Roland W. Gooch

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 10,315,918
- Issue date Jun 11, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 10,262,913
- Issue date Apr 16, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,966,320
- Issue date May 8, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,520,332
- Issue date Dec 13, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 9,427,776
- Issue date Aug 30, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaged infrared (IR) focal plane array (FPA) with eva...
- Patent number 9,227,839
- Issue date Jan 5, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter structure and method for forming such structure
- Patent number 9,196,556
- Issue date Nov 24, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 9,132,496
- Issue date Sep 15, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming deposited patterns on a surface
- Patent number 9,105,800
- Issue date Aug 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,093,444
- Issue date Jul 28, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Disposable bond gap control structures
- Patent number 9,073,298
- Issue date Jul 7, 2015
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 8,844,793
- Issue date Sep 30, 2014
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Incident radiation detector packaging
- Patent number 8,809,784
- Issue date Aug 19, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Disposable bond gap control structures
- Patent number 8,454,789
- Issue date Jun 4, 2013
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Color correction for radiation detectors
- Patent number 8,153,980
- Issue date Apr 10, 2012
- L-3 Communications Corp.
- John F. Brady
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,977,208
- Issue date Jul 12, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,867,874
- Issue date Jan 11, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared detector elements and methods of forming same
- Patent number 7,655,909
- Issue date Feb 2, 2010
- L-3 Communications Corporation
- Thomas R. Schimert
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,535,093
- Issue date May 19, 2009
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for solder bonding
- Patent number 7,528,061
- Issue date May 5, 2009
- L-3 Communications Corporation
- Athanasios J. Syllaios
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted infrared image detector systems and associated methods
- Patent number 7,514,684
- Issue date Apr 7, 2009
- L-3 Communications Corporation
- Roland W. Gooch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for bonding
- Patent number 7,462,831
- Issue date Dec 9, 2008
- L-3 Communications Corporation
- Roland W. Gooch
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for integrating focal plane arrays
- Patent number 7,459,686
- Issue date Dec 2, 2008
- L-3 Communications Corporation
- Athanasios J. Syllaios
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optically blocked reference pixels for focal plane arrays
- Patent number 7,375,331
- Issue date May 20, 2008
- L-3 Communications Corporation
- Thomas R. Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically blocked reference pixels for focal plane arrays
- Patent number 7,262,412
- Issue date Aug 28, 2007
- L-3 Communications Corporation
- Thomas R. Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-wavelength structures for reduction of reflective properties
- Patent number 7,220,621
- Issue date May 22, 2007
- L-3 Communications Corporation
- Athanasios J. Syllaios
- G02 - OPTICS
Information Patent Grant
Vacuum package fabrication of integrated circuit components
- Patent number 7,015,074
- Issue date Mar 21, 2006
- L-3 Communications Corporation
- Athanasios J. Syllaios
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20180226309
- Publication date Aug 9, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20170011977
- Publication date Jan 12, 2017
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20160340179
- Publication date Nov 24, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20160040282
- Publication date Feb 11, 2016
- Raytheon Company
- Roland Gooch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...
- Publication number 20150321905
- Publication date Nov 12, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150279755
- Publication date Oct 1, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20150249042
- Publication date Sep 3, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE
- Publication number 20150162479
- Publication date Jun 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING FORMATION OF OXIDE ON SOLDER
- Publication number 20150076216
- Publication date Mar 19, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150014854
- Publication date Jan 15, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE
- Publication number 20140175590
- Publication date Jun 26, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20140053966
- Publication date Feb 27, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPOSABLE BOND GAP CONTROL STRUCTURES
- Publication number 20130255876
- Publication date Oct 3, 2013
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Disposable Bond Gap Control Structures
- Publication number 20120111492
- Publication date May 10, 2012
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reducing Formation Of Oxide On Solder
- Publication number 20120111925
- Publication date May 10, 2012
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Incident Radiation Detector Packaging
- Publication number 20120096813
- Publication date Apr 26, 2012
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Packaging Circuit Devices
- Publication number 20110097845
- Publication date Apr 28, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Packaging Circuit Devices
- Publication number 20090227068
- Publication date Sep 10, 2009
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Surface mounted infrared image detector systems and associated methods
- Publication number 20080048120
- Publication date Feb 28, 2008
- Roland W. Gooch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optically blocked reference pixels for focal plane arrays
- Publication number 20070262407
- Publication date Nov 15, 2007
- L-3 Integrated Systems Company
- Thomas R. Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for integrating focal plane arrays
- Publication number 20070170359
- Publication date Jul 26, 2007
- Athanasios J. Syllaios
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Systems and methods for bonding
- Publication number 20070170360
- Publication date Jul 26, 2007
- Roland W. Gooch
- G01 - MEASURING TESTING
Information Patent Application
Infrared detector elements and methods of forming same
- Publication number 20070170363
- Publication date Jul 26, 2007
- Thomas R. Schimert
- G01 - MEASURING TESTING
Information Patent Application
Optically blocked reference pixels for focal plane arrays
- Publication number 20060124831
- Publication date Jun 15, 2006
- Thomas R. Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for solder bonding
- Publication number 20060128136
- Publication date Jun 15, 2006
- Athanasios J. Syllaios
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sub-wavelength structures for reduction of reflective properties
- Publication number 20050054212
- Publication date Mar 10, 2005
- Raytheon Company, a Delaware corporation
- Athanasios J. Syllaios
- G02 - OPTICS
Information Patent Application
Vacuum package fabrication of integrated circuit components
- Publication number 20050042839
- Publication date Feb 24, 2005
- Raytheon Company, a Delaware corporation
- Athanasios J. Syllaios
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Roland W. Gooch

Person

Patents Grantslast 30 patents

Method of stress relief in anti-reflective coated cap wafers for wa...

Wafer level package solder barrier used as vacuum getter

Wafer level package solder barrier used as vacuum getter

Wafer level package solder barrier used as vacuum getter

Method of stress relief in anti-reflective coated cap wafers for wa...

Wafer level packaged infrared (IR) focal plane array (FPA) with eva...

Getter structure and method for forming such structure

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Reducing formation of oxide on solder

Method of forming deposited patterns on a surface

Wafer level package solder barrier used as vacuum getter

Disposable bond gap control structures

Reducing formation of oxide on solder

Incident radiation detector packaging

Integrated bondline spacers for wafer level packaged circuit devices

Disposable bond gap control structures

Color correction for radiation detectors

Method and apparatus for packaging circuit devices

Method and apparatus for packaging circuit devices

Infrared detector elements and methods of forming same

Method and apparatus for packaging circuit devices

Systems and methods for solder bonding

Surface mounted infrared image detector systems and associated methods

Systems and methods for bonding

Systems and methods for integrating focal plane arrays

Optically blocked reference pixels for focal plane arrays

Optically blocked reference pixels for focal plane arrays

Sub-wavelength structures for reduction of reflective properties

Vacuum package fabrication of integrated circuit components

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE

REDUCING FORMATION OF OXIDE ON SOLDER

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

DISPOSABLE BOND GAP CONTROL STRUCTURES

Disposable Bond Gap Control Structures

Reducing Formation Of Oxide On Solder

Incident Radiation Detector Packaging

Method and Apparatus for Packaging Circuit Devices

Method and Apparatus for Packaging Circuit Devices

Surface mounted infrared image detector systems and associated methods

Optically blocked reference pixels for focal plane arrays

Systems and methods for integrating focal plane arrays

Systems and methods for bonding

Infrared detector elements and methods of forming same

Optically blocked reference pixels for focal plane arrays

Systems and methods for solder bonding

Sub-wavelength structures for reduction of reflective properties

Vacuum package fabrication of integrated circuit components