Roland Hampp

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating isolation regions of semiconductor devices a...
- Patent number 8,936,995
- Issue date Jan 20, 2015
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-inducing structures, methods, and materials
- Patent number 8,361,879
- Issue date Jan 29, 2013
- Infineon Technologies AG
- Alois Gutmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned silicided contacts
- Patent number 8,187,962
- Issue date May 29, 2012
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned silicided contacts
- Patent number 8,159,038
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive features and structures thereof
- Patent number 7,947,606
- Issue date May 24, 2011
- Infineon Technologies AG
- Jiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Threshold voltage consistency and effective width in same-substrate...
- Patent number 7,892,939
- Issue date Feb 22, 2011
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming isolation structures
- Patent number 7,795,107
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device performance improvement using flowfill as material for isola...
- Patent number 7,615,840
- Issue date Nov 10, 2009
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,235,485
- Issue date Jun 26, 2007
- Samsung Electronics Co., Ltd.
- Jun-keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming Conductive Features and Structures Thereof
- Publication number 20110175148
- Publication date Jul 21, 2011
- Jiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Silicided Contacts
- Publication number 20100190328
- Publication date Jul 29, 2010
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Isolation Structures
- Publication number 20090317957
- Publication date Dec 24, 2009
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Features and Structures Thereof
- Publication number 20090294986
- Publication date Dec 3, 2009
- Jiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-Inducing Structures, Methods, and Materials
- Publication number 20090283852
- Publication date Nov 19, 2009
- Alois Gutmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Threshold Voltage Consistency and Effective Width in Same-Substrate...
- Publication number 20090227086
- Publication date Sep 10, 2009
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Silicided Contacts
- Publication number 20090218640
- Publication date Sep 3, 2009
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Copper Integration in the FEOL
- Publication number 20090218692
- Publication date Sep 3, 2009
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Performance Improvement Using FlowFill as Material for Isola...
- Publication number 20080315267
- Publication date Dec 25, 2008
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gapfill for metal contacts
- Publication number 20080311711
- Publication date Dec 18, 2008
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultraviolet (UV) Radiation Treatment Methods for Subatmospheric Che...
- Publication number 20070249128
- Publication date Oct 25, 2007
- Junjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating isolation regions of semiconductor devices a...
- Publication number 20070205489
- Publication date Sep 6, 2007
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070087560
- Publication date Apr 19, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Jun-keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS

Roland Hampp

Person

Patents Grantslast 30 patents

Methods of fabricating isolation regions of semiconductor devices a...

Stress-inducing structures, methods, and materials

Self aligned silicided contacts

Self aligned silicided contacts

Methods of forming conductive features and structures thereof

Threshold voltage consistency and effective width in same-substrate...

Method for forming isolation structures

Device performance improvement using flowfill as material for isola...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

Methods of Forming Conductive Features and Structures Thereof

Self Aligned Silicided Contacts

Method for Forming Isolation Structures

Methods of Forming Conductive Features and Structures Thereof

Stress-Inducing Structures, Methods, and Materials

Threshold Voltage Consistency and Effective Width in Same-Substrate...

Self Aligned Silicided Contacts

Barrier for Copper Integration in the FEOL

Device Performance Improvement Using FlowFill as Material for Isola...

Gapfill for metal contacts

Ultraviolet (UV) Radiation Treatment Methods for Subatmospheric Che...

Methods of fabricating isolation regions of semiconductor devices a...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE