Robert O. Conn

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Accelerator having acceleration channels formed between covalently...
- Patent number 8,742,700
- Issue date Jun 3, 2014
- Transmute, Inc.
- Kim L. Hailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accelerator having acceleration channels formed between covalently...
- Patent number 8,680,792
- Issue date Mar 25, 2014
- Transmute, Inc.
- Kim L. Hailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In system reflow of low temperature eutectic bond balls
- Patent number 8,671,560
- Issue date Mar 18, 2014
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accelerator having a multi-channel micro-collimator
- Patent number 8,648,315
- Issue date Feb 11, 2014
- Transmute, Inc.
- Kim L. Hailey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Accelerator on a chip having a grid and plate cell
- Patent number 8,564,225
- Issue date Oct 22, 2013
- Transmute, Inc.
- Kim L. Hailey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Accelerator on a chip having a cold ion source
- Patent number 8,541,757
- Issue date Sep 24, 2013
- Transmute, Inc.
- Kim L. Hailey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Through-substrate via having a strip-shaped through-hole signal con...
- Patent number 8,541,884
- Issue date Sep 24, 2013
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accelerator having acceleration channels formed between covalently...
- Patent number 8,519,644
- Issue date Aug 27, 2013
- Transmute, Inc.
- Kim L. Hailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preventing breakage of long metal signal conductors on semiconducto...
- Patent number 8,404,585
- Issue date Mar 26, 2013
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated semiconductor substrate structure using incompatible pro...
- Patent number 8,222,086
- Issue date Jul 17, 2012
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral metal structure with conductive post portions
- Patent number 8,129,834
- Issue date Mar 6, 2012
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disabling unused/inactive resources in an integrated circuit for st...
- Patent number 8,099,691
- Issue date Jan 17, 2012
- Xilinx, Inc.
- Tim Tuan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interposer for redistributing signals
- Patent number 8,062,968
- Issue date Nov 22, 2011
- Xilinx, Inc.
- Robert O. Conn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Large substrate structural vias
- Patent number 8,008,134
- Issue date Aug 30, 2011
- Research Triangle Institute
- Robert O. Conn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Preventing breakage of long metal signal conductors on semiconducto...
- Patent number 7,999,388
- Issue date Aug 16, 2011
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-layer signal conductor
- Patent number 7,978,029
- Issue date Jul 12, 2011
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor substrate structure using incompatible pro...
- Patent number 7,944,041
- Issue date May 17, 2011
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate elastomeric stack
- Patent number 7,829,994
- Issue date Nov 9, 2010
- siXis, Inc.
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Local defect memories on semiconductor substrates in a stack computer
- Patent number 7,831,874
- Issue date Nov 9, 2010
- siXis, Inc.
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Comb-shaped power bus bar assembly structure having integrated capa...
- Patent number 7,764,498
- Issue date Jul 27, 2010
- siXis, Inc.
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable self-aligning insulative guide tray for holding semicondu...
- Patent number 7,719,844
- Issue date May 18, 2010
- siXis, Inc.
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Large substrate structural vias
- Patent number 7,709,966
- Issue date May 4, 2010
- siXis, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package having thermal expansion posts
- Patent number 7,667,473
- Issue date Feb 23, 2010
- Xilinx, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and mechanism for controlling power consumption of an integr...
- Patent number 7,581,124
- Issue date Aug 25, 2009
- Xilinx, Inc.
- Neil G. Jacobson
- G11 - INFORMATION STORAGE
Information Patent Grant
Interposing structure
- Patent number 7,566,960
- Issue date Jul 28, 2009
- Xilinx, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disabling unused/inactive resources in programmable logic devices f...
- Patent number 7,562,332
- Issue date Jul 14, 2009
- Xilinx, Inc.
- Tim Tuan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tuning programmable logic devices for low-power design implementation
- Patent number 7,549,139
- Issue date Jun 16, 2009
- Xilinx, Inc.
- Tim Tuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Regulating unused/inactive resources in programmable logic devices...
- Patent number 7,504,854
- Issue date Mar 17, 2009
- Xilinx, Inc.
- Kevin T. Look
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-heating mechanism for duplicating microbump failure conditions...
- Patent number 7,362,121
- Issue date Apr 22, 2008
- Xilinx, Inc.
- Robert O. Conn
- G01 - MEASURING TESTING
Information Patent Grant
Remote field upgrading of programmable logic device configuration d...
- Patent number 7,269,724
- Issue date Sep 11, 2007
- Xilinx, Inc.
- Stephen M. Trimberger
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Accelerator Having Acceleration Channels Formed Between Covalently...
- Publication number 20140049193
- Publication date Feb 20, 2014
- Transmute, Inc.
- Kim L. Hailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Con...
- Publication number 20130009322
- Publication date Jan 10, 2013
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing breakage of long metal signal conductors on semiconducto...
- Publication number 20110266034
- Publication date Nov 3, 2011
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
In system reflow of low temperature eutectic bond balls
- Publication number 20110239456
- Publication date Oct 6, 2011
- siXis, Inc.
- Robert O. Conn
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated semiconductor substrate structure using incompatible pro...
- Publication number 20110183469
- Publication date Jul 28, 2011
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple-layer signal conductor
- Publication number 20100283559
- Publication date Nov 11, 2010
- siXis, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Large substrate structural vias
- Publication number 20100200540
- Publication date Aug 12, 2010
- siXis, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integral metal structure with conductive post portions
- Publication number 20100187665
- Publication date Jul 29, 2010
- siXis, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-substrate power-conducting via with embedded capacitance
- Publication number 20090267183
- Publication date Oct 29, 2009
- Research Triangle Institute
- Dorota Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable self-aligning insulative guide tray for holding semicondu...
- Publication number 20090080152
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Comb-shaped power bus bar assembly structure having integrated capa...
- Publication number 20090080158
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LARGE SUBSTRATE STRUCTURAL VIAS
- Publication number 20090079056
- Publication date Mar 26, 2009
- RTI International
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated semiconductor substrate structure using incompatible pro...
- Publication number 20090079059
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Preventing breakage of long metal signal conductors on semiconducto...
- Publication number 20090079084
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Local defect memories on semiconductor substrates in a stack computer
- Publication number 20090079463
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor substrate elastomeric stack
- Publication number 20090079058
- Publication date Mar 26, 2009
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit with interface tile for coupling to a stacked-di...
- Publication number 20040268286
- Publication date Dec 30, 2004
- Xilinx, Inc.
- Bernard J. New
- H03 - BASIC ELECTRONIC CIRCUITRY

Robert O. Conn

Person

Patents Grantslast 30 patents

Accelerator having acceleration channels formed between covalently...

Accelerator having acceleration channels formed between covalently...

In system reflow of low temperature eutectic bond balls

Accelerator having a multi-channel micro-collimator

Accelerator on a chip having a grid and plate cell

Accelerator on a chip having a cold ion source

Through-substrate via having a strip-shaped through-hole signal con...

Accelerator having acceleration channels formed between covalently...

Preventing breakage of long metal signal conductors on semiconducto...

Integrated semiconductor substrate structure using incompatible pro...

Integral metal structure with conductive post portions

Disabling unused/inactive resources in an integrated circuit for st...

Interposer for redistributing signals

Large substrate structural vias

Preventing breakage of long metal signal conductors on semiconducto...

Multiple-layer signal conductor

Integrated semiconductor substrate structure using incompatible pro...

Semiconductor substrate elastomeric stack

Local defect memories on semiconductor substrates in a stack computer

Comb-shaped power bus bar assembly structure having integrated capa...

Stackable self-aligning insulative guide tray for holding semicondu...

Large substrate structural vias

Flip-chip package having thermal expansion posts

Method and mechanism for controlling power consumption of an integr...

Interposing structure

Disabling unused/inactive resources in programmable logic devices f...

Tuning programmable logic devices for low-power design implementation

Regulating unused/inactive resources in programmable logic devices...

Self-heating mechanism for duplicating microbump failure conditions...

Remote field upgrading of programmable logic device configuration d...

Patents Applicationslast 30 patents

In System Reflow of Low Temperature Eutectic Bond Balls

Accelerator Having Acceleration Channels Formed Between Covalently...

Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Con...

Preventing breakage of long metal signal conductors on semiconducto...

In system reflow of low temperature eutectic bond balls

Integrated semiconductor substrate structure using incompatible pro...

Multiple-layer signal conductor

Large substrate structural vias

Integral metal structure with conductive post portions

Through-substrate power-conducting via with embedded capacitance

Stackable self-aligning insulative guide tray for holding semicondu...

Comb-shaped power bus bar assembly structure having integrated capa...

LARGE SUBSTRATE STRUCTURAL VIAS

Integrated semiconductor substrate structure using incompatible pro...

Preventing breakage of long metal signal conductors on semiconducto...

Local defect memories on semiconductor substrates in a stack computer

Semiconductor substrate elastomeric stack

Integrated circuit with interface tile for coupling to a stacked-di...