Robert Vinson Burress

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,399,426
- Issue date Jun 4, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,335,571
- Issue date Jan 1, 2002
- Miguel Albert Capote
- Miguel Albert Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020031868
- Publication date Mar 14, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS