Robert Starkston

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,923,257
- Issue date Mar 5, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,515,248
- Issue date Nov 29, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 11,444,033
- Issue date Sep 13, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,114,353
- Issue date Sep 7, 2021
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling a magnet with a MEMS device
- Patent number 11,022,792
- Issue date Jun 1, 2021
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Localized high density substrate routing
- Patent number 10,796,988
- Issue date Oct 6, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 10,763,215
- Issue date Sep 1, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 10,716,214
- Issue date Jul 14, 2020
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized high density substrate routing
- Patent number 10,366,951
- Issue date Jul 30, 2019
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package
- Patent number 10,304,769
- Issue date May 28, 2019
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system with spring for magnet placement
- Patent number 10,125,013
- Issue date Nov 13, 2018
- Intel Corporation
- Robert Starkston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 10,008,452
- Issue date Jun 26, 2018
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel level fabrication of package substrates with integrated stiff...
- Patent number 9,832,860
- Issue date Nov 28, 2017
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 9,679,843
- Issue date Jun 13, 2017
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 9,642,248
- Issue date May 2, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 9,269,701
- Issue date Feb 23, 2016
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 9,136,236
- Issue date Sep 15, 2015
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 9,001,520
- Issue date Apr 7, 2015
- Intel Corporation
- Qing Ma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods and apparatus for laser scribing wafers
- Patent number 8,364,304
- Issue date Jan 29, 2013
- Intel Corporation
- Robert Starkston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for laser scribing wafers
- Patent number 7,772,090
- Issue date Aug 10, 2010
- Intel Corporation
- Robert Starkston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a die to a substrate
- Patent number 7,332,423
- Issue date Feb 19, 2008
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly having a thermally conductive member with...
- Patent number 7,223,638
- Issue date May 29, 2007
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marking on underfill
- Patent number 7,015,592
- Issue date Mar 21, 2006
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance in flip chip/integral heat spreader packages us...
- Patent number 6,617,683
- Issue date Sep 9, 2003
- Intel Corporation
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,239,973
- Issue date May 29, 2001
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for reducing electromagnetic interference and enclosure
- Patent number 6,191,475
- Issue date Feb 20, 2001
- Intel Corporation
- Harry G. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,043,983
- Issue date Mar 28, 2000
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface thickness control for a microprocessor
- Patent number 6,043,560
- Issue date Mar 28, 2000
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230130944
- Publication date Apr 27, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230040850
- Publication date Feb 9, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATES
- Publication number 20210384094
- Publication date Dec 9, 2021
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR STACKING WIRE-BOND CONVERTED FLIP-CHIP DIE
- Publication number 20210202441
- Publication date Jul 1, 2021
- Intel Corporation
- ENG HUAT GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20200395297
- Publication date Dec 17, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
- Publication number 20200335444
- Publication date Oct 22, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A MAGNET WITH A MEMS DEVICE
- Publication number 20190391386
- Publication date Dec 26, 2019
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
- Publication number 20190057937
- Publication date Feb 21, 2019
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATES
- Publication number 20190057915
- Publication date Feb 21, 2019
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20180350737
- Publication date Dec 6, 2018
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...
- Publication number 20180343744
- Publication date Nov 29, 2018
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-DIE PACKAGE
- Publication number 20180226334
- Publication date Aug 9, 2018
- Intel Corporation
- ROBERT L. SANKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM WITH SPRING FOR MAGNET PLACEMENT
- Publication number 20180134547
- Publication date May 17, 2018
- Intel Corporation
- Robert Starkston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20170287831
- Publication date Oct 5, 2017
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20170200677
- Publication date Jul 13, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20160197037
- Publication date Jul 7, 2016
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFF...
- Publication number 20160095209
- Publication date Mar 31, 2016
- Intel Corporation
- Robert STARKSTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20150340353
- Publication date Nov 26, 2015
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20150156869
- Publication date Jun 4, 2015
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20140091474
- Publication date Apr 3, 2014
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20140085846
- Publication date Mar 27, 2014
- Qing Ma
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS AND APPARATUS FOR LASER SCRIBING WAFERS
- Publication number 20100279490
- Publication date Nov 4, 2010
- Intel Corporation
- Robert Starkston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering a die to a substrate
- Publication number 20070001318
- Publication date Jan 4, 2007
- Robert Starkston
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic assembly having a thermally conductive member with...
- Publication number 20050255635
- Publication date Nov 17, 2005
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Marking on underfill
- Publication number 20050206017
- Publication date Sep 22, 2005
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for laser scribing wafers
- Publication number 20050067391
- Publication date Mar 31, 2005
- Intel Corporation
- Robert Starkston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of improving thermal performance in flip chip/integral heat...
- Publication number 20030067069
- Publication date Apr 10, 2003
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS

Robert Starkston

Person

Patents Grantslast 30 patents

Localized high density substrate routing

Localized high density substrate routing

Hybrid microelectronic substrates

Localized high density substrate routing

Hybrid microelectronic substrate and methods for fabricating the same

Hybrid microelectronic substrates

Coupling a magnet with a MEMS device

Localized high density substrate routing

Hybrid microelectronic substrate and methods for fabricating the same

Hybrid microelectronic substrate and methods for fabricating the same

Localized high density substrate routing

Multi-die package

Microelectromechanical system with spring for magnet placement

Microelectronic structures having laminated or embedded glass routi...

Panel level fabrication of package substrates with integrated stiff...

Localized high density substrate routing

Microelectronic structures having laminated or embedded glass routi...

Localized high density substrate routing

Localized high density substrate routing

Microelectronic structures having laminated or embedded glass routi...

Methods and apparatus for laser scribing wafers

Methods for laser scribing wafers

Soldering a die to a substrate

Microelectronic assembly having a thermally conductive member with...

Marking on underfill

Thermal performance in flip chip/integral heat spreader packages us...

EMI containment for microprocessor core mounted on a card using sur...

Substrate for reducing electromagnetic interference and enclosure

EMI containment for microprocessor core mounted on a card using sur...

Thermal interface thickness control for a microprocessor

Patents Applicationslast 30 patents

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

HYBRID MICROELECTRONIC SUBSTRATES

SYSTEM AND METHOD FOR STACKING WIRE-BOND CONVERTED FLIP-CHIP DIE

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME

COUPLING A MAGNET WITH A MEMS DEVICE

HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME

HYBRID MICROELECTRONIC SUBSTRATES

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...

MULTI-DIE PACKAGE

MICROELECTROMECHANICAL SYSTEM WITH SPRING FOR MAGNET PLACEMENT

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFF...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

METHODS AND APPARATUS FOR LASER SCRIBING WAFERS

Soldering a die to a substrate

Microelectronic assembly having a thermally conductive member with...

Marking on underfill

Methods for laser scribing wafers

Method of improving thermal performance in flip chip/integral heat...