Robin Wilson

Person

Belfast, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Near field RF communicator and timing apparatus
- Patent number 9,515,705
- Issue date Dec 6, 2016
- Broadcom Corporation
- Humberto Andrade da Fonseca
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tuneable NFC-enabled device
- Patent number 9,305,192
- Issue date Apr 5, 2016
- Broadcom Europe Limited
- Robin Wilson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detecting peaks in a received signal in a near field communications...
- Patent number 9,236,915
- Issue date Jan 12, 2016
- Broadcom Corporation
- Humberto Andrade Da Fonseca
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Near field RF communicators having refined energy sharing character...
- Patent number 9,197,059
- Issue date Nov 24, 2015
- Broadcom Europe Limited
- Robin Wilson
- G05 - CONTROLLING REGULATING
Information Patent Grant
Voltage regulation of near field communication communicators
- Patent number 9,182,771
- Issue date Nov 10, 2015
- Broadcom Europe Limited
- Paul Butler
- G05 - CONTROLLING REGULATING
Information Patent Grant
NFC communicators implementing coil voltage reduction circuitry
- Patent number 9,143,199
- Issue date Sep 22, 2015
- Broadcom Europe Limited
- Joakim Bangs
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optimizing power consumption in a near field communications (NFC) e...
- Patent number 9,054,749
- Issue date Jun 9, 2015
- Broadcom Corporation
- Robin Wyndham John Wilson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reducing emissions in a near field communications (NFC) capable device
- Patent number 8,897,699
- Issue date Nov 25, 2014
- Broadcom Corporation
- Robin Wyndham John Wilson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Near field RF communicators having refined energy sharing character...
- Patent number 8,588,682
- Issue date Nov 19, 2013
- Broadcom Innovision Limited
- Robin Wilson
- G05 - CONTROLLING REGULATING
Information Patent Grant
Tuneable NFC-enabled device
- Patent number 8,503,931
- Issue date Aug 6, 2013
- Broadcom Innovision Limited
- Robin Wilson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
NFC communicators implementing coil voltage reduction circuitry
- Patent number 8,489,020
- Issue date Jul 16, 2013
- Broadcom Innovision Limited
- Joakim Bangs
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonded wafer substrate utilizing roughened surfaces for use in MEMS...
- Patent number 8,253,243
- Issue date Aug 28, 2012
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tuneable NFC device
- Patent number 8,249,500
- Issue date Aug 21, 2012
- Innovision Research & Technology PLC
- Robin Wilson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Peak detector for detecting peaks in a modulated signal
- Patent number 8,188,787
- Issue date May 29, 2012
- Broadcom Corporation
- Robin Wilson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...
- Patent number 8,169,057
- Issue date May 1, 2012
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Near field RF communicators and near field communications enabled d...
- Patent number 8,150,321
- Issue date Apr 3, 2012
- Ian Winter
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Technique for stable processing of thin/fragile substrates
- Patent number 8,148,203
- Issue date Apr 3, 2012
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front lit PIN/NIP diode having a continuous anode/cathode
- Patent number 8,058,091
- Issue date Nov 15, 2011
- Icemos Technology Ltd.
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of fabricating a bonded wafer substrate for use in MEMS stru...
- Patent number 8,030,133
- Issue date Oct 4, 2011
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Technique for stable processing of thin/fragile substrates
- Patent number 7,999,348
- Issue date Aug 16, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,972,934
- Issue date Jul 5, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a photodiode array with through-wafer vias
- Patent number 7,910,479
- Issue date Mar 22, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,821,089
- Issue date Oct 26, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,768,085
- Issue date Aug 3, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode having increased proportion of light-sensitive area to l...
- Patent number 7,741,141
- Issue date Jun 22, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...
- Patent number 7,741,172
- Issue date Jun 22, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer having through-wafer vias
- Patent number 7,709,950
- Issue date May 4, 2010
- Icemos Technology Ltd.
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Front side electrical contact for photodetector array and method of...
- Patent number 7,601,556
- Issue date Oct 13, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded-wafer superjunction semiconductor device
- Patent number 7,579,667
- Issue date Aug 25, 2009
- Icemos Technology Ltd.
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a photodiode array with through-wafer vias
- Patent number 7,579,273
- Issue date Aug 25, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NEAR FIELD RF COMMUNICATOR AND TIMING APPARATUS
- Publication number 20160127013
- Publication date May 5, 2016
- BROADCOM CORPORATION
- Humberto Andrade Da FONSECA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NEAR FIELD RF COMMUNICATORS HAVING REFINED ENERGY SHARING CHARACTER...
- Publication number 20140036395
- Publication date Feb 6, 2014
- Broadcom Innovision Limited
- Robin WILSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Controlling NFC Tag Power Dissipation
- Publication number 20130337756
- Publication date Dec 19, 2013
- BROADCOM CORPORATION
- Robin WILSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TUNEABLE NFC-ENABLED DEVICE
- Publication number 20130281018
- Publication date Oct 24, 2013
- Robin WILSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NFC Communicators Implementing Coil Voltage Reduction Circuitry
- Publication number 20130273845
- Publication date Oct 17, 2013
- Joakim Bangs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Varying Load Modulation in an NFC-Enabled Device Over a Range of Fi...
- Publication number 20130078914
- Publication date Mar 28, 2013
- BROADCOM CORPORATION
- Philip Stewart ROYSTON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TUNEABLE NFC-ENABLED DEVICE
- Publication number 20120270499
- Publication date Oct 25, 2012
- INNOVISION RESEARCH & TECHNOLOGY PLC
- Robin Wilson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Voltage Regulation of Near Field Communication Communicators
- Publication number 20110306295
- Publication date Dec 15, 2011
- BROADCOM CORPORATION
- Paul Butler
- G05 - CONTROLLING REGULATING
Information Patent Application
TECHNIQUE FOR STABLE PROCESSING OF THIN/FRAGILE SUBSTRATES
- Publication number 20110266659
- Publication date Nov 3, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER SUBSTRATE FOR USE IN MEMS STRUCTURES
- Publication number 20110260265
- Publication date Oct 27, 2011
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE
- Publication number 20110042576
- Publication date Feb 24, 2011
- ICEMOS TECHNOLOGY LTD.
- Robin WILSON
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
NEAR FIELD RF COMMUNICATORS
- Publication number 20100291869
- Publication date Nov 18, 2010
- Robin Wilson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NEAR FIELD RF COMMUNICATORS AND NEAR FIELD COMMUNICATIONS ENABLED D...
- Publication number 20100167644
- Publication date Jul 1, 2010
- Ian Winter
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NFC COMMUNICATORS
- Publication number 20100112941
- Publication date May 6, 2010
- Innovision Research & Technology PLC
- Joakim Bangs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonded Wafer Substrate for Use in MEMS Structures
- Publication number 20100065946
- Publication date Mar 18, 2010
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...
- Publication number 20090253261
- Publication date Oct 8, 2009
- ICEMOS TECHNOLOGY LTD.
- Cormac MACNAMARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing a Photodiode Array with Through-Wafer Vias
- Publication number 20090224352
- Publication date Sep 10, 2009
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photodiode Having Increased Proportion of Light-Sensitive Area to L...
- Publication number 20090176330
- Publication date Jul 9, 2009
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Near field RF communicators and near field communications-enabled d...
- Publication number 20090011706
- Publication date Jan 8, 2009
- Innovision Research & Technology PLC
- Robin Wilson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...
- Publication number 20080315269
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED-WAFER SUPERJUNCTION SEMICONDUCTOR DEVICE
- Publication number 20080315247
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for Stable Processing of Thin/Fragile Substrates
- Publication number 20080315345
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Wafer Having Through-Wafer Vias
- Publication number 20080315368
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode
- Publication number 20080299698
- Publication date Dec 4, 2008
- Icemos Technology Corporation
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POSITIVE-INTRINSIC-NEGATIVE (PIN)/NEGATIVE-INTRINSIC-POSITIVE (NIP)...
- Publication number 20080246122
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...
- Publication number 20080248606
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...
- Publication number 20080248608
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Demodulator
- Publication number 20080143435
- Publication date Jun 19, 2008
- Innovision Research & Technology PLC
- Robin Wilson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter
- Publication number 20080122040
- Publication date May 29, 2008
- Icemos Technology Corporation
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PHOTODIODE ARRAY WITH THROUGH-WAFER VIAS
- Publication number 20080099870
- Publication date May 1, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Robin Wilson

Person

Patents Grantslast 30 patents

Near field RF communicator and timing apparatus

Tuneable NFC-enabled device

Detecting peaks in a received signal in a near field communications...

Near field RF communicators having refined energy sharing character...

Voltage regulation of near field communication communicators

NFC communicators implementing coil voltage reduction circuitry

Optimizing power consumption in a near field communications (NFC) e...

Reducing emissions in a near field communications (NFC) capable device

Near field RF communicators having refined energy sharing character...

Tuneable NFC-enabled device

NFC communicators implementing coil voltage reduction circuitry

Bonded wafer substrate utilizing roughened surfaces for use in MEMS...

Tuneable NFC device

Peak detector for detecting peaks in a modulated signal

Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...

Near field RF communicators and near field communications enabled d...

Technique for stable processing of thin/fragile substrates

Front lit PIN/NIP diode having a continuous anode/cathode

Method of fabricating a bonded wafer substrate for use in MEMS stru...

Technique for stable processing of thin/fragile substrates

Photodetector array using isolation diffusions as crosstalk inhibit...

Method of manufacturing a photodiode array with through-wafer vias

Photodetector array using isolation diffusions as crosstalk inhibit...

Photodetector array using isolation diffusions as crosstalk inhibit...

Photodiode having increased proportion of light-sensitive area to l...

Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...

Silicon wafer having through-wafer vias

Front side electrical contact for photodetector array and method of...

Bonded-wafer superjunction semiconductor device

Method of manufacturing a photodiode array with through-wafer vias

Patents Applicationslast 30 patents

NEAR FIELD RF COMMUNICATOR AND TIMING APPARATUS

NEAR FIELD RF COMMUNICATORS HAVING REFINED ENERGY SHARING CHARACTER...

Method and Apparatus for Controlling NFC Tag Power Dissipation

TUNEABLE NFC-ENABLED DEVICE

NFC Communicators Implementing Coil Voltage Reduction Circuitry

Varying Load Modulation in an NFC-Enabled Device Over a Range of Fi...

TUNEABLE NFC-ENABLED DEVICE

Voltage Regulation of Near Field Communication Communicators

TECHNIQUE FOR STABLE PROCESSING OF THIN/FRAGILE SUBSTRATES

BONDED WAFER SUBSTRATE FOR USE IN MEMS STRUCTURES

DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE

NEAR FIELD RF COMMUNICATORS

NEAR FIELD RF COMMUNICATORS AND NEAR FIELD COMMUNICATIONS ENABLED D...

NFC COMMUNICATORS

Bonded Wafer Substrate for Use in MEMS Structures

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...

Method of Manufacturing a Photodiode Array with Through-Wafer Vias

Photodiode Having Increased Proportion of Light-Sensitive Area to L...

Near field RF communicators and near field communications-enabled d...

PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...

BONDED-WAFER SUPERJUNCTION SEMICONDUCTOR DEVICE

Technique for Stable Processing of Thin/Fragile Substrates

Silicon Wafer Having Through-Wafer Vias

Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode

POSITIVE-INTRINSIC-NEGATIVE (PIN)/NEGATIVE-INTRINSIC-POSITIVE (NIP)...

PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...

FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...

Demodulator

Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter

METHOD OF MANUFACTURING A PHOTODIODE ARRAY WITH THROUGH-WAFER VIAS