Roger D. Weekly

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Implementing high-speed signaling via dedicated printed circuit-boa...
- Patent number 11,076,493
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module power supply
- Patent number 10,765,002
- Issue date Sep 1, 2020
- International Business Machines Corporation
- Michael A Christo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 10,375,820
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module power supply
- Patent number 10,362,674
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Michael A Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module power supply
- Patent number 10,080,285
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Michael A Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing high-speed signaling via dedicated printed circuit-boa...
- Patent number 10,034,393
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 9,955,567
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module power supply
- Patent number 9,456,498
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Michael A Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit substrate fabrication method providing improved...
- Patent number 8,962,475
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard assembly for interconnecting and distributing signals a...
- Patent number 8,958,214
- Issue date Feb 17, 2015
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 8,927,879
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for designing substrates having reference plane voids with s...
- Patent number 8,813,000
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,742,565
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,645,889
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,638,567
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit substrate fabrication and design methods provid...
- Patent number 8,624,297
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,625,300
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing high-speed signaling via dedicated printed circuit-boa...
- Patent number 8,619,432
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing an optical fiber connection
- Patent number 8,593,621
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Kevin J. Bills
- G01 - MEASURING TESTING
Information Patent Grant
Method of attaching an electronic module power supply
- Patent number 8,572,840
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Michael A Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for multi-application socket
- Patent number 8,514,583
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Roger D. Weekly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for integrated circuit module tamperproof mode pe...
- Patent number 8,451,020
- Issue date May 28, 2013
- International Business Machines Corporation
- Roger D. Weekly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard assembly for interconnecting and distributing signals a...
- Patent number 8,446,738
- Issue date May 21, 2013
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,399,981
- Issue date Mar 19, 2013
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,338,948
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,325,490
- Issue date Dec 4, 2012
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for enhancing reference return current conduction
- Patent number 8,295,058
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Joseph J. Cahill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,288,657
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced thermal management for improved module reliability
- Patent number 8,214,658
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Jon A. Casey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Power delivery analysis and design
- Patent number 8,055,486
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Daniel Douriet
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE POWER SUPPLY
- Publication number 20190306977
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Michael A. Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE POWER SUPPLY
- Publication number 20190014662
- Publication date Jan 10, 2019
- International Business Machines Corporation
- Michael A. Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...
- Publication number 20180352662
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20180213636
- Publication date Jul 26, 2018
- JINWOO CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC MODULE POWER SUPPLY
- Publication number 20160255722
- Publication date Sep 1, 2016
- International Business Machines Corporation
- Michael A. Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20140331482
- Publication date Nov 13, 2014
- JINWOO CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...
- Publication number 20140075749
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...
- Publication number 20140080300
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Sungjun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...
- Publication number 20140033146
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC MODULE POWER SUPPLY
- Publication number 20140029221
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Michael A. Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array with Improved Single-Ended and Differential Signal...
- Publication number 20130087918
- Publication date Apr 11, 2013
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motherboard Assembly for Interconnecting and Distributing Signals a...
- Publication number 20130055192
- Publication date Feb 28, 2013
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Application
BALL GRID ARRAY WITH IMPROVED SINGLE-ENDED AND DIFFERENTIAL SIGNAL...
- Publication number 20130015573
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...
- Publication number 20120331429
- Publication date Dec 27, 2012
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...
- Publication number 20120331430
- Publication date Dec 27, 2012
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20120204141
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20120125677
- Publication date May 24, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR MULTI-APPLICATION SOCKET
- Publication number 20120120576
- Publication date May 17, 2012
- International Business Machines Corporation
- Roger D. Weekly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC MODULE POWER SUPPLY
- Publication number 20120081859
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Michael A. Christo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...
- Publication number 20120081873
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATED CIRCUIT MODULE TAMPERPROOF MODE PE...
- Publication number 20120081142
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Roger D. Weekly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array with Improved Single-Ended and Differential Signal...
- Publication number 20120001327
- Publication date Jan 5, 2012
- International Business Machines Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing An Optical Fiber Connection
- Publication number 20110267602
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Kevin J. Bills
- G01 - MEASURING TESTING
Information Patent Application
Structure for Enhancing Reference Return Current Conduction
- Publication number 20110147068
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Joseph J. Cahill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Motherboard Assembly for Interconnecting and Distributing Signals a...
- Publication number 20110085313
- Publication date Apr 14, 2011
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20110083888
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...
- Publication number 20100261346
- Publication date Oct 14, 2010
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON INTERPOSER TESTING FOR THREE DIMENSIONAL CHIP STACK
- Publication number 20100155888
- Publication date Jun 24, 2010
- International Business Machines Corporation
- Michael Anthony Christo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Thermal Management for Improved Module Reliability
- Publication number 20100049995
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tracking Thermal Mini-Cycle Stress
- Publication number 20100049466
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING

Roger D. Weekly

Person

Patents Grantslast 30 patents

Implementing high-speed signaling via dedicated printed circuit-boa...

Electronic module power supply

Crosstalk reduction between signal layers in a multilayered package...

Electronic module power supply

Electronic module power supply

Implementing high-speed signaling via dedicated printed circuit-boa...

Crosstalk reduction between signal layers in a multilayered package...

Electronic module power supply

Multi-layer circuit substrate fabrication method providing improved...

Motherboard assembly for interconnecting and distributing signals a...

Crosstalk reduction between signal layers in a multilayered package...

System for designing substrates having reference plane voids with s...

Ball grid array with improved single-ended and differential signal...

Noise coupling reduction and impedance discontinuity control in hig...

Circuit manufacturing and design techniques for reference plane voi...

Multi-layer circuit substrate fabrication and design methods provid...

Circuit manufacturing and design techniques for reference plane voi...

Implementing high-speed signaling via dedicated printed circuit-boa...

Testing an optical fiber connection

Method of attaching an electronic module power supply

System and method for multi-application socket

System and method for integrated circuit module tamperproof mode pe...

Motherboard assembly for interconnecting and distributing signals a...

Ball grid array with improved single-ended and differential signal...

Ball grid array with improved single-ended and differential signal...

Circuit manufacturing and design techniques for reference plane voi...

Structure for enhancing reference return current conduction

Noise coupling reduction and impedance discontinuity control in hig...

Enhanced thermal management for improved module reliability

Power delivery analysis and design

Patents Applicationslast 30 patents

ELECTRONIC MODULE POWER SUPPLY

ELECTRONIC MODULE POWER SUPPLY

IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

ELECTRONIC MODULE POWER SUPPLY

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...

MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...

SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...

ELECTRONIC MODULE POWER SUPPLY

Ball Grid Array with Improved Single-Ended and Differential Signal...

Motherboard Assembly for Interconnecting and Distributing Signals a...

BALL GRID ARRAY WITH IMPROVED SINGLE-ENDED AND DIFFERENTIAL SIGNAL...

CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...

CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

SYSTEM AND METHOD FOR MULTI-APPLICATION SOCKET

ELECTRONIC MODULE POWER SUPPLY

IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOA...

SYSTEM AND METHOD FOR INTEGRATED CIRCUIT MODULE TAMPERPROOF MODE PE...

Ball Grid Array with Improved Single-Ended and Differential Signal...

Testing An Optical Fiber Connection

Structure for Enhancing Reference Return Current Conduction

Motherboard Assembly for Interconnecting and Distributing Signals a...

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...

SILICON INTERPOSER TESTING FOR THREE DIMENSIONAL CHIP STACK

Enhanced Thermal Management for Improved Module Reliability

Tracking Thermal Mini-Cycle Stress