Roderick C. Mosely

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of ALD tantalum nitride for copper metallization
- Patent number 8,324,095
- Issue date Dec 4, 2012
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for the detection of high pressure conditions...
- Patent number 7,802,480
- Issue date Sep 28, 2010
- Thomas & Betts International, Inc.
- Roderick C. Mosely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning of native oxide with hydrogen-containing radicals
- Patent number 7,604,708
- Issue date Oct 20, 2009
- Applied Materials, Inc.
- Bingxi Sun Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum-type electrical switching apparatus
- Patent number 7,499,255
- Issue date Mar 3, 2009
- Thomas & Betts International, Inc.
- James Francis Domo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the detection of high pressure conditions...
- Patent number 7,497,122
- Issue date Mar 3, 2009
- Thomas & Betts International, Inc.
- Mary Grace Montesclaros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the sonic detection of high pressure condi...
- Patent number 7,383,733
- Issue date Jun 10, 2008
- Jennings Technology
- Roderick C. Mosely
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method and apparatus for the detection of high pressure conditions...
- Patent number 7,313,964
- Issue date Jan 1, 2008
- Jennings Technology
- Mary Grace Montesclaros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the detection of high pressure conditions...
- Patent number 7,302,854
- Issue date Dec 4, 2007
- Jennings Technology
- Roderick C. Mosely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End point detection for sputtering and resputtering
- Patent number 7,048,837
- Issue date May 23, 2006
- Applied Materials, Inc.
- Sasson R. Somekh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of ALD tantalum nitride for copper metallization
- Patent number 7,049,226
- Issue date May 23, 2006
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of TiSiN deposition using a chemical vapor deposition (CVD)...
- Patent number 6,933,021
- Issue date Aug 23, 2005
- Applied Materials, Inc.
- Jing-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reactive preclean prior to metallization for sub-quarter micron app...
- Patent number 6,905,965
- Issue date Jun 14, 2005
- Applied Materials, Inc.
- Suchitra Subrahmanyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature integrated metallization process and apparatus
- Patent number 6,743,714
- Issue date Jun 1, 2004
- Applied Materials, Inc.
- Roderick Craig Mosely
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature integrated metallization process and apparatus
- Patent number 6,726,776
- Issue date Apr 27, 2004
- Applied Materials, Inc.
- Roderick Craig Mosely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive preclean prior to metallization for sub-quarter micron app...
- Patent number 6,693,030
- Issue date Feb 17, 2004
- Applied Materials, Inc.
- Suchitra Subrahmanyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper interconnect barrier layer structure and formation method
- Patent number 6,607,976
- Issue date Aug 19, 2003
- Applied Materials, Inc.
- Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selective formation of a barrier layer for a contact leve...
- Patent number 6,518,176
- Issue date Feb 11, 2003
- Ted Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming aluminum lines over aluminum-filled vias in a se...
- Patent number 6,509,274
- Issue date Jan 21, 2003
- Applied Materials, Inc.
- Ted Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of a film on a semiconductor wafer
- Patent number 6,500,742
- Issue date Dec 31, 2002
- Applied Materials, Inc.
- Chyi Chern
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single step process for blanket-selective CVD aluminum deposition
- Patent number 6,458,684
- Issue date Oct 1, 2002
- Applied Materials, Inc.
- Ted Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Construction of a film on a semiconductor wafer
- Patent number 6,444,036
- Issue date Sep 3, 2002
- Applied Materials, Inc.
- Chyi Chern
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nitrogen treatment of a metal nitride/metal stack
- Patent number 6,436,819
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Zhi-Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-selective chemical vapor deposition
- Patent number 6,430,458
- Issue date Aug 6, 2002
- Applied Materials, Inc.
- Roderick Craig Mosely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming metal interconnects
- Patent number 6,372,633
- Issue date Apr 16, 2002
- Applied Materials, Inc.
- Dan Maydan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature integrated metallization process and apparatus
- Patent number 6,355,560
- Issue date Mar 12, 2002
- Applied Materials, Inc.
- Roderick Craig Mosely
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment for ex-situ contact fill
- Patent number 6,297,147
- Issue date Oct 2, 2001
- Applied Materials, Inc.
- Lisa Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Construction of a film on a semiconductor wafer
- Patent number 6,251,758
- Issue date Jun 26, 2001
- Applied Materials, Inc.
- Chyi Chern
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
REFLECTIVE FOURIER PTYCHOGRAPHY IMAGING OF LARGE SURFACES
- Publication number 20220413276
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Collin Michael Anderson
- G01 - MEASURING TESTING
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION
- Publication number 20100075494
- Publication date Mar 25, 2010
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for the detection of high pressure conditions...
- Publication number 20090173160
- Publication date Jul 9, 2009
- Roderick C. Mosely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for the detection of high pressure conditions...
- Publication number 20080072678
- Publication date Mar 27, 2008
- Mary Grace Montesclaros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for the sonic detection of high pressure condi...
- Publication number 20070089521
- Publication date Apr 26, 2007
- Roderick C. Mosely
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Method and apparatus for the detection of high pressure conditions...
- Publication number 20060278010
- Publication date Dec 14, 2006
- Mary Grace Montesclaros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of ALD tantalum nitride for copper metallization
- Publication number 20060148253
- Publication date Jul 6, 2006
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Vacuum-type electrical switching apparatus
- Publication number 20060126257
- Publication date Jun 15, 2006
- James Francis Domo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
End point detection for sputtering and resputtering
- Publication number 20050173239
- Publication date Aug 11, 2005
- APPLIED MATERIALS, INC.
- Sasson R. Somekh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration of ALD tantalum nitride for copper metallization
- Publication number 20050106865
- Publication date May 19, 2005
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reactive preclean prior to metallization for sub-quarter micron app...
- Publication number 20040248404
- Publication date Dec 9, 2004
- APPLIED MATERIALS, INC.
- Suchitra Subrahmanyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cleaning of native oxide with hydrogen-containing radicals
- Publication number 20040219789
- Publication date Nov 4, 2004
- APPLIED MATERIALS, INC.
- Bingxi Sun Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20030116427
- Publication date Jun 26, 2003
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper interconnect barrier layer structure and formation method
- Publication number 20030059980
- Publication date Mar 27, 2003
- Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability barrier integration for Cu application
- Publication number 20030017695
- Publication date Jan 23, 2003
- APPLIED MATERIALS, INC.
- Fusen Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reliability barrier integration for Cu application
- Publication number 20030013297
- Publication date Jan 16, 2003
- APPLIED MATERIALS, INC.
- Fusen Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for detecting the thickness of copper oxide
- Publication number 20020186381
- Publication date Dec 12, 2002
- Suchitra Subrahmanyan
- G01 - MEASURING TESTING
Information Patent Application
Method of TiSiN deposition using a chemical vapor deposition (CVD)...
- Publication number 20020168468
- Publication date Nov 14, 2002
- APPLIED MATERIALS, INC.
- Jing-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of tisin deposition using a chemical vapor deposition process
- Publication number 20020114886
- Publication date Aug 22, 2002
- APPLIED MATERIALS, INC.
- Jing-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Single step process for blanket-selective cvd aluminum deposition
- Publication number 20020068427
- Publication date Jun 6, 2002
- Ted Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming metal interconnects
- Publication number 20020058408
- Publication date May 16, 2002
- APPLIED MATERIALS, INC.
- Dan Maydan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT
- Publication number 20020033533
- Publication date Mar 21, 2002
- MARVIN LIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Construction of a film on a semiconductor wafer
- Publication number 20010025205
- Publication date Sep 27, 2001
- APPLIED MATERIALS, INC.
- Chyi Chern
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT LEVEL VIA AND METHOD OF SELECTIVE FORMATION OF A BARRIER LA...
- Publication number 20010001503
- Publication date May 24, 2001
- TED GUO
- H01 - BASIC ELECTRIC ELEMENTS

Roderick C. Mosely

Person

Patents Grantslast 30 patents

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Integration of ALD tantalum nitride for copper metallization

Method and apparatus for the detection of high pressure conditions...

Cleaning of native oxide with hydrogen-containing radicals

Vacuum-type electrical switching apparatus

Method and apparatus for the detection of high pressure conditions...

Method and apparatus for the sonic detection of high pressure condi...

Method and apparatus for the detection of high pressure conditions...

Method and apparatus for the detection of high pressure conditions...

End point detection for sputtering and resputtering

Integration of ALD tantalum nitride for copper metallization

Method of TiSiN deposition using a chemical vapor deposition (CVD)...

Reactive preclean prior to metallization for sub-quarter micron app...

Low temperature integrated metallization process and apparatus

Low temperature integrated metallization process and apparatus

Reactive preclean prior to metallization for sub-quarter micron app...

Copper interconnect barrier layer structure and formation method

Method of selective formation of a barrier layer for a contact leve...

Method for forming aluminum lines over aluminum-filled vias in a se...

Construction of a film on a semiconductor wafer

Single step process for blanket-selective CVD aluminum deposition

Construction of a film on a semiconductor wafer

Nitrogen treatment of a metal nitride/metal stack

Semi-selective chemical vapor deposition

Method and apparatus for forming metal interconnects

Low temperature integrated metallization process and apparatus

Plasma treatment for ex-situ contact fill

Construction of a film on a semiconductor wafer

Patents Applicationslast 30 patents

REFLECTIVE FOURIER PTYCHOGRAPHY IMAGING OF LARGE SURFACES

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Method and apparatus for the detection of high pressure conditions...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Method and apparatus for the detection of high pressure conditions...

Method and apparatus for the sonic detection of high pressure condi...

Method and apparatus for the detection of high pressure conditions...

Integration of ALD tantalum nitride for copper metallization

Vacuum-type electrical switching apparatus

Self-ionized and inductively-coupled plasma for sputtering and resp...

End point detection for sputtering and resputtering

Integration of ALD tantalum nitride for copper metallization

Self-ionized and inductively-coupled plasma for sputtering and resp...

Reactive preclean prior to metallization for sub-quarter micron app...

Cleaning of native oxide with hydrogen-containing radicals

Self-ionized and inductively-coupled plasma for sputtering and resp...

Copper interconnect barrier layer structure and formation method

Reliability barrier integration for Cu application

Reliability barrier integration for Cu application

Method and apparatus for detecting the thickness of copper oxide

Method of TiSiN deposition using a chemical vapor deposition (CVD)...

Method of tisin deposition using a chemical vapor deposition process

Single step process for blanket-selective cvd aluminum deposition

Method and apparatus for forming metal interconnects

INTERCONNECT STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT

Construction of a film on a semiconductor wafer

CONTACT LEVEL VIA AND METHOD OF SELECTIVE FORMATION OF A BARRIER LA...