Robert W. Batz, JR.

Person

Kalispell, MT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplating tool with feedback of metal thickness distribution a...
- Patent number 10,260,855
- Issue date Apr 16, 2019
- Applied Materials, Inc.
- Todd J. Egan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper process using anion permeable barrier
- Patent number 9,234,293
- Issue date Jan 12, 2016
- Applied Materials, Inc.
- Rajesh Baskaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic process using cation permeable barrier
- Patent number 8,961,771
- Issue date Feb 24, 2015
- Applied Materials, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic process using anion permeable barrier
- Patent number 8,852,417
- Issue date Oct 7, 2014
- Applied Materials, Inc.
- Rajesh Baskaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact assembly for supplying power to workpieces during electroch...
- Patent number 6,805,778
- Issue date Oct 19, 2004
- Semitool, Inc.
- Robert W. Batz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submicron metallization using electrochemical deposition
- Patent number 6,806,186
- Issue date Oct 19, 2004
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high deposition rate solder electroplating on a microele...
- Patent number 6,669,834
- Issue date Dec 30, 2003
- Semitool, Inc.
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for controlling workpiece surface exposure to...
- Patent number 6,602,383
- Issue date Aug 5, 2003
- Semitool, Inc.
- Robert W. Batz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact assemblies, methods for making contact assemblies, and plat...
- Patent number 6,527,925
- Issue date Mar 4, 2003
- Semitool, Inc.
- Robert W. Batz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Electroplating reactor including back-side electrical contact appar...
- Patent number 6,527,926
- Issue date Mar 4, 2003
- Semitool, Inc.
- Daniel J. Woodruff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for plating semiconductor workpieces using a workpiece-enga...
- Patent number 6,461,494
- Issue date Oct 8, 2002
- Semitool, Inc.
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for high deposition rate solder electroplating on a micro...
- Patent number 6,334,937
- Issue date Jan 1, 2002
- Semitool, Inc.
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for controlling semiconductor workpiece surface exposure to...
- Patent number 6,090,711
- Issue date Jul 18, 2000
- Semitool, Inc.
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for plating semiconductor workpieces using a workpiece-enga...
- Patent number 6,001,234
- Issue date Dec 14, 1999
- Semitool, Inc.
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER PROCESS USING ANION PERMEABLE BARRIER
- Publication number 20150083600
- Publication date Mar 26, 2015
- Applied Materials, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING TOOL WITH FEEDBACK OF METAL THICKNESS DISTRIBUTION A...
- Publication number 20140367267
- Publication date Dec 18, 2014
- Applied Materials, Inc.
- Todd J. Egan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...
- Publication number 20140246324
- Publication date Sep 4, 2014
- Applied Materials, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER
- Publication number 20140209472
- Publication date Jul 31, 2014
- Applied Materials, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and Method for Thermally Controlled Processing of Microel...
- Publication number 20080011450
- Publication date Jan 17, 2008
- Semitool, Inc.
- Kyle M. Hanson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic copper process using anion permeable barrier
- Publication number 20070068820
- Publication date Mar 29, 2007
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic process using cation permeable barrier
- Publication number 20060260946
- Publication date Nov 23, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic process using cation permeable barrier
- Publication number 20060237323
- Publication date Oct 26, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto barrier layers using ion pe...
- Publication number 20060189129
- Publication date Aug 24, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic process using anion permeable barrier
- Publication number 20060163072
- Publication date Jul 27, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic process using anion permeable barrier
- Publication number 20060157355
- Publication date Jul 20, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for processing a microfeature workpiece with m...
- Publication number 20050205111
- Publication date Sep 22, 2005
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of submicron metallization using electrochemical deposition...
- Publication number 20050051436
- Publication date Mar 10, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating reactor including back-side electrical contact appar...
- Publication number 20040222086
- Publication date Nov 11, 2004
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20040035694
- Publication date Feb 26, 2004
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for plating semiconductor workpieces using a workpiece-enga...
- Publication number 20040035707
- Publication date Feb 26, 2004
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for thermally controlled processing of microel...
- Publication number 20040013808
- Publication date Jan 22, 2004
- Kyle M. Hanson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20030196892
- Publication date Oct 23, 2003
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20030173209
- Publication date Sep 18, 2003
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for filling recessed micro-structures with metallization in...
- Publication number 20030045095
- Publication date Mar 6, 2003
- Semitool, Inc.
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Submicron metallization using electrochemical deposition
- Publication number 20020004301
- Publication date Jan 10, 2002
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method, chemistry, and apparatus for high deposition rate solder el...
- Publication number 20020000378
- Publication date Jan 3, 2002
- Semitool, Inc.
- Robert W. Batz,
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating reactor including back-side electrical contact appar...
- Publication number 20010052457
- Publication date Dec 20, 2001
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Robert W. Batz, JR.

Person

Patents Grantslast 30 patents

Electroplating tool with feedback of metal thickness distribution a...

Electrolytic copper process using anion permeable barrier

Electrolytic process using cation permeable barrier

Electrolytic process using anion permeable barrier

Contact assembly for supplying power to workpieces during electroch...

Submicron metallization using electrochemical deposition

Method for high deposition rate solder electroplating on a microele...

Apparatus and methods for controlling workpiece surface exposure to...

Contact assemblies, methods for making contact assemblies, and plat...

Electroplating reactor including back-side electrical contact appar...

Methods for plating semiconductor workpieces using a workpiece-enga...

Apparatus for high deposition rate solder electroplating on a micro...

Methods for controlling semiconductor workpiece surface exposure to...

Methods for plating semiconductor workpieces using a workpiece-enga...

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER PROCESS USING ANION PERMEABLE BARRIER

ELECTROPLATING TOOL WITH FEEDBACK OF METAL THICKNESS DISTRIBUTION A...

METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...

ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER

Apparatus and Method for Thermally Controlled Processing of Microel...

Electrolytic copper process using anion permeable barrier

Copper electrolytic process using cation permeable barrier

Electrolytic process using cation permeable barrier

Method for applying metal features onto barrier layers using ion pe...

Electrolytic process using anion permeable barrier

Electrolytic process using anion permeable barrier

Method and apparatus for processing a microfeature workpiece with m...

Method of submicron metallization using electrochemical deposition...

Electroplating reactor including back-side electrical contact appar...

Contact assemblies, methods for making contact assemblies, and plat...

Methods for plating semiconductor workpieces using a workpiece-enga...

Apparatus and method for thermally controlled processing of microel...

Contact assemblies, methods for making contact assemblies, and plat...

Contact assemblies, methods for making contact assemblies, and plat...

Method for filling recessed micro-structures with metallization in...

Submicron metallization using electrochemical deposition

Method, chemistry, and apparatus for high deposition rate solder el...

Electroplating reactor including back-side electrical contact appar...