Robert W. Warren

Person

Laguna Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3-D stacking of active devices over passive devices
- Patent number 9,955,582
- Issue date Apr 24, 2018
- Skyworks Solutions, Inc.
- Mark A. Kuhlman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with corner pins
- Patent number 9,142,491
- Issue date Sep 22, 2015
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating an overmolded semiconductor package with wi...
- Patent number 9,054,115
- Issue date Jun 9, 2015
- Skyworks Solutions, Inc.
- Dinhphuoc V. Hoang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Overmolded semiconductor package with wirebonds for electromagnetic...
- Patent number 9,041,168
- Issue date May 26, 2015
- Skyworks Solutions, Inc.
- Dinhphuoc V. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with reduced solder voiding
- Patent number 9,029,991
- Issue date May 12, 2015
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with thermal pad for higher power dissipation
- Patent number 8,552,540
- Issue date Oct 8, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded USB connector module with molded hood and LED light pipe
- Patent number 8,540,529
- Issue date Sep 24, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods of tamper proof packaging of a semiconductor de...
- Patent number 8,455,990
- Issue date Jun 4, 2013
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded semiconductor package with a wirebond cage for EMI shiel...
- Patent number 8,399,972
- Issue date Mar 19, 2013
- Skyworks Solutions, Inc.
- Dinhphuoc V. Hoang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire...
- Patent number 8,377,731
- Issue date Feb 19, 2013
- Conexant Systems, Inc.
- Robert Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overmolded semiconductor package with a wirebond cage for EMI shiel...
- Patent number 8,071,431
- Issue date Dec 6, 2011
- Skyworks Solutions, Inc.
- Dinphuoc V. Hoang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire...
- Patent number 8,022,490
- Issue date Sep 20, 2011
- Conexant Systems, Inc.
- Robert Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enhanced thermal dissipation ball grid array package
- Patent number 8,013,440
- Issue date Sep 6, 2011
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaAs integrated circuit device and method of attaching same
- Patent number 7,923,842
- Issue date Apr 12, 2011
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with cavities for active devices
- Patent number 7,635,606
- Issue date Dec 22, 2009
- Skyworks Solutions, Inc.
- Robert W. Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a wafer level package with device wafer and...
- Patent number 7,629,201
- Issue date Dec 8, 2009
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package including a device wafer integrated with a pass...
- Patent number 7,576,426
- Issue date Aug 18, 2009
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overmolded semiconductor package with an integrated EMI and RFI shield
- Patent number 7,198,987
- Issue date Apr 3, 2007
- Skyworks Solutions, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multichip interconnect decal grid array with epoxy int...
- Patent number 6,435,883
- Issue date Aug 20, 2002
- Raytheon Company
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top of die chip-on-board encapsulation
- Patent number 5,951,813
- Issue date Sep 14, 1999
- Raytheon Company
- Robert W. Warren
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional component stacking using high density multichip i...
- Patent number 5,905,639
- Issue date May 18, 1999
- Raytheon Company
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20180242455
- Publication date Aug 23, 2018
- SKYWORKS SOLUTIONS, INC.
- Mark A. KUHLMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED RADIO-FREQUENCY MODULE HAVING WIREBOND SHIELDING
- Publication number 20150255402
- Publication date Sep 10, 2015
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc V. HOANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO FABRICATION OF SHIELDED RADIO-FREQUENCY MODULE
- Publication number 20150255403
- Publication date Sep 10, 2015
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc V. HOANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Corner Pins
- Publication number 20140091448
- Publication date Apr 3, 2014
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Sphere Array Package
- Publication number 20130256885
- Publication date Oct 3, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY
- Publication number 20130208424
- Publication date Aug 15, 2013
- Robert W. Warren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Stud Bump Wafer Level Package
- Publication number 20130087915
- Publication date Apr 11, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
- Publication number 20130062742
- Publication date Mar 14, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded USB Connector Module with Molded Hood and LED Light Pipe
- Publication number 20130034990
- Publication date Feb 7, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Externally Wire Bondable Chip Scale Package in a System-in-Package...
- Publication number 20120326304
- Publication date Dec 27, 2012
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION
- Publication number 20120286408
- Publication date Nov 15, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Unpackaged and packaged IC stacked in a system-in-package module
- Publication number 20120241954
- Publication date Sep 27, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated led in system-in-package module
- Publication number 20120188738
- Publication date Jul 26, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC...
- Publication number 20120146178
- Publication date Jun 14, 2012
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc V. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WI...
- Publication number 20120137514
- Publication date Jun 7, 2012
- Skyworks Solution, Inc.
- Dinhphuoc V. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages with reduced solder voiding
- Publication number 20120119341
- Publication date May 17, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for improved heat dissipation in semiconductor...
- Publication number 20120104591
- Publication date May 3, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Heat Dissipation Using Thermal Conduits
- Publication number 20120032350
- Publication date Feb 9, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ELECTRO-MECHANICAL SENSOR (MEMS) FABRICATED WITH RIBBON WIRE...
- Publication number 20120009778
- Publication date Jan 12, 2012
- Robert Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
- Publication number 20110186966
- Publication date Aug 4, 2011
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIEL...
- Publication number 20110084368
- Publication date Apr 14, 2011
- SKYWORKS SOLUTIONS, INC.
- Dinphuoc V. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Improved Heat Dissipation with Variable Pitc...
- Publication number 20110001230
- Publication date Jan 6, 2011
- Conexant Systems, Inc.
- Jianjun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Tamper Proof Packaging of a Semiconductor De...
- Publication number 20100213590
- Publication date Aug 26, 2010
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20090267220
- Publication date Oct 29, 2009
- Mark A. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Enhanced Thermal Dissipation Ball Grid Array Package
- Publication number 20090243086
- Publication date Oct 1, 2009
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Electro-Mechanical Sensor (MEMS) Fabricated with Ribbon Wire...
- Publication number 20090236677
- Publication date Sep 24, 2009
- Robert Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT
- Publication number 20090127695
- Publication date May 21, 2009
- Patrick Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package with cavities for active devices
- Publication number 20090075431
- Publication date Mar 19, 2009
- Skyworks Solutions, Inc.
- Robert W. Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for fabricating a wafer level package having through wafer v...
- Publication number 20080064142
- Publication date Mar 13, 2008
- Skyworks Solutions, Inc.
- QING GAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for fabricating a wafer level package with device wafer and...
- Publication number 20080003761
- Publication date Jan 3, 2008
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Robert W. Warren

Person

Patents Grantslast 30 patents

3-D stacking of active devices over passive devices

Spot plated leadframe and IC bond pad via array design for copper wire

Semiconductor package with corner pins

Methods for fabricating an overmolded semiconductor package with wi...

Overmolded semiconductor package with wirebonds for electromagnetic...

Semiconductor packages with reduced solder voiding

Wafer level package with thermal pad for higher power dissipation

Shielded USB connector module with molded hood and LED light pipe

Systems and methods of tamper proof packaging of a semiconductor de...

Overmolded semiconductor package with a wirebond cage for EMI shiel...

Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire...

Overmolded semiconductor package with a wirebond cage for EMI shiel...

Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire...

Enhanced thermal dissipation ball grid array package

GaAs integrated circuit device and method of attaching same

Wafer level package with cavities for active devices

Method for fabricating a wafer level package with device wafer and...

Wafer level package including a device wafer integrated with a pass...

Overmolded semiconductor package with an integrated EMI and RFI shield

High density multichip interconnect decal grid array with epoxy int...

Top of die chip-on-board encapsulation

Three-dimensional component stacking using high density multichip i...

Patents Applicationslast 30 patents

3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES

PACKAGED RADIO-FREQUENCY MODULE HAVING WIREBOND SHIELDING

METHODS RELATED TO FABRICATION OF SHIELDED RADIO-FREQUENCY MODULE

Semiconductor Package with Corner Pins

Copper Sphere Array Package

SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY

Copper Stud Bump Wafer Level Package

Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire

Shielded USB Connector Module with Molded Hood and LED Light Pipe

Externally Wire Bondable Chip Scale Package in a System-in-Package...

WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION

Unpackaged and packaged IC stacked in a system-in-package module

Integrated led in system-in-package module

OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC...

METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WI...

Semiconductor packages with reduced solder voiding

Systems and methods for improved heat dissipation in semiconductor...

Systems and Methods for Heat Dissipation Using Thermal Conduits

MICRO ELECTRO-MECHANICAL SENSOR (MEMS) FABRICATED WITH RIBBON WIRE...

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIEL...

Systems and Methods of Improved Heat Dissipation with Variable Pitc...

Systems and Methods of Tamper Proof Packaging of a Semiconductor De...

3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES

Enhanced Thermal Dissipation Ball Grid Array Package

Micro Electro-Mechanical Sensor (MEMS) Fabricated with Ribbon Wire...

SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT

Wafer level package with cavities for active devices

Method for fabricating a wafer level package having through wafer v...

Method for fabricating a wafer level package with device wafer and...