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Romel N. Manatad
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Cebu, PH
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Patents Grants
last 30 patents
Information
Patent Grant
Concealed gate terminal semiconductor packages and related methods
Patent number
11,791,247
Issue date
Oct 17, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Erwin Ian Vamenta Almagro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate interposer on a leaderframe
Patent number
11,296,069
Issue date
Apr 5, 2022
Semiconductor Components Industries, LLC
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical and horizontal circuit assemblies
Patent number
11,177,203
Issue date
Nov 16, 2021
FAIRCHILD SEMICONDUCTOR CORPORATION
Jerome Teysseyre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with clip interconnect and dual side c...
Patent number
11,088,046
Issue date
Aug 10, 2021
Semiconductor Components Industries, LLC
Maria Cristina Estacio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate interposer on a leadframe
Patent number
10,546,847
Issue date
Jan 28, 2020
FAIRCHILD SEMICONDUCTOR CORPORATION
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical and horizontal circuit assemblies
Patent number
10,256,178
Issue date
Apr 9, 2019
FAIRCHILD SEMICONDUCTOR CORPORATION
Jerome Teysseyre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless module with active devices
Patent number
9,698,143
Issue date
Jul 4, 2017
Fairchild Semiconductor Corporation
Allan Tungul Flores
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and designs for localized wafer thinning
Patent number
8,624,393
Issue date
Jan 7, 2014
Fairchild Semiconductor Corporation
Suku Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and designs for localized wafer thinning
Patent number
8,158,506
Issue date
Apr 17, 2012
Fairchild Semiconductor Corporation
Suku Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust leaded molded packages and methods for forming the same
Patent number
7,906,837
Issue date
Mar 15, 2011
Fairchild Semiconductor Corporation
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power quad flat no-lead semiconductor die packages with isolated he...
Patent number
7,816,784
Issue date
Oct 19, 2010
Fairchild Semiconductor Corporation
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device with dual exposed surfaces and method...
Patent number
7,816,178
Issue date
Oct 19, 2010
Fairchild Semiconductor Corporation
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alternative flip chip in leaded molded package design and method fo...
Patent number
7,586,178
Issue date
Sep 8, 2009
Fairchild Semiconductor Corporation
Romel N. Manatad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip in leaded molded package and method of manufacture thereof
Patent number
7,582,956
Issue date
Sep 1, 2009
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device with dual exposed surfaces and method...
Patent number
7,576,429
Issue date
Aug 18, 2009
Fairchild Semiconductor Corporation
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust leaded molded packages and methods for forming the same
Patent number
7,560,311
Issue date
Jul 14, 2009
Fairchild Semiconductor Corporation
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to manufacture a universal footprint for a package with expo...
Patent number
7,256,479
Issue date
Aug 14, 2007
Fairchild Semiconductor Corporation
Jonathan A. Noquil
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Alternative flip chip in leaded molded package design and method fo...
Patent number
7,217,594
Issue date
May 15, 2007
Fairchild Semiconductor Corporation
Romel N. Manatad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip in leaded molded package and method of manufacture thereof
Patent number
7,215,011
Issue date
May 8, 2007
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip in leaded molded package and method of manufacture thereof
Patent number
7,154,168
Issue date
Dec 26, 2006
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust leaded molded packages and methods for forming the same
Patent number
7,122,884
Issue date
Oct 17, 2006
Fairchild Semiconductor Corporation
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip in leaded molded package and method of manufacture thereof
Patent number
6,949,410
Issue date
Sep 27, 2005
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for maintaining solder thickness in flipchip attach packagin...
Patent number
6,943,434
Issue date
Sep 13, 2005
Fairchild Semiconductor Corporation
Consuelo N. Tangpuz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip in leaded molded package and method of manufacture thereof
Patent number
6,720,642
Issue date
Apr 13, 2004
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20230402350
Publication date
Dec 14, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Erwin Ian Vamenta ALMAGRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
Publication number
20220238421
Publication date
Jul 28, 2022
Semiconductor Components Industries, LLC
Maria Clemens Ypil QUINONES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20220102248
Publication date
Mar 31, 2022
Semiconductor Components Industries, LLC
Erwin Ian Vamenta ALMAGRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
Publication number
20220059443
Publication date
Feb 24, 2022
Semiconductor Components Industries, LLC
Jerome TEYSSEYRE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
Publication number
20210351099
Publication date
Nov 11, 2021
Semiconductor Components Industries, LLC
Maria Cristina ESTACIO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
Publication number
20200219866
Publication date
Jul 9, 2020
Fairchild Semiconductor Corporation
Elsie Agdon CABAHUG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
Publication number
20190393119
Publication date
Dec 26, 2019
Semiconductor Components Industries, LLC
Maria Cristina ESTACIO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
Publication number
20190181083
Publication date
Jun 13, 2019
Fairchild Semiconductor Corporation
Jerome TEYSSEYRE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
Publication number
20180068935
Publication date
Mar 8, 2018
FAIRCHILD SEMICONDUCTOR CORPORATION
Jerome TEYSSEYRE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
Publication number
20160284631
Publication date
Sep 29, 2016
Fairchild Semiconductor Corporation
Elsie Agdon CABAHUG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS MODULE WITH ACTIVE AND PASSIVE COMPONENTS
Publication number
20140070329
Publication date
Mar 13, 2014
Fairchild Semiconductor Corporation
Allan Tungul Flores
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS MODULE WITH ACTIVE DEVICES
Publication number
20140071650
Publication date
Mar 13, 2014
Fairchild Semiconductor Corporation
Allan Tungul Flores
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and Designs for Localized Wafer Thinning
Publication number
20120168947
Publication date
Jul 5, 2012
Suku Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
Publication number
20110244633
Publication date
Oct 6, 2011
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
Publication number
20100164078
Publication date
Jul 1, 2010
Ruben Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER QUAD FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGES WITH ISOLATED HE...
Publication number
20100148328
Publication date
Jun 17, 2010
Fairchild Semiconductor Corporation
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING
Publication number
20090273082
Publication date
Nov 5, 2009
Suku Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH DUAL EXPOSED SURFACES AND METHOD...
Publication number
20090269885
Publication date
Oct 29, 2009
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROBUST LEADED MOLDED PACKAGES AND METHODS FOR FORMING THE SAME
Publication number
20090236714
Publication date
Sep 24, 2009
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP IN LEADED MOLDED PACKAGE AND METHOD OF MANUFACTURE THEREOF
Publication number
20080036056
Publication date
Feb 14, 2008
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALTERNATIVE FLIP CHIP IN LEADED MOLDED PACKAGE DESIGN AND METHOD FO...
Publication number
20070241431
Publication date
Oct 18, 2007
Romel N. Manatad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged semiconductor device with dual exposed surfaces and method...
Publication number
20070161151
Publication date
Jul 12, 2007
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Robust leaded molded packages and methods for forming the same
Publication number
20060231933
Publication date
Oct 19, 2006
Elsie Agdon Cabahug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to manufacture a universal footprint for a package with expo...
Publication number
20060151861
Publication date
Jul 13, 2006
Jonathan A. Noquil
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Flip chip in leaded molded package and method of manufacture thereof
Publication number
20050280126
Publication date
Dec 22, 2005
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
Publication number
20050224940
Publication date
Oct 13, 2005
Consuelo N. Tangpuz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Filp chip in leaded molded package and method of manufacture thereof
Publication number
20050167848
Publication date
Aug 4, 2005
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alternative flip chip in leaded molded package design and method fo...
Publication number
20040157372
Publication date
Aug 12, 2004
Romel N. Manatad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
Publication number
20040130009
Publication date
Jul 8, 2004
Consuelo N. Tangpuz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip in leaded molded package and method of manufacture thereof
Publication number
20040056364
Publication date
Mar 25, 2004
Fairchild Semiconductor Corporation
Rajeev Joshi
H01 - BASIC ELECTRIC ELEMENTS