Robert Montgomery

Person

Marshfield, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin semiconductor component fabrication using a dielectric s...
- Patent number 10,818,613
- Issue date Oct 27, 2020
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin semiconductor component fabrication using a dielectric s...
- Patent number 10,290,588
- Issue date May 14, 2019
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with a double metal contact and related...
- Patent number 9,761,550
- Issue date Sep 12, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with a double metal contact
- Patent number 9,318,355
- Issue date Apr 19, 2016
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of electronic circuitry
- Patent number 9,076,779
- Issue date Jul 7, 2015
- International Rectifier Corporation
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of electronic circuitry
- Patent number 9,000,512
- Issue date Apr 7, 2015
- International Rectifier Corporation
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with reduced thickness variation and method for...
- Patent number 8,987,898
- Issue date Mar 24, 2015
- International Rectifier Corporation
- Rupert Burbidge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a double metal contact
- Patent number 8,791,525
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peelable tape carrier
- Patent number 8,173,245
- Issue date May 8, 2012
- International Rectifier Corporation
- Robert Montgomery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer singulation process
- Patent number 8,153,464
- Issue date Apr 10, 2012
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench MOSFET with deposited oxide
- Patent number 8,106,446
- Issue date Jan 31, 2012
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation to selectively thin wafers/die to lower device RDSON
- Patent number 7,851,361
- Issue date Dec 14, 2010
- International Rectifier Corporation
- Hugo R. G. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package that includes stacked semiconductor die
- Patent number 7,615,854
- Issue date Nov 10, 2009
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split electrode gate trench power device
- Patent number 7,423,317
- Issue date Sep 9, 2008
- International Rectifier Corporation
- Hugo R. G. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET fabrication using inside/outside spacers
- Patent number 7,390,717
- Issue date Jun 24, 2008
- International Rectifier Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a trench MOSFET with deposited oxide
- Patent number 7,371,641
- Issue date May 13, 2008
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET with reduced gate resistance
- Patent number 7,368,353
- Issue date May 6, 2008
- International Rectifier Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...
- Publication number 20190229072
- Publication date Jul 25, 2019
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...
- Publication number 20170069578
- Publication date Mar 9, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact and Related...
- Publication number 20160233185
- Publication date Aug 11, 2016
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact
- Publication number 20140327057
- Publication date Nov 6, 2014
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer with Reduced Thickness Variation and Method for...
- Publication number 20120306072
- Publication date Dec 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Rupert Burbidge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT
- Publication number 20090212435
- Publication date Aug 27, 2009
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench MOSFET with deposited oxide
- Publication number 20080185642
- Publication date Aug 7, 2008
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser ablation to selectively thin wafers/die to lower device RDSON
- Publication number 20070210407
- Publication date Sep 13, 2007
- Hugo R.G. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package that includes stacked semiconductor die
- Publication number 20070108575
- Publication date May 17, 2007
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer singulation process
- Publication number 20070087524
- Publication date Apr 19, 2007
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split electrode gate trench power device
- Publication number 20070023829
- Publication date Feb 1, 2007
- Hugo R.G. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peelable tape carrier
- Publication number 20060275585
- Publication date Dec 7, 2006
- Robert Montgomery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Trench MOSFET with deposited oxide
- Publication number 20060091456
- Publication date May 4, 2006
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench power MOSFET fabrication using inside/outside spacers
- Publication number 20050208724
- Publication date Sep 22, 2005
- International Rectifier Corp.
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench power MOSFET with reduced gate resistance
- Publication number 20050112823
- Publication date May 26, 2005
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS

Robert Montgomery

Person

Patents Grantslast 30 patents

Ultra-thin semiconductor component fabrication using a dielectric s...

Ultra-thin semiconductor component fabrication using a dielectric s...

Power semiconductor device with a double metal contact and related...

Power semiconductor device with a double metal contact

Packaging of electronic circuitry

Packaging of electronic circuitry

Semiconductor wafer with reduced thickness variation and method for...

Power semiconductor device including a double metal contact

Peelable tape carrier

Wafer singulation process

Trench MOSFET with deposited oxide

Laser ablation to selectively thin wafers/die to lower device RDSON

Semiconductor package that includes stacked semiconductor die

Split electrode gate trench power device

Trench power MOSFET fabrication using inside/outside spacers

Method of making a trench MOSFET with deposited oxide

Trench power MOSFET with reduced gate resistance

Patents Applicationslast 30 patents

Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...

Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...

Power Semiconductor Device with a Double Metal Contact and Related...

Power Semiconductor Device with a Double Metal Contact

Semiconductor Wafer with Reduced Thickness Variation and Method for...

POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT

Trench MOSFET with deposited oxide

Laser ablation to selectively thin wafers/die to lower device RDSON

Semiconductor package that includes stacked semiconductor die

Wafer singulation process

Split electrode gate trench power device

Peelable tape carrier

Trench MOSFET with deposited oxide

Trench power MOSFET fabrication using inside/outside spacers

Trench power MOSFET with reduced gate resistance