Robert Rosenberg

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capped copper interconnect
- Patent number 7,495,338
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of copper w...
- Patent number 7,468,320
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin, single phase, diffusion barrier for metal conductors
- Patent number 7,172,968
- Issue date Feb 6, 2007
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper conductor
- Patent number 7,119,018
- Issue date Oct 10, 2006
- International Buisness Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a porous dielectric material layer in a semicond...
- Patent number 6,831,364
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Timothy Joseph Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming copper structures
- Patent number 6,812,143
- Issue date Nov 2, 2004
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier material for copper structures
- Patent number 6,787,912
- Issue date Sep 7, 2004
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL decoupling capacitor
- Patent number 6,777,809
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL decoupling capacitor
- Patent number 6,525,427
- Issue date Feb 25, 2003
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with Ti-containing liners
- Patent number 6,503,641
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ultra thin, single phase, diffusion barrier for metal conductors
- Patent number 6,452,276
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a porous dielectric material layer in a semicond...
- Patent number 6,451,712
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Timothy Joseph Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing metal interconnections and product produced t...
- Patent number 6,417,572
- Issue date Jul 9, 2002
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of Cu wires...
- Patent number 6,342,733
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ferrite laminate magnet
- Patent number 6,264,885
- Issue date Jul 24, 2001
- International Business Machines Corporation
- John Ulrich Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ferrite laminate magnet
- Patent number 5,986,395
- Issue date Nov 16, 1999
- International Business Machines Corporation
- John Ulrich Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming perforated metal/ferrite laminated magnet
- Patent number 5,857,883
- Issue date Jan 12, 1999
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of defect free silicon on an insulating substrate
- Patent number 5,540,785
- Issue date Jul 30, 1996
- International Business Machines Corporation
- Robert H. Dennard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating defect-free silicon on an insulating substrate
- Patent number 5,462,883
- Issue date Oct 31, 1995
- International Business Machines Corporation
- Robert H. Dennard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow base transistor and method of fabricating same
- Patent number 5,132,765
- Issue date Jul 21, 1992
- Jeffrey L. Blouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a narrow base transistor
- Patent number 5,008,207
- Issue date Apr 16, 1991
- International Business Machines Corporation
- Jeffrey L. Blouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon/carbon protection of metallic magnetic structures
- Patent number 4,647,494
- Issue date Mar 3, 1987
- International Business Machines Corporation
- Bernard S. Meyerson
- G11 - INFORMATION STORAGE
Information Patent Grant
Control of the sintering of powdered metals
- Patent number 4,599,277
- Issue date Jul 8, 1986
- International Business Machines Corp.
- James M. Brownlow
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Gallium aluminum arsenide integrated circuit structure using germanium
- Patent number 4,482,906
- Issue date Nov 13, 1984
- International Business Machines Corporation
- Harold J. Hovel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned process for fabricating gallium arsenide metal-semicon...
- Patent number 4,389,768
- Issue date Jun 28, 1983
- International Business Machines Corporation
- Alan B. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a radiation responsive device
- Patent number 4,155,785
- Issue date May 22, 1979
- International Business Machines Corporation
- Jerome J. Cuomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Growth of polycrystalline semiconductor film with intermetallic nuc...
- Patent number 4,132,571
- Issue date Jan 2, 1979
- International Business Machines Corporation
- Jerome J. Cuomo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Radiation responsive device
- Patent number 4,062,038
- Issue date Dec 6, 1977
- International Business Machines Corporation
- Jerome John Cuomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial process of forming ferrite, Fe.sub.3 O.sub.4 and .gamma.F...
- Patent number 3,996,095
- Issue date Dec 7, 1976
- International Business Machines Corporation
- Kie Yeung Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...
- Publication number 20090142924
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20060264036
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal capped copper interconnect
- Publication number 20060157857
- Publication date Jul 20, 2006
- International Business Machines Corporation
- Michael Lane
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reliability of low-k dielectric devices with energy dissipative layer
- Publication number 20060012014
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Shyng-Tsong T. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper conductor
- Publication number 20060006070
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Michael Lane
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduced electromigration and stressed induced migration of copper w...
- Publication number 20050266673
- Publication date Dec 1, 2005
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20050127514
- Publication date Jun 16, 2005
- IBM
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming an electrically conductive interconnect
- Publication number 20050118796
- Publication date Jun 2, 2005
- Stefanie R. Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL decoupling capacitor
- Publication number 20040195694
- Publication date Oct 7, 2004
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of aligned capped metal lines and interconnections in mul...
- Publication number 20040113277
- Publication date Jun 17, 2004
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier material for copper structures
- Publication number 20030201537
- Publication date Oct 30, 2003
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming copper structures
- Publication number 20030203617
- Publication date Oct 30, 2003
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL decoupling capacitor
- Publication number 20030089943
- Publication date May 15, 2003
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Beol decoupling capacitor
- Publication number 20030085447
- Publication date May 8, 2003
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a porous dielectric material layer in a semicond...
- Publication number 20030057414
- Publication date Mar 27, 2003
- International Business Machines Corporation
- Timothy Joseph Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra thin, single phase, diffusion barrier for metal conductors
- Publication number 20020175418
- Publication date Nov 28, 2002
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced electromigration and stressed induced migration of Cu wires...
- Publication number 20020098681
- Publication date Jul 25, 2002
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with Ti-containing liners
- Publication number 20020076574
- Publication date Jun 20, 2002
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method for forming a porous dielectric material layer in a semicond...
- Publication number 20020074659
- Publication date Jun 20, 2002
- International Business Machines Corporation
- Timothy Joseph Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL decoupling capacitor
- Publication number 20020066919
- Publication date Jun 6, 2002
- International Business Machines Corporation
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL decoupling capacitor
- Publication number 20010040271
- Publication date Nov 15, 2001
- Peter Richard Duncombe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL DECOUPLING CAPACITOR
- Publication number 20010013660
- Publication date Aug 16, 2001
- PETER RICHARD DUNCOMBE
- H01 - BASIC ELECTRIC ELEMENTS

Robert Rosenberg

Person

Patents Grantslast 30 patents

Formation of aligned capped metal lines and interconnections in mul...

Metal capped copper interconnect

Reduced electromigration and stressed induced migration of copper w...

Ultra thin, single phase, diffusion barrier for metal conductors

Copper conductor

Method for forming a porous dielectric material layer in a semicond...

Process of forming copper structures

Barrier material for copper structures

BEOL decoupling capacitor

BEOL decoupling capacitor

Interconnects with Ti-containing liners

Ultra thin, single phase, diffusion barrier for metal conductors

Method for forming a porous dielectric material layer in a semicond...

Process for producing metal interconnections and product produced t...

Reduced electromigration and stressed induced migration of Cu wires...

Metal/ferrite laminate magnet

Metal/ferrite laminate magnet

Method of forming perforated metal/ferrite laminated magnet

Fabrication of defect free silicon on an insulating substrate

Method of fabricating defect-free silicon on an insulating substrate

Narrow base transistor and method of fabricating same

Method of fabricating a narrow base transistor

Silicon/carbon protection of metallic magnetic structures

Control of the sintering of powdered metals

Gallium aluminum arsenide integrated circuit structure using germanium

Self-aligned process for fabricating gallium arsenide metal-semicon...

Process of making a radiation responsive device

Growth of polycrystalline semiconductor film with intermetallic nuc...

Radiation responsive device

Epitaxial process of forming ferrite, Fe.sub.3 O.sub.4 and .gamma.F...

Patents Applicationslast 30 patents

REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...

Line level air gaps

Metal capped copper interconnect

Reliability of low-k dielectric devices with energy dissipative layer

Copper conductor

Reduced electromigration and stressed induced migration of copper w...

Line level air gaps

Process for forming an electrically conductive interconnect

BEOL decoupling capacitor

Formation of aligned capped metal lines and interconnections in mul...

Barrier material for copper structures

Process of forming copper structures

BEOL decoupling capacitor

Beol decoupling capacitor

Method for forming a porous dielectric material layer in a semicond...

Ultra thin, single phase, diffusion barrier for metal conductors

Reduced electromigration and stressed induced migration of Cu wires...

Interconnects with Ti-containing liners

Method for forming a porous dielectric material layer in a semicond...

BEOL decoupling capacitor

BEOL decoupling capacitor

BEOL DECOUPLING CAPACITOR