Roger A. Emigh

Person

Post Falls, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit protruding pad package system and method for man...
- Patent number 8,587,098
- Issue date Nov 19, 2013
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit protruding pad package system
- Patent number 7,968,377
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packaging and fabrication method
- Patent number 7,064,430
- Issue date Jun 20, 2006
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders, heat spreader packages, and fabrication methods for...
- Patent number 6,775,140
- Issue date Aug 10, 2004
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having fibrous interface
- Patent number 6,740,972
- Issue date May 25, 2004
- Honeywell International Inc.
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant fibrous thermal interface
- Patent number 6,713,151
- Issue date Mar 30, 2004
- Honeywell International Inc.
- Nancy F. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having fibrous interface
- Patent number 6,617,199
- Issue date Sep 9, 2003
- Honeywell International Inc.
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,809,393
- Issue date Sep 15, 1998
- Johnson Matthey Electronics, Inc.
- John Alden Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,780,755
- Issue date Jul 14, 1998
- Johnson Matthey Electronics, Inc.
- John Alden Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Metal sputtering target assembly
- Patent number 5,687,600
- Issue date Nov 18, 1997
- Johnson Matthey Electronics, Inc.
- Roger Alan Emigh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,590,389
- Issue date Dec 31, 1996
- Johnson Matthey Electronics, Inc.
- John A. Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MAN...
- Publication number 20110233744
- Publication date Sep 29, 2011
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die packaging and fabrication method
- Publication number 20060043559
- Publication date Mar 2, 2006
- STATS ChipPAC Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreaders, heat spreader packages, and fabrication methods for...
- Publication number 20040075987
- Publication date Apr 22, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having fibrous interface
- Publication number 20010052652
- Publication date Dec 20, 2001
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having fibrous interface
- Publication number 20010023968
- Publication date Sep 27, 2001
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS

Roger A. Emigh

Person

Patents Grantslast 30 patents

Integrated circuit protruding pad package system and method for man...

Integrated circuit protruding pad package system

Stacked die packaging and fabrication method

Heat spreaders, heat spreader packages, and fabrication methods for...

Electronic device having fibrous interface

Compliant fibrous thermal interface

Electronic device having fibrous interface

Sputtering target with ultra-fine, oriented grains and method of ma...

Sputtering target with ultra-fine, oriented grains and method of ma...

Metal sputtering target assembly

Sputtering target with ultra-fine, oriented grains and method of ma...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MAN...

Stacked die packaging and fabrication method

Heat spreaders, heat spreader packages, and fabrication methods for...

Electronic device having fibrous interface

Electronic device having fibrous interface