tall solders for through-mold interconnect
Patent number
9,159,690
Issue date
Oct 13, 2015
Intel Corporation
Chia-Pin Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processes of making pad-less interconnect for electrical coreless s...
Patent number
9,049,807
Issue date
Jun 2, 2015
Intel Corporation
Javier Soto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnect structures with polymer core
Patent number
8,987,918
Issue date
Mar 24, 2015
Intel Corporation
Sandeep Razdan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with multiple dice
Patent number
8,742,597
Issue date
Jun 3, 2014
Intel Corporation
Robert Nickerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package and method of manufacturing same
Patent number
8,674,519
Issue date
Mar 18, 2014
Intel Corporation
Leonel R. Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package interconnect stiffener
Patent number
8,513,792
Issue date
Aug 20, 2013
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of interconnecting workpieces
Patent number
7,971,347
Issue date
Jul 5, 2011
Intel Corporation
Leonel Arana
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit device mounting with folded substrate and interp...
Patent number
7,818,878
Issue date
Oct 26, 2010
Intel Corporation
Robert M. Nickerson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for trace shielding and routing on a substrate
Patent number
7,375,978
Issue date
May 20, 2008
Intel Corporation
John Conner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Folded substrate with interposer package for integrated circuit dev...
Patent number
7,358,444
Issue date
Apr 15, 2008
Intel Corporation
Robert M. Nickerson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power distribution within a folded flex package method and apparatus
Patent number
7,304,373
Issue date
Dec 4, 2007
Intel Corporation
Brian Taggart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond finger on via substrate, process of making same, package made...
Patent number
7,302,756
Issue date
Dec 4, 2007
Intel Corporation
Brian Taggart
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240128152
Publication date
Apr 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
Publication number
20240128253
Publication date
Apr 18, 2024
Intel Corporation
Denis MYASISHCHEV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20240030116
Publication date
Jan 25, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240021493
Publication date
Jan 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
Publication number
20240021500
Publication date
Jan 18, 2024
Intel Corporation
Robert M. NICKERSON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240014097
Publication date
Jan 11, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20240006401
Publication date
Jan 4, 2024
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
Publication number
20230290708
Publication date
Sep 14, 2023
Intel Corporation
Robert M. NICKERSON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20230138543
Publication date
May 4, 2023
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20220344318
Publication date
Oct 27, 2022
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20220344247
Publication date
Oct 27, 2022
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20220157799
Publication date
May 19, 2022
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20210066155
Publication date
Mar 4, 2021
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
Publication number
20210066167
Publication date
Mar 4, 2021
Intel Corporation
Robert M. NICKERSON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
Publication number
20210066273
Publication date
Mar 4, 2021
Intel Corporation
Denis MYASISHCHEV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20200273784
Publication date
Aug 27, 2020
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20200251462
Publication date
Aug 6, 2020
Intel Corporation
Russell Mortensen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE
Publication number
20200035658
Publication date
Jan 30, 2020
Intel Corporation
Kumar Abhishek SINGH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS
Publication number
20190385983
Publication date
Dec 19, 2019
Intel Corporation
OMKAR KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR
Publication number
20190103385
Publication date
Apr 4, 2019
Intel Corporation
OMKAR KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE ARCHITECTURE FOR SOLDER JOINT RELIABILTY IN MICROELECTRON...
Publication number
20190104610
Publication date
Apr 4, 2019
Intel Corporation
Robert Nickerson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS
Publication number
20190006319
Publication date
Jan 3, 2019
Intel Corporation
OMKAR KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
Publication number
20170229438
Publication date
Aug 10, 2017
Intel Corporation
Sandeep Razdan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES F...
Publication number
20160381800
Publication date
Dec 29, 2016
Intel Corporation
Naga Sivakumar Yagnamurthy
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20160218093
Publication date
Jul 28, 2016
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20160133557
Publication date
May 12, 2016
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT
Publication number
20160043049
Publication date
Feb 11, 2016
Intel Corporation
Chia-Pin Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSES OF MAKING PAD-LESS INTERCONNECT FOR ELECTRICAL CORELESS S...
Publication number
20150221608
Publication date
Aug 6, 2015
Intel Corporation
Javier SOTO GONZALEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BBUL TOP SIDE SUBSTRATE LAYER ENABLING DUAL SIDED SILICON INTERCONN...
Publication number
20150171044
Publication date
Jun 18, 2015
Intel Corporation
Robert M. NICKERSON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
Publication number
20150162313
Publication date
Jun 11, 2015
Intel Corporation
Sandeep Razdan
H01 - BASIC ELECTRIC ELEMENTS