Ronald J. Jensen

Person

Bloomington, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for three dimensional sensors
- Patent number 8,459,112
- Issue date Jun 11, 2013
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package including a thermally and electrically c...
- Patent number 8,362,607
- Issue date Jan 29, 2013
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tiered integrated circuit package
- Patent number 8,354,743
- Issue date Jan 15, 2013
- Honeywell International Inc.
- Ronald James Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die heater
- Patent number 7,965,094
- Issue date Jun 21, 2011
- Honeywell International Inc.
- Richard Spielberger
- G01 - MEASURING TESTING
Information Patent Grant
SOI on package hypersensitive sensor
- Patent number 7,868,362
- Issue date Jan 11, 2011
- Honeywell International Inc.
- Todd Andrew Randazzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for stacking integrated circuits
- Patent number 7,863,720
- Issue date Jan 4, 2011
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for stacking integrated circuits
- Patent number 7,700,409
- Issue date Apr 20, 2010
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with top-side conduction cooling
- Patent number 7,635,916
- Issue date Dec 22, 2009
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical die chip-on-board
- Patent number 7,095,226
- Issue date Aug 22, 2006
- Honeywell International, Inc.
- Hong Wan
- G01 - MEASURING TESTING
Information Patent Grant
Stacked ball grid array
- Patent number 6,657,134
- Issue date Dec 2, 2003
- Honeywell International Inc.
- Richard K. Spielberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to permit high temperature assembly processes for magnetical...
- Patent number 6,027,948
- Issue date Feb 22, 2000
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stacking and capacitor mounting arrangement including spacers
- Patent number 6,005,778
- Issue date Dec 21, 1999
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation enhanced chip encapsulant
- Patent number 5,998,867
- Issue date Dec 7, 1999
- Honeywell Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die test and burn-in device
- Patent number 5,453,701
- Issue date Sep 26, 1995
- Honeywell Inc.
- Ronald J. Jensen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY CONNECTED INTEGRATED CIRCUITS
- Publication number 20150145136
- Publication date May 28, 2015
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE DIMENSIONAL SENSORS
- Publication number 20120313193
- Publication date Dec 13, 2012
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Application
MULTI-TIERED INTEGRATED CIRCUIT PACKAGE
- Publication number 20110180919
- Publication date Jul 28, 2011
- Honeywell International Inc.
- Ronald James Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including a thermally and electrically c...
- Publication number 20100308453
- Publication date Dec 9, 2010
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Die Heater
- Publication number 20100007367
- Publication date Jan 14, 2010
- Honeywell International Inc.
- Richard Spielberger
- G01 - MEASURING TESTING
Information Patent Application
SOI on Package Hypersensitive Sensor
- Publication number 20090096113
- Publication date Apr 16, 2009
- Honeywell International Inc.
- Todd Andrew Randazzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package With Top-Side Conduction Cooling
- Publication number 20080272482
- Publication date Nov 6, 2008
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Stacking Integrated Circuits
- Publication number 20070222055
- Publication date Sep 27, 2007
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for stacking integrated circuits
- Publication number 20050258528
- Publication date Nov 24, 2005
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical die chip-on-board
- Publication number 20050122100
- Publication date Jun 9, 2005
- Honeywell International Inc.
- Hong Wan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ball grid array package
- Publication number 20030102156
- Publication date Jun 5, 2003
- Richard K. Spielberger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Ronald J. Jensen

Person

Patents Grantslast 30 patents

Systems and methods for three dimensional sensors

Integrated circuit package including a thermally and electrically c...

Multi-tiered integrated circuit package

Packaged die heater

SOI on package hypersensitive sensor

Method and system for stacking integrated circuits

Method and system for stacking integrated circuits

Integrated circuit package with top-side conduction cooling

Vertical die chip-on-board

Stacked ball grid array

Method to permit high temperature assembly processes for magnetical...

Chip stacking and capacitor mounting arrangement including spacers

Radiation enhanced chip encapsulant

Bare die test and burn-in device

Patents Applicationslast 30 patents

VERTICALLY CONNECTED INTEGRATED CIRCUITS

SYSTEMS AND METHODS FOR THREE DIMENSIONAL SENSORS

MULTI-TIERED INTEGRATED CIRCUIT PACKAGE

Integrated circuit package including a thermally and electrically c...

Packaged Die Heater

SOI on Package Hypersensitive Sensor

Integrated Circuit Package With Top-Side Conduction Cooling

Method and System for Stacking Integrated Circuits

Method and system for stacking integrated circuits

Vertical die chip-on-board

Ball grid array package