Rohan Akolkar

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nanopore sequencers
- Patent number 11,567,060
- Issue date Jan 31, 2023
- Illumina, Inc.
- Boyan Boyanov
- G01 - MEASURING TESTING
Information Patent Grant
Electrochemical sensor for lead detection
- Patent number 11,125,717
- Issue date Sep 21, 2021
- Case Western Reserve University
- Rohan Akolkar
- G01 - MEASURING TESTING
Information Patent Grant
Iron boron alloy coatings and a process for their preparation
- Patent number 9,783,891
- Issue date Oct 10, 2017
- Atotech Deutschland GmbH
- Jacob Blickensderfer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless Cu plating for enhanced self-forming barrier layers
- Patent number 8,766,342
- Issue date Jul 1, 2014
- Intel Corporation
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layers
- Patent number 8,508,018
- Issue date Aug 13, 2013
- Intel Corporation
- Rohan N. Akolkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless Cu plating for enhanced self-forming barrier layers
- Patent number 8,138,084
- Issue date Mar 20, 2012
- Intel Corporation
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal interconnects for improved gap-fill, reliability, and re...
- Patent number 7,867,891
- Issue date Jan 11, 2011
- Intel Corporation
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating chemistries and methods of forming interconnections
- Patent number 7,338,585
- Issue date Mar 4, 2008
- Intel Corporation
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIMENSIONALLY STABLE ANODE FOR ELECTROLYTIC CHLORINE EVOLUTION IN M...
- Publication number 20240158935
- Publication date May 16, 2024
- Case Western Reserve University
- Rohan Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND PROCESS FOR SUSTAINABLE ELECTROWINNING OF METAL
- Publication number 20230279572
- Publication date Sep 7, 2023
- Case Western Reserve University
- Rohan Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL SENSOR FOR LEAD DETECTION
- Publication number 20220011263
- Publication date Jan 13, 2022
- Case Western Reserve University
- Rohan Akolkar
- G01 - MEASURING TESTING
Information Patent Application
NANOPORE SEQUENCERS
- Publication number 20200132664
- Publication date Apr 30, 2020
- Illumina, Inc.
- Boyan Boyanov
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
IRON BORON ALLOY COATINGS AND A PROCESS FOR THEIR PREPARATION
- Publication number 20170121824
- Publication date May 4, 2017
- Atotech Deutschland GmbH
- Jacob BLICKENSDERFER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROWINNING CELL AND PROCESS
- Publication number 20150021195
- Publication date Jan 22, 2015
- Case Western Reserve University
- Rohan Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS CU PLATING FOR ENHANCED SELF-FORMING BARRIER LAYERS
- Publication number 20120175776
- Publication date Jul 12, 2012
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT METAL BARRIER LAYERS
- Publication number 20120161320
- Publication date Jun 28, 2012
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIERLESS SINGLE-PHASE INTERCONNECT
- Publication number 20120153483
- Publication date Jun 21, 2012
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS
- Publication number 20120077053
- Publication date Mar 29, 2012
- Rohan N. Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS CU PLATING FOR ENHANCED SELF-FORMING BARRIER LAYERS
- Publication number 20110147940
- Publication date Jun 23, 2011
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND RE...
- Publication number 20110079910
- Publication date Apr 7, 2011
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dopant Enhanced Interconnect
- Publication number 20100200991
- Publication date Aug 12, 2010
- Rohan Akolkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dual metal interconnects for improved gap-fill, reliability, and re...
- Publication number 20100140804
- Publication date Jun 10, 2010
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER METALLIZATION UTILIZING REFLOW ON NOBLE METAL LINERS
- Publication number 20090169760
- Publication date Jul 2, 2009
- Rohan Akolkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of fabricating metal interconnects using a sacrificial layer...
- Publication number 20080113508
- Publication date May 15, 2008
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial tapered trench opening for damascene interconnects
- Publication number 20080026555
- Publication date Jan 31, 2008
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating Chemistries and Methods of Forming Interconnections
- Publication number 20070267297
- Publication date Nov 22, 2007
- Rohan N. Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Rohan Akolkar

Person

Patents Grantslast 30 patents

Nanopore sequencers

Electrochemical sensor for lead detection

Iron boron alloy coatings and a process for their preparation

Electroless Cu plating for enhanced self-forming barrier layers

Barrier layers

Electroless Cu plating for enhanced self-forming barrier layers

Dual metal interconnects for improved gap-fill, reliability, and re...

Electroplating chemistries and methods of forming interconnections

Patents Applicationslast 30 patents

DIMENSIONALLY STABLE ANODE FOR ELECTROLYTIC CHLORINE EVOLUTION IN M...

SYSTEM AND PROCESS FOR SUSTAINABLE ELECTROWINNING OF METAL

ELECTROCHEMICAL SENSOR FOR LEAD DETECTION

NANOPORE SEQUENCERS

IRON BORON ALLOY COATINGS AND A PROCESS FOR THEIR PREPARATION

ELECTROWINNING CELL AND PROCESS

ELECTROLESS CU PLATING FOR ENHANCED SELF-FORMING BARRIER LAYERS

COBALT METAL BARRIER LAYERS

BARRIERLESS SINGLE-PHASE INTERCONNECT

BARRIER LAYERS

ELECTROLESS CU PLATING FOR ENHANCED SELF-FORMING BARRIER LAYERS

DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND RE...

Dopant Enhanced Interconnect

Dual metal interconnects for improved gap-fill, reliability, and re...

COPPER METALLIZATION UTILIZING REFLOW ON NOBLE METAL LINERS

Method of fabricating metal interconnects using a sacrificial layer...

Sacrificial tapered trench opening for damascene interconnects

Electroplating Chemistries and Methods of Forming Interconnections