Rock Nadeau

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Support and alignment device for enabling chemical mechanical polis...
- Patent number 6,579,149
- Issue date Jun 17, 2003
- International Business Machines Corporation
- Richard J. Lebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry recirculation in chemical mechanical polishing
- Patent number 6,458,020
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Jeffrey A. Brigante
- B24 - GRINDING POLISHING
Information Patent Grant
Method for reworking copper metallurgy in semiconductor devices
- Patent number 6,340,601
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Thomas F. Curran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing in-situ end point system
- Patent number 6,334,807
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Richard J. Lebel
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system and method for integrated spin...
- Patent number 6,319,093
- Issue date Nov 20, 2001
- International Business Machines Corporation
- Richard J. Lebel
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ pad conditioning process for CMP
- Patent number 6,022,266
- Issue date Feb 8, 2000
- International Business Machines Corporation
- Timothy Scott Bullard
- B24 - GRINDING POLISHING
Information Patent Grant
CMP wafer carrier for preferential polishing of a wafer
- Patent number 5,885,135
- Issue date Mar 23, 1999
- International Business Machines Corporation
- Daniel D. Desorcie
- B24 - GRINDING POLISHING
Information Patent Grant
Dishing and erosion monitor structure for damascene metal processing
- Patent number 5,874,318
- Issue date Feb 23, 1999
- Internatioal Business Machines Corporation
- Faye Diann Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing and erosion monitor structure for damascene metal processing
- Patent number 5,723,874
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Faye Diann Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotary signal coupling for chemical mechanical polishing endpoint d...
- Patent number 5,663,637
- Issue date Sep 2, 1997
- International Business Machines Corporation
- Leping Li
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Support and alignment device for enabling chemical mechanical polis...
- Publication number 20020106972
- Publication date Aug 8, 2002
- International Business Machines Corporation
- Richard J. Lebel
- H01 - BASIC ELECTRIC ELEMENTS

Rock Nadeau

Person

Patents Grantslast 30 patents

Support and alignment device for enabling chemical mechanical polis...

Slurry recirculation in chemical mechanical polishing

Method for reworking copper metallurgy in semiconductor devices

Chemical mechanical polishing in-situ end point system

Chemical-mechanical polishing system and method for integrated spin...

In-situ pad conditioning process for CMP

CMP wafer carrier for preferential polishing of a wafer

Dishing and erosion monitor structure for damascene metal processing

Dishing and erosion monitor structure for damascene metal processing

Rotary signal coupling for chemical mechanical polishing endpoint d...

Patents Applicationslast 30 patents

Support and alignment device for enabling chemical mechanical polis...