Robert Paul Mikulka

Person

Oceanside, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two-dimensional structure to form an embedded three-dimensional str...
- Patent number 10,490,348
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying thickness inductor
- Patent number 10,354,795
- Issue date Jul 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an embedded inductor and a thin film magnetic...
- Patent number 10,290,414
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable matching network
- Patent number 10,187,031
- Issue date Jan 22, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
RF multiplexer with integrated directional couplers
- Patent number 10,171,112
- Issue date Jan 1, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Double-sided circuit
- Patent number 10,103,703
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) ball support using cavity structure
- Patent number 10,074,625
- Issue date Sep 11, 2018
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of acoustic resonator devices
- Patent number 10,069,474
- Issue date Sep 4, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Augmented capacitor structure for high quality (Q)-factor radio fre...
- Patent number 9,966,426
- Issue date May 8, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with a dielectric between a via and a plate of the capacitor
- Patent number 9,935,166
- Issue date Apr 3, 2018
- QUALCOMM Incorporated
- Je-Hsiung Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Frequency multiplexer
- Patent number 9,906,318
- Issue date Feb 27, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
LC filter layer stacking by layer transfer to make 3D multiplexer s...
- Patent number 9,876,513
- Issue date Jan 23, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,813,043
- Issue date Nov 7, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Superposed structure 3D orthogonal through substrate inductor
- Patent number 9,666,362
- Issue date May 30, 2017
- QUALCOMM Incorporated
- David Francis Berdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varactor device with backside contact
- Patent number 9,660,110
- Issue date May 23, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,634,640
- Issue date Apr 25, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Face-up substrate integration with solder ball connection in semico...
- Patent number 9,468,098
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Varying thickness inductor
- Patent number 9,449,753
- Issue date Sep 20, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pass filters and low pass filters using through glass via tech...
- Patent number 9,425,761
- Issue date Aug 23, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,401,689
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thick conductive stack plating process with fine critical dimension...
- Patent number 9,343,399
- Issue date May 17, 2016
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress mitigation structure for wafer warpage reduction
- Patent number 9,343,403
- Issue date May 17, 2016
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,331,665
- Issue date May 3, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite dilation mode resonators
- Patent number 9,331,666
- Issue date May 3, 2016
- QUALCOMM MEMS Technologies, Inc.
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Superposed structure 3D orthogonal through substrate inductor
- Patent number 9,275,786
- Issue date Mar 1, 2016
- QUALCOMM Incorporated
- David Francis Berdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for reducing magnetic coupling in integrated circuits (ICS)...
- Patent number 9,264,013
- Issue date Feb 16, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die package comprising die-to-wire connector and a wire-to-die conn...
- Patent number 9,202,789
- Issue date Dec 1, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diplexer design using through glass via technology
- Patent number 9,203,373
- Issue date Dec 1, 2015
- QUALCOMM Incorporated
- Chengjie Zuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact 3-D coplanar transmission lines
- Patent number 9,136,574
- Issue date Sep 15, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Complex passive design with special via implementation
- Patent number 9,001,031
- Issue date Apr 7, 2015
- QUALCOMM MEMS Technologies, Inc.
- Chi Shun Lo
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...
- Publication number 20170372831
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Mario Francisco VELEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED CIRCUIT
- Publication number 20170338788
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUNABLE MATCHING NETWORK
- Publication number 20170331445
- Publication date Nov 16, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...
- Publication number 20170288707
- Publication date Oct 5, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS
- Publication number 20170279469
- Publication date Sep 28, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC RESONATOR DEVICES
- Publication number 20170141756
- Publication date May 18, 2017
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGE (WLP) BALL SUPPORT USING CAVITY STRUCTURE
- Publication number 20170084565
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Mario Francisco VELEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUGMENTED CAPACITOR STRUCTURE FOR HIGH QUALITY (Q)-FACTOR RADIO FRE...
- Publication number 20170077214
- Publication date Mar 16, 2017
- QUALCOMM Incorporated
- Niranjan Sunil MUDAKATTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING AN EMBEDDED INDUCTOR AND A THIN FILM MAGNETIC...
- Publication number 20170062120
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICO...
- Publication number 20160381809
- Publication date Dec 29, 2016
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARYING THICKNESS INDUCTOR
- Publication number 20160358709
- Publication date Dec 8, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20160204758
- Publication date Jul 14, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO RED...
- Publication number 20160181233
- Publication date Jun 23, 2016
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR
- Publication number 20160163450
- Publication date Jun 9, 2016
- QUALCOMM Incorporated
- David Francis BERDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARACTOR DEVICE WITH BACKSIDE CONTACT
- Publication number 20160093750
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR
- Publication number 20160020013
- Publication date Jan 21, 2016
- QUALCOMM Incorporated
- David Francis BERDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREQUENCY MULTIPLEXER
- Publication number 20150304059
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Chengjie Zuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONN...
- Publication number 20150303148
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION STRUCTURE FOR WAFER WARPAGE REDUCTION
- Publication number 20150287677
- Publication date Oct 8, 2015
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICO...
- Publication number 20150271920
- Publication date Sep 24, 2015
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING THICKNESS INDUCTOR
- Publication number 20150061813
- Publication date Mar 5, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE THAT INCLUDES CONDUCTIVE VIA AND METAL LAYER
- Publication number 20150035162
- Publication date Feb 5, 2015
- QUALCOMM Incorporated
- Je-Hsiung Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THICK CONDUCTIVE STACK PLATING PROCESS WITH FINE CRITICAL DIMENSION...
- Publication number 20150014812
- Publication date Jan 15, 2015
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT 3-D COPLANAR TRANSMISSION LINES
- Publication number 20140361854
- Publication date Dec 11, 2014
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR REDUCING MAGNETIC COUPLING IN INTEGRATED CIRCUITS (ICS)...
- Publication number 20140354372
- Publication date Dec 4, 2014
- QUALCOMM Incorporated
- Chengjie Zuo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
DESIGN FOR HIGH PASS FILTERS AND LOW PASS FILTERS USING THROUGH GLA...
- Publication number 20140354378
- Publication date Dec 4, 2014
- QUALCOMM Incorporated
- Chengjie ZUO
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ELECTRONIC DEVICE HAVING ASYMMETRICAL THROUGH GLASS VIAS
- Publication number 20140327510
- Publication date Nov 6, 2014
- QUALCOMM Incorporated
- Daeik D. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR TUNABLE BY A VARIABLE MAGNETIC FLUX DENSITY COMPONENT
- Publication number 20140327508
- Publication date Nov 6, 2014
- QUALCOMM Incorporated
- Daeik D. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20140327496
- Publication date Nov 6, 2014
- QUALCOMM Incorporated
- Chengjie Zuo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPAC...
- Publication number 20140268616
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Je-Hsiung Lan
- G06 - COMPUTING CALCULATING COUNTING

Robert Paul Mikulka

Person

Patents Grantslast 30 patents

Two-dimensional structure to form an embedded three-dimensional str...

Varying thickness inductor

Substrate comprising an embedded inductor and a thin film magnetic...

Tunable matching network

RF multiplexer with integrated directional couplers

Double-sided circuit

Wafer level package (WLP) ball support using cavity structure

Encapsulation of acoustic resonator devices

Augmented capacitor structure for high quality (Q)-factor radio fre...

Capacitor with a dielectric between a via and a plate of the capacitor

Frequency multiplexer

LC filter layer stacking by layer transfer to make 3D multiplexer s...

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Superposed structure 3D orthogonal through substrate inductor

Varactor device with backside contact

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Face-up substrate integration with solder ball connection in semico...

Varying thickness inductor

High pass filters and low pass filters using through glass via tech...

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Thick conductive stack plating process with fine critical dimension...

Stress mitigation structure for wafer warpage reduction

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Composite dilation mode resonators

Superposed structure 3D orthogonal through substrate inductor

Systems for reducing magnetic coupling in integrated circuits (ICS)...

Die package comprising die-to-wire connector and a wire-to-die conn...

Diplexer design using through glass via technology

Compact 3-D coplanar transmission lines

Complex passive design with special via implementation

Patents Applicationslast 30 patents

TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...

DOUBLE-SIDED CIRCUIT

TUNABLE MATCHING NETWORK

LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...

RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS

ACOUSTIC RESONATOR DEVICES

WAFER LEVEL PACKAGE (WLP) BALL SUPPORT USING CAVITY STRUCTURE

AUGMENTED CAPACITOR STRUCTURE FOR HIGH QUALITY (Q)-FACTOR RADIO FRE...

SUBSTRATE COMPRISING AN EMBEDDED INDUCTOR AND A THIN FILM MAGNETIC...

FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICO...

VARYING THICKNESS INDUCTOR

TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO RED...

SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR

VARACTOR DEVICE WITH BACKSIDE CONTACT

SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR

FREQUENCY MULTIPLEXER

DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONN...

STRESS MITIGATION STRUCTURE FOR WAFER WARPAGE REDUCTION

FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICO...

VARYING THICKNESS INDUCTOR

INDUCTIVE DEVICE THAT INCLUDES CONDUCTIVE VIA AND METAL LAYER

THICK CONDUCTIVE STACK PLATING PROCESS WITH FINE CRITICAL DIMENSION...

COMPACT 3-D COPLANAR TRANSMISSION LINES

SYSTEMS FOR REDUCING MAGNETIC COUPLING IN INTEGRATED CIRCUITS (ICS)...

DESIGN FOR HIGH PASS FILTERS AND LOW PASS FILTERS USING THROUGH GLA...

ELECTRONIC DEVICE HAVING ASYMMETRICAL THROUGH GLASS VIAS

INDUCTOR TUNABLE BY A VARIABLE MAGNETIC FLUX DENSITY COMPONENT

TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPAC...