Robin W. Cheung

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Isolation structures in film-based image sensors
- Patent number 10,615,198
- Issue date Apr 7, 2020
- Apple Inc.
- Yu-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device fabrication
- Patent number 8,569,160
- Issue date Oct 29, 2013
- Unity Semiconductor Corporation
- Darrell Rinerson
- G11 - INFORMATION STORAGE
Information Patent Grant
Immersion platinum plating solution
- Patent number 8,361,560
- Issue date Jan 29, 2013
- Unity Semiconductor Corporation
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Immersion platinum plating solution
- Patent number 8,317,910
- Issue date Nov 27, 2012
- Unity Semiconductor Corporation
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device fabrication
- Patent number 8,314,024
- Issue date Nov 20, 2012
- Unity Semiconductor Corporation
- Darrell Rinerson
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device using ion implant isolated conductive metal oxide
- Patent number 8,268,667
- Issue date Sep 18, 2012
- Unity Semiconductor Corporation
- Darrell Rinerson
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Continuous plane of thin-film materials for a two-terminal cross-po...
- Patent number 8,237,142
- Issue date Aug 7, 2012
- Unity Semiconductor Corporation
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell formation using ion implant isolated conductive metal o...
- Patent number 8,003,511
- Issue date Aug 23, 2011
- Unity Semiconductor Corporation
- Darrell Rinerson
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Continuous plane of thin-film materials for a two-terminal cross-po...
- Patent number 7,897,951
- Issue date Mar 1, 2011
- Unity Semiconductor Corporation
- Darrell Rinerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous plane of thin-film materials for a two-terminal cross-po...
- Patent number 7,888,711
- Issue date Feb 15, 2011
- Unity Semiconductor Corporation
- Robin Cheung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Continuous plane of thin-film materials for a two-terminal cross-po...
- Patent number 7,742,323
- Issue date Jun 22, 2010
- Unity Semiconductor Corporation
- Darrell Rinerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-chemical deposition system
- Patent number 7,497,932
- Issue date Mar 3, 2009
- Applied Materials, Inc.
- Yezdi Dordi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for post-etch deposition of a dielectric film
- Patent number 7,393,795
- Issue date Jul 1, 2008
- Applied Materials, Inc.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for capturing and using design intent in an in...
- Patent number 7,313,456
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- John H. Madok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device interconnect fabricating techniques
- Patent number 7,312,146
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Robin W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for annealing copper films
- Patent number 7,192,494
- Issue date Mar 20, 2007
- Applied Materials, Inc.
- B. Michelle Chen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method and apparatus for providing intra-tool monitoring and control
- Patent number 7,074,626
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Suketu Parikh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for heating and cooling substrates
- Patent number 6,929,774
- Issue date Aug 16, 2005
- Applied Materials, Inc.
- Ratson Morad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of conditioning electrochemical baths in plating technology
- Patent number 6,893,548
- Issue date May 17, 2005
- Applied Materials Inc.
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for providing intra-tool monitoring and control
- Patent number 6,842,659
- Issue date Jan 11, 2005
- Applied Materials Inc.
- Suketu Parikh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electroless deposition method over sub-micron apertures
- Patent number 6,824,666
- Issue date Nov 30, 2004
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for treating a substrate
- Patent number 6,818,066
- Issue date Nov 16, 2004
- Applied Materials, Inc.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved electroplating fill of an aperture
- Patent number 6,797,620
- Issue date Sep 28, 2004
- Applied Materials, Inc.
- John S. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post metal barrier/adhesion film
- Patent number 6,753,248
- Issue date Jun 22, 2004
- Applied Materials, Inc.
- Michael Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnects
- Patent number 6,740,221
- Issue date May 25, 2004
- Applied Materials Inc.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heating and cooling substrates
- Patent number 6,658,763
- Issue date Dec 9, 2003
- Applied Materials, Inc.
- Ratson Morad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treating a substrate
- Patent number 6,645,550
- Issue date Nov 11, 2003
- Applied Materials, Inc.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-chemical deposition system
- Patent number 6,635,157
- Issue date Oct 21, 2003
- Applied Materials, Inc.
- Yezdi Dordi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated solder bump deposition apparatus and method
- Patent number 6,572,010
- Issue date Jun 3, 2003
- Applied Materials Inc.
- Yezdi N. Dordi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallized interconnection structure
- Patent number 6,492,722
- Issue date Dec 10, 2002
- Advanced Micro Devices, Inc.
- Robin W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EQUIPMENT AND METHOD OF MANUFACTURING FOR LIQUID PROCESSING IN A CO...
- Publication number 20140087073
- Publication date Mar 27, 2014
- Igor Constantin Ivanov
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DEVICE FABRICATION
- Publication number 20130059436
- Publication date Mar 7, 2013
- Darrell Rinerson
- G11 - INFORMATION STORAGE
Information Patent Application
IMMERSION PLATINUM PLATING SOLUTION
- Publication number 20120315503
- Publication date Dec 13, 2012
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- B32 - LAYERED PRODUCTS
Information Patent Application
CONTINUOUS PLANE OF THIN-FILM MATERIALS FOR A TWO-TERMINAL CROSS-PO...
- Publication number 20120292585
- Publication date Nov 22, 2012
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Fabricated BEOL Non-Volatile Two-Terminal Cross-Trench M...
- Publication number 20120012897
- Publication date Jan 19, 2012
- UNITY SEMICONDUCTOR CORPORATION
- PAUL BESSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Using A Dual Layer Conductive Metal Oxide Structure
- Publication number 20110315943
- Publication date Dec 29, 2011
- UNITY SEMICONDUCTOR CORPORATION
- Darrell Rinerson
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Application
Memory Device Using Ion Implant Isolated Conductive Metal Oxide
- Publication number 20110315948
- Publication date Dec 29, 2011
- UNITY SEMICONDUCTOR CORPORATION
- Darrell Rinerson
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Application
Immersion platinum plating solution
- Publication number 20110229734
- Publication date Sep 22, 2011
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Continuous plane of thin-film materials for a two-terminal cross-po...
- Publication number 20110155990
- Publication date Jun 30, 2011
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Continuous plane of thin-film materials for a two-terminal cross-po...
- Publication number 20110133147
- Publication date Jun 9, 2011
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Continuous plane of thin-film materials for a two-terminal cross-po...
- Publication number 20100265762
- Publication date Oct 21, 2010
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory cell formation using ion implant isolated conductive metal o...
- Publication number 20100159641
- Publication date Jun 24, 2010
- UNITY SEMICONDUCTOR CORPORATION
- Darrell Rinerson
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Application
Device fabrication
- Publication number 20100159688
- Publication date Jun 24, 2010
- UNITY SEMICONDUCTOR CORPORATION
- Darrell Rinerson
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FABRICATING LOW K DIELECTRIC DUAL DAMASCENE STRUCTURES
- Publication number 20090156012
- Publication date Jun 18, 2009
- Applied Materials, Inc.
- CHANG-LIN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-AWARE SEMICONDUCTOR EQUIPMENT
- Publication number 20090112520
- Publication date Apr 30, 2009
- Applied Materials, Inc.
- DIMITRIS LYMBEROPOULOS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Continuous plane of thin-film materials for a two-terminal cross-po...
- Publication number 20090026442
- Publication date Jan 29, 2009
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Continuous plane of thin-film materials for a two-terminal cross-po...
- Publication number 20090026441
- Publication date Jan 29, 2009
- UNITY SEMICONDUCTOR CORPORATION
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective layer for a low k dielectric film and methods of forming...
- Publication number 20070254491
- Publication date Nov 1, 2007
- Applied Materials, Inc.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for post-etch deposition of a dielectric film
- Publication number 20070175858
- Publication date Aug 2, 2007
- APPLIED MATERIALS, INC.
- Robin Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ANNEALING COPPER FILMS
- Publication number 20070128869
- Publication date Jun 7, 2007
- B. Michelle Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electro-chemical deposition system
- Publication number 20060246690
- Publication date Nov 2, 2006
- APPLIED MATERIALS, INC.
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING INTRA-TOOL MONITORING AND CONTROL
- Publication number 20060235563
- Publication date Oct 19, 2006
- Suketu Parikh
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor device interconnect fabricating techniques
- Publication number 20060063370
- Publication date Mar 23, 2006
- APPLIED MATERIALS, INC.
- Robin W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for capturing and using design intent in an in...
- Publication number 20040201041
- Publication date Oct 14, 2004
- APPLIED MATERIALS, INC.
- John H. Madok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for providing intra-tool monitoring and control
- Publication number 20040173464
- Publication date Sep 9, 2004
- APPLIED MATERIALS, INC.
- Suketu Parikh
- G05 - CONTROLLING REGULATING
Information Patent Application
Method and apparatus for heating and cooling substrates
- Publication number 20040154185
- Publication date Aug 12, 2004
- APPLIED MATERIALS, INC.
- Ratson Morad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-chemical deposition system
- Publication number 20040084301
- Publication date May 6, 2004
- APPLIED MATERIALS, INC.
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for electro chemical deposition of copper metallization w...
- Publication number 20040079633
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- Robin Cheung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for annealing copper films
- Publication number 20040003873
- Publication date Jan 8, 2004
- APPLIED MATERIALS, INC.
- B. Michelle Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for improved electroplating fill of an aperture
- Publication number 20030194850
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- John S. Lewis
- H01 - BASIC ELECTRIC ELEMENTS

Robin W. Cheung

Person

Patents Grantslast 30 patents

Isolation structures in film-based image sensors

Device fabrication

Immersion platinum plating solution

Immersion platinum plating solution

Device fabrication

Memory device using ion implant isolated conductive metal oxide

Continuous plane of thin-film materials for a two-terminal cross-po...

Memory cell formation using ion implant isolated conductive metal o...

Continuous plane of thin-film materials for a two-terminal cross-po...

Continuous plane of thin-film materials for a two-terminal cross-po...

Continuous plane of thin-film materials for a two-terminal cross-po...

Electro-chemical deposition system

Methods for post-etch deposition of a dielectric film

Method and apparatus for capturing and using design intent in an in...

Semiconductor device interconnect fabricating techniques

Method and apparatus for annealing copper films

Method and apparatus for providing intra-tool monitoring and control

Method and apparatus for heating and cooling substrates

Method of conditioning electrochemical baths in plating technology

Method and apparatus for providing intra-tool monitoring and control

Electroless deposition method over sub-micron apertures

Method and apparatus for treating a substrate

Method and apparatus for improved electroplating fill of an aperture

Post metal barrier/adhesion film

Method of forming copper interconnects

Method for heating and cooling substrates

Method of treating a substrate

Electro-chemical deposition system

Integrated solder bump deposition apparatus and method

Metallized interconnection structure

Patents Applicationslast 30 patents

EQUIPMENT AND METHOD OF MANUFACTURING FOR LIQUID PROCESSING IN A CO...

DEVICE FABRICATION

IMMERSION PLATINUM PLATING SOLUTION

CONTINUOUS PLANE OF THIN-FILM MATERIALS FOR A TWO-TERMINAL CROSS-PO...

Vertically Fabricated BEOL Non-Volatile Two-Terminal Cross-Trench M...

Memory Device Using A Dual Layer Conductive Metal Oxide Structure

Memory Device Using Ion Implant Isolated Conductive Metal Oxide

Immersion platinum plating solution

Continuous plane of thin-film materials for a two-terminal cross-po...

Continuous plane of thin-film materials for a two-terminal cross-po...

Continuous plane of thin-film materials for a two-terminal cross-po...

Memory cell formation using ion implant isolated conductive metal o...

Device fabrication

METHOD FOR FABRICATING LOW K DIELECTRIC DUAL DAMASCENE STRUCTURES

SELF-AWARE SEMICONDUCTOR EQUIPMENT

Continuous plane of thin-film materials for a two-terminal cross-po...

Continuous plane of thin-film materials for a two-terminal cross-po...

Protective layer for a low k dielectric film and methods of forming...

Methods for post-etch deposition of a dielectric film

METHOD AND APPARATUS FOR ANNEALING COPPER FILMS

Electro-chemical deposition system

METHOD AND APPARATUS FOR PROVIDING INTRA-TOOL MONITORING AND CONTROL

Semiconductor device interconnect fabricating techniques

Method and apparatus for capturing and using design intent in an in...

Method and apparatus for providing intra-tool monitoring and control

Method and apparatus for heating and cooling substrates

Electro-chemical deposition system

Apparatus for electro chemical deposition of copper metallization w...

Method and apparatus for annealing copper films

Method and apparatus for improved electroplating fill of an aperture