Robin E. Gorrell

Person

Eau Claire, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dimensionally stable core for use in high density chip packages and...
- Patent number 6,344,371
- Issue date Feb 5, 2002
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming redundant signal traces and corresponding electro...
- Patent number 5,976,974
- Issue date Nov 2, 1999
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using ultrasonic treatment in combination with UV-lasers...
- Patent number 5,965,043
- Issue date Oct 12, 1999
- W. L. Gore & Associates, Inc.
- David B. Noddin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimensionally stable core for use in high density chip packages
- Patent number 5,847,327
- Issue date Dec 8, 1998
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming raised metallic contacts on electrical circuits f...
- Patent number 5,786,270
- Issue date Jul 28, 1998
- W. L. Gore & Associates, Inc.
- Robin E. Gorrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming raised metallic contacts on electrical circuits
- Patent number 5,747,358
- Issue date May 5, 1998
- W. L. Gore & Associates, Inc.
- Robin E. Gorrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect system for an area array interconnection us...
- Patent number 5,276,955
- Issue date Jan 11, 1994
- SuperComputer Systems Limited Partnership
- David B. Noddin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Crack resistant interconnect module
- Publication number 20040104463
- Publication date Jun 3, 2004
- Robin E. Gorrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crack resistant interconnect module
- Publication number 20040099958
- Publication date May 27, 2004
- William R. Schildgen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA SOLDER BALL SHEAR STRENGTH
- Publication number 20020045036
- Publication date Apr 18, 2002
- ROBIN GORRELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSIONALLY STABLE CORE FOR USE IN HIGH DENSITY CHIP PACKAGES AND...
- Publication number 20010029065
- Publication date Oct 11, 2001
- PAUL J. FISCHER
- H01 - BASIC ELECTRIC ELEMENTS

Robin E. Gorrell

Person

Patents Grantslast 30 patents

Dimensionally stable core for use in high density chip packages and...

Method of forming redundant signal traces and corresponding electro...

Method for using ultrasonic treatment in combination with UV-lasers...

Dimensionally stable core for use in high density chip packages

Method of forming raised metallic contacts on electrical circuits f...

Method of forming raised metallic contacts on electrical circuits

Multilayer interconnect system for an area array interconnection us...

Patents Applicationslast 30 patents

Crack resistant interconnect module

Crack resistant interconnect module

BGA SOLDER BALL SHEAR STRENGTH

DIMENSIONALLY STABLE CORE FOR USE IN HIGH DENSITY CHIP PACKAGES AND...