Ronald EISELE

Person

Surendorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Compact power electronics module with increased cooling surface
- Patent number 12,136,585
- Issue date Nov 5, 2024
- Danfoss Silicon Power GmbH
- Stefan Behrendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module with improved cooling
- Patent number 12,133,366
- Issue date Oct 29, 2024
- Danfoss Silicon Power GmbH
- Stefan Behrendt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module
- Patent number 10,832,995
- Issue date Nov 10, 2020
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool for the lower die of a sintering device
- Patent number 10,818,633
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semi-conductor module with an encapsulating cement mass that covers...
- Patent number 10,685,894
- Issue date Jun 16, 2020
- Heraeus Deutschland GmbH & Co. KG
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising an encapsulating compound that cove...
- Patent number 10,593,608
- Issue date Mar 17, 2020
- Heraeus Deutschland GmbH & Co. KG
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for cohesively connecting a first component of a power semic...
- Patent number 10,438,924
- Issue date Oct 8, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 10,403,566
- Issue date Sep 3, 2019
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,381,283
- Issue date Aug 13, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling trough, cooler and power module assembly
- Patent number 10,306,800
- Issue date May 28, 2019
- Danfoss Silicon Power GmbH
- Franke Wulf-Toke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor contact structure and method for the production...
- Patent number 10,079,219
- Issue date Sep 18, 2018
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,318,421
- Issue date Apr 19, 2016
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a high-temperature and temperature-change resi...
- Patent number 9,287,232
- Issue date Mar 15, 2016
- Danfoss Silicon Power GmbH
- Mathias Kock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with method for manufacturing a sintered...
- Patent number 9,040,338
- Issue date May 26, 2015
- Danfoss Silicon Power GmbH
- Ronald Eisele
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 8,802,564
- Issue date Aug 12, 2014
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rigid power module suited for high-voltage applications
- Patent number 8,546,923
- Issue date Oct 1, 2013
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 8,490,681
- Issue date Jul 23, 2013
- Danfoss Silicon Power GmbH
- Ronald Eisele
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for the low-temperature pressure sintering of electronic uni...
- Patent number 8,118,211
- Issue date Feb 21, 2012
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a rigid power module suited for high-volta...
- Patent number 8,017,446
- Issue date Sep 13, 2011
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for cooling a power semicondu...
- Patent number 7,529,091
- Issue date May 5, 2009
- Danfoss Silicon Power GmbH
- Klaus Kristen Olesen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling unit and flow distributing element for use in such unit
- Patent number 7,339,788
- Issue date Mar 4, 2008
- Danfoss Silicon Power GmbH
- Klaus Kristen Olesen
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPACT POWER ELECTRONICS MODULE WITH INCREASED COOLING SURFACE
- Publication number 20220293489
- Publication date Sep 15, 2022
- DANFOSS SILICON POWER GMBH
- Stefan Behrendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE WITH IMPROVED COOLING
- Publication number 20220295662
- Publication date Sep 15, 2022
- DANFOSS SILICON POWER GMBH
- Stefan Behrendt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...
- Publication number 20210210416
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PROD...
- Publication number 20210210403
- Publication date Jul 8, 2021
- Heraeus Deutschland GmBH & Co., KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...
- Publication number 20210210406
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A HEAT-SPREADING PLATE, HEAT-SPREADING PLATE,...
- Publication number 20210202350
- Publication date Jul 1, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE
- Publication number 20190341341
- Publication date Nov 7, 2019
- DANFOSS SILICON POWER GMBH
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CIRCUIT CARRIER
- Publication number 20180301354
- Publication date Oct 18, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...
- Publication number 20180261518
- Publication date Sep 13, 2018
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS
- Publication number 20180240776
- Publication date Aug 23, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180218957
- Publication date Aug 2, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170365541
- Publication date Dec 21, 2017
- DANFOSS SILICON POWER GMBH
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
- Publication number 20170338193
- Publication date Nov 23, 2017
- DANFOSS SILICON POWER GMBH
- Josef Lutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING TROUGH, COOLER AND POWER MODULE ASSEMBLY
- Publication number 20170332515
- Publication date Nov 16, 2017
- DANFOSS SILICON POWER GMBH
- Franke Wulf-Toke
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...
- Publication number 20170317049
- Publication date Nov 2, 2017
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COHESIVELY CONNECTING A FIRST COMPONENT OF A POWER SEMIC...
- Publication number 20170317051
- Publication date Nov 2, 2017
- DANFOSS SILICON POWER GMBH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20170229424
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE
- Publication number 20170221852
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20170216920
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...
- Publication number 20170133291
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR MODULE WITH AN ENCAPSULATING CEMENT MASS THAT COVERS...
- Publication number 20160260648
- Publication date Sep 8, 2016
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20160225738
- Publication date Aug 4, 2016
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH METHOD FOR MANUFACTURING A SINTERED...
- Publication number 20130228890
- Publication date Sep 5, 2013
- Ronald Eisele
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Ronald EISELE

Person

Patents Grantslast 30 patents

Compact power electronics module with increased cooling surface

Power electronics module with improved cooling

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Sintering tool and method for sintering an electronic subassembly

Power module

Sintering tool and method for sintering an electronic subassembly

Sintering tool for the lower die of a sintering device

Semi-conductor module with an encapsulating cement mass that covers...

Method for manufacturing semiconductor chips

Semiconductor module comprising an encapsulating compound that cove...

Sintering device

Method for cohesively connecting a first component of a power semic...

Power module

Power semiconductor module

Electronic sandwich structure with two parts joined together by mea...

Cooling trough, cooler and power module assembly

Power semiconductor contact structure and method for the production...

Method for creating a connection between metallic moulded bodies an...

Power semiconductor chip with a metallic moulded body for contactin...

Power semiconductor chip with a metallic moulded body for contactin...

Method for producing a high-temperature and temperature-change resi...

Power semiconductor module with method for manufacturing a sintered...

Method of manufacturing a semiconductor component

Rigid power module suited for high-voltage applications

Fluid cooling system

Method for the low-temperature pressure sintering of electronic uni...

Method for manufacturing a rigid power module suited for high-volta...

Power semiconductor module and method for cooling a power semicondu...

Cooling unit and flow distributing element for use in such unit

Patents Applicationslast 30 patents

COMPACT POWER ELECTRONICS MODULE WITH INCREASED COOLING SURFACE

POWER ELECTRONICS MODULE WITH IMPROVED COOLING

METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...

HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PROD...

METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...

METHOD FOR PRODUCING A HEAT-SPREADING PLATE, HEAT-SPREADING PLATE,...

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

POWER MODULE

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

METHOD FOR MANUFACTURING A CIRCUIT CARRIER

SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS

POWER SEMICONDUCTOR MODULE

POWER MODULE

POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE

COOLING TROUGH, COOLER AND POWER MODULE ASSEMBLY

POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...

METHOD FOR COHESIVELY CONNECTING A FIRST COMPONENT OF A POWER SEMIC...

SINTERING DEVICE

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...

SEMI-CONDUCTOR MODULE WITH AN ENCAPSULATING CEMENT MASS THAT COVERS...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

POWER SEMICONDUCTOR MODULE WITH METHOD FOR MANUFACTURING A SINTERED...

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT