Ronald Huemoeller

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 12,183,594
- Issue date Dec 31, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,080,682
- Issue date Sep 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,033,946
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid panel method of manufacturing electronic devices and electro...
- Patent number 11,915,949
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,881,471
- Issue date Jan 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,848,214
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,830,860
- Issue date Nov 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,823,913
- Issue date Nov 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,676,941
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 11,652,038
- Issue date May 16, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid panel method of manufacturing electronic devices and electro...
- Patent number 11,605,552
- Issue date Mar 14, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,574,890
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte. Lte.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 11,545,405
- Issue date Jan 3, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,444,013
- Issue date Sep 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,342,268
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded ball land substrate, semiconductor package, and manufactur...
- Patent number 11,335,643
- Issue date May 17, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Corey Reichman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 11,289,451
- Issue date Mar 29, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,244,923
- Issue date Feb 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,145,638
- Issue date Oct 12, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,094,560
- Issue date Aug 17, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an encapsulated semiconductor device
- Patent number 11,081,370
- Issue date Aug 3, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 11,031,256
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,031,259
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240421127
- Publication date Dec 19, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240355744
- Publication date Oct 24, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...
- Publication number 20240274445
- Publication date Aug 15, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for collective dishing of singulated dies
- Publication number 20240170452
- Publication date May 23, 2024
- Anup PANCHOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240162187
- Publication date May 16, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAY...
- Publication number 20240111107
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Paul MEISSNER
- G02 - OPTICS
Information Patent Application
PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR...
- Publication number 20240111106
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Paul MEISSNER
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20240087914
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240088114
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...
- Publication number 20240021571
- Publication date Jan 18, 2024
- Anup PANCHOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230187410
- Publication date Jun 15, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230154893
- Publication date May 18, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005832
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220285277
- Publication date Sep 8, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220238483
- Publication date Jul 28, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20220223563
- Publication date Jul 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220093576
- Publication date Mar 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20220051909
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220005787
- Publication date Jan 6, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20210358770
- Publication date Nov 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...
- Publication number 20210296139
- Publication date Sep 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20210280542
- Publication date Sep 9, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...
- Publication number 20210265182
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...
- Publication number 20210265192
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20210257346
- Publication date Aug 19, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210233848
- Publication date Jul 29, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS

Ronald Huemoeller

Person

Patents Grantslast 30 patents

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor package with front side and back side redistribution...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device package and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor product with interlocking metal-to-metal bonds and me...

Hybrid panel method of manufacturing electronic devices and electro...

Semiconductor package with routing patch and conductive interconnec...

Semiconductor device with integrated heat distribution and manufact...

Semiconductor device and manufacturing method thereof

Encapsulated semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Method of manufacturing an electronic device and electronic device...

Semiconductor package and fabricating method thereof

Semiconductor package with front side and back side redistribution...

Hybrid panel method of manufacturing electronic devices and electro...

Semiconductor devices and methods of manufacturing semiconductor de...

Packaging for fingerprint sensors and methods of manufacture

Semiconductor device and manufacturing method thereof

Semiconductor device package and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Embedded ball land substrate, semiconductor package, and manufactur...

Semiconductor package with high routing density patch

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Encapsulated semiconductor package

Methods of manufacturing an encapsulated semiconductor device

Semiconductor device with tiered pillar and manufacturing method th...

Method of manufacturing an electronic device and electronic device...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

Method for collective dishing of singulated dies

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAY...

PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...

HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRO...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...